Full-Time
Sr Staff Test Engineer
Ate
Posted on 8/20/2026
Renesas Electronics
10,001+ employees
Automotive-focused MCUs, SoCs, analog devices
No salary listed
Bengaluru, Karnataka, India
In Person
 QA & Testing (2) |
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- At least 10 years of experience developing hardware and software at wafer sort and final test for PMIC, temperature sensor, and I3C products.
- At least 10 years of experience with mFLEX, Advantest 93K, SPEA, Cohu DiamondX, Teradyne Eagle, or equivalent analog automatic test equipment.
- Experience using I2C, I3C, and SPI protocols and implementing trims for power integrated-circuit products.
- Experience developing characterization and production test programs and hardware.
- Strong technical knowledge of electronic devices, circuits, and analog test techniques.
- Data analysis skills using Spotfire, dataPower, or an equivalent tool based on STDF.
- Experience with laboratory equipment such as oscilloscopes, power supplies, sourcemeters, and loads.
- Experience with product-engineering activities including yield improvement and test-time reduction.
- Strong understanding of the integrated-circuit product-development process from concept through volume production.
- Work with design and systems teams to understand specifications.
- Generate test plans, create test and characterization programs, and design automatic test equipment hardware interface boards.
- Debug and characterize silicon on automatic test equipment and correlate results with bench data.
- Analyze silicon results and support failure-analysis tasks.
- Perform statistical analysis of yield fallout, debug and resolve yield issues, and optimize test time.
- Work with the production team to release products to volume production.
- Define and implement test strategies for new power and analog products.
- Develop and use automatic test equipment test hardware and software.
- Perform silicon qualification and characterization, including qualification hardware development.
- Conduct comprehensive device debugging, design validation, and failure analysis.
- Drive robust, cost-effective test solutions while remaining accountable for product quality.
- Test Lead experience.
- Experience with test-program and hardware offload to outsourced semiconductor assembly and test providers.
- Proficiency in C++, Python, and C# programming or scripting.
- Experience with LabVIEW and TestStand.
- Experience with revision-control tools including Subversion and Git.
Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.
Company Size
10,001+
Company Stage
IPO
Headquarters
Tokyo, Japan
Founded
2002
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Simplify's Take
What believers are saying
- TIER IV chose R-Car Gen 5 on August 20, 2026 for autonomous driving.
- Gen 3 MRDIMM samples shipped in 2026, targeting 16,000 MT/s AI datacenter demand.
- Irida Labs and Pictorus acquisitions in 2026 deepen Renesas' edge-AI software stack.
What critics are saying
- Navitas sued Renesas on August 10, 2026, threatening GaN product margins and shipments.
- Takasaki's 6-inch line closes within two to three years, disrupting analog supply continuity.
- SiTime's timing-business acquisition removes a cash-generating segment, shrinking Renesas' diversification and leverage.
What makes Renesas Electronics unique
- Renesas leads automotive MCUs with R-Car Gen 5 and RH850 platform depth.
- Renesas 365 unifies embedded hardware, cloud modeling, and lifecycle software after Pictorus.
- Winning Combinations bundle semiconductors, software, and reference designs for faster automaker integration.
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Benefits
Health Insurance
Life Insurance
Mental Health Support
Professional Development Budget
Meal Benefits
Growth & Insights and Company News
6 month growth
↓ -22%1 year growth
↓ -30%2 year growth
↓ -30%TIER IV is collaborating with Renesas Electronics to build an open AI-native computing platform for software-defined vehicles. The partnership combines TIER IV's Autoware autonomous driving software and reference AI models with Renesas' R-Car Gen 5 automotive system-on-chips. The collaboration aims to deliver scalable solutions spanning Level 2+ advanced driver assistance through Level 4 autonomous driving. TIER IV will port and optimise Autoware on R-Car Gen 5 SoCs and deploy its end-to-end autonomous driving AI models on the platform. The companies will jointly promote this integrated hardware and software platform to automakers and Tier 1 suppliers worldwide. TIER IV plans to demonstrate Autoware and its reference AI models running on Renesas' R-Car X5H at Automotive World 2026 in September at Makuhari Messe near Tokyo.
SiTime reported triple-digit year-over-year revenue growth, driven largely by AI demand and the expanding data centre market, according to Chairman and CEO Rajesh Vashist. The company's timing synchronisation technology is critical for data centre components including TPUs, GPUs, switches, accelerator cards, optical modules, and cables. Vashist explained that the technology ensures high performance and cost efficiency across these systems. He discussed the company's growth trajectory and market position during an interview on Bloomberg's "The Close" programme.
Renesas Electronics has nearly returned to its pre-earthquake stock level following a magnitude 7.1 quake that struck its Kumamoto facility on 28 July. The Japanese chipmaker halted production at the Kawashiri plant after the tremor caused wall cracks and water supply disruption. The company scheduled a phased restart from 5 August, targeting full wafer-input capacity within approximately three weeks. This marks a faster recovery than the 2016 earthquake at the same plant, which affected 35% of wafers and cost an estimated ¥14 billion in sales. Renesas shares fell initially but jumped 13.45% on 3 August after strong second-quarter results showed non-GAAP revenue rising 24.9% year-on-year. The stock closed at ¥3,825 on 10 August, just 1.1% below pre-quake levels.
Renesas Electronics will phase out production at its Takasaki Factory in Japan within two to three years due to challenges with its 6-inch wafer line. The semiconductor manufacturer cited aging equipment, deteriorating utility facilities, and discontinued support for production materials as key factors behind the decision. The company plans to maintain and strengthen research and development functions at the site, focusing on analogue ICs and power semiconductors for data centres and automotive applications. Renesas will build inventory to ensure stable supply for customers during the transition. The firm committed to supporting affected employees through reassignment, career support, and other employment opportunities. Specific timing and details of the closure have not been finalised.
Renesas Electronics announced its third-generation DDR5 MRDIMM chipset solutions, delivering speeds up to 16,000 mega transfers per second for AI data centres and cloud infrastructure. The Gen 3 solutions provide 25% higher memory bandwidth than the previous generation whilst maintaining compatibility with existing DDR5 infrastructure. The chipset includes Multiplexed Registering Clock Driver and Multiplexed Data Buffer devices, designed to address growing memory bandwidth demands from AI workloads. Renesas offers a complete platform spanning MRCD, MDB, power management ICs, SPD hubs, and temperature sensors. The Gen 3 MRCD and MDB are currently sampling to select customers, including major DRAM suppliers. Production availability is expected in the second half of 2027. Renesas will showcase the solutions at FMS 2026 in Santa Clara, California, from 4-6 August.