Design Engineer 1

Germany to establish 'first-of-its-kind' semiconductor facilities. The European Commission has approved €659 million ($1.08 billion) in German state aid to support the establishment of four 'first-of-a-kind' facilities in the semiconductor value chain. The measures will contribute to strengthening the European Union's position and autonomy in the semiconductor value chain by supporting the construction of first-of-a-kind facilities. Germany will receive a €353 million facility for the SME Element 3-5 for a facility in Baesweiler, North Rhine-Westphalia for the manufacturing of silicon carbide epi-wafers, and €214 million for Vishay Siliconix Itzehoe for a facility in Itzehoe, Schleswig-Holstein for the manufacturing of nickel and phosphorous channel silicon power. The commission will also give the nation €74.4 million for KLA-Tencor MIE for a facility in Weilburg, Hesse for the manufacturing of advanced optical overlay and film metrology equipment, as well as €17.9 million for KETEK for a facility in Munich, Bavaria for the manufacturing of two highly specialised chips. The chips are silicon drift detectors and graphene radiation entry windows. In November 2024, Germany published a call for proposals for innovative investment projects in the European semiconductor value chain. Two years later, in June, the commission adopted a new proposal for the Chips Act 2.0, which introduces new measures to further boost the chips industry, reduce strategic dependencies, and support advanced chip production in the EU. The Chips Act 2.0 builds on the progress made by the original Chips Act and aims to reinforce current European strengths and build capacity in cutting-edge semiconductor technologies.

€659m German State aid approved for four new semiconductor facilities. 14th July 2026 The European Commission has approved €659 million in German State aid to support the establishment of four first-of-a-kind facilities in the semiconductor value chain. The measures will contribute to strengthening the EU's position and autonomy in the semiconductor value chain by supporting the construction of first-of-a-kind facilities, in line with the objectives set out in the Commission's Communication 'A Chips Act for Europe' and the Commission's 2024-2029 Political Guidelines. Germany will provide the following direct grants for the construction of semiconductor facilities: * €353 million for the SME Element 3-5 GmbH for a facility in Baesweiler, North Rhine-Westphalia for the manufacturing of silicon carbide ('SiC') epi-wafers; * €214 million for Vishay Siliconix Itzehoe GmbH ('Vishay') for a facility in Itzehoe, Schleswig-Holstein, for the manufacturing of N- and P-channel Silicon Power MOSFETs; * €74.4 million for KLA-Tencor MIE GmbH ('KLA') for a facility in Weilburg, Hesse, for the manufacturing of advanced optical overlay and film metrology equipment; * €17.9 million for KETEK GmbH for a facility in Munich, Bavaria, for the manufacturing of two highly-specialised chips: Silicon Drift Detectors ('SDDs') and Graphene Radiation Entry Windows ('GREW'). All four measures are jointly financed by the federal budget and the respective Länder authorities. Aid to Element 3-5. Element 3-5's SiCnature will establish a first-of-a-kind factory for SiC epi-wafers. These are silicon carbide wafers with a very thin, high-quality layer added on top to improve their performance compared to standard SiC-wafers. The new type of wafers is expected to be used in end applications across various sectors including automotive, industrial, telecommunications and energy. This project involves major improvements, notably in the manufacturing process. It will improve energy efficiency, yield and manufacturing efficiency compared to conventional hot-wall chemical vapour deposition. Aid to Vishay. Vishay will establish a new semiconductor manufacturing capacity at its existing Itzehoe site, where it will produce the next generation of Power MOSFETs. These are metal-oxide-semiconductor field-effect transistors designed to switch or control high voltages and currents efficiently in power electronic circuits. They are mainly used in the automotive sector, but also have industrial and commercial uses. Aid to KLA. KLA will establish a new manufacturing capacity at its existing Weilburg site for advanced optical overlay and film metrology equipment (including key sub-assemblies). This equipment is used for process and quality control in the mass production of semiconductor devices, enabling front-end and back-end manufacturers to achieve higher yield and productivity. The tools KLA will produce in Weilburg enable the creation of leading-edge and near-leading edge semiconductor manufacturing processes. Aid to KETEK. KETEK will construct two production lines for highly specialised chips: SDD chips and GREW chips, which are key components of the SDD detectors KETEK already builds. SDD detectors are used for industrial sorting and recycling systems. The project will enable the assembly of the next generation of detectors by integrating two production lines into one cleanroom, thereby allowing greater integration and efficiency than current solutions. Under the measures, all beneficiaries agreed to: * ensure broader impact of the projects with positive effects on the EU semiconductor value chain; * strengthen collaborations with universities and research institutions; * fulfil orders on a priority basis in case of a supply shortage; * develop specialised training to increase the pool of qualified and skilled workers; * share with Germany potential project-related profits, beyond current expectations. The Commission's assessment. The Commission assessed the German measure under EU State aid rules and based on the principles set out in the European Chips Act. The Commission found that: * the measures facilitate the development of economic activities by creating manufacturing capacity in Europe; * the facilities are first-of-a-kind in Europe; * the aid has an 'incentive effect', as without public support, Element 3-5, Vishay and KLA would not carry out the investments in the EU, and KETEK would not carry out the investment at all; * the measures have a limited impact on competition and trade within the EU. They are necessary and appropriate to ensure the resilience of Europe's semiconductor supply chain. In addition, the aid is proportionate and limited to the minimum necessary based on proven funding gaps. Finally, Element 3- 5, Vishay, KLA and KETEK have agreed to share with Germany potential project-related profits beyond current expectations; * the measures have wider positive effects for the European semiconductor ecosystem and contribute to strengthening Europe's security of supply. The beneficiaries will collaborate with start-ups, SMEs and research institutions. Element 3-5, Vishay, KLA and KETEK are also applying for their facilities to be recognised as a so-called Integrated Production Facility under the EU Chips Act Regulation and therefore commit to comply with all obligations linked to this status. On this basis, the Commission approved the German measures under EU State aid rules. Teresa Ribera, Executive Vice-President for Clean, Just and Competitive Transition at the EU Commission commented: "Today's approval of Germany's support for four new projects in the semiconductor value chain shows Europe is turning the ambitions of the EU Chips Act into action. By backing innovations in semiconductors, we are strengthening our technological sovereignty and Europe's competitiveness."

Automotive optocoupler saves your PCB space. July 10, 2026 Need to save board space? This optocoupler supports data transfer and signal isolation for vehicle and industrial systems. Vishay Intertechnology has launched the VOMHA43A, an automotive-grade 1 MBd high-speed optocoupler that combines a 3.6 mm-wide SOP-5 package with support for isolation voltages (VIORM) of up to 707 Vpeak. The device also offers a comparative tracking index (CTI) of 400 and a minimum guaranteed common mode transient immunity (CMTI) of 40 kV/μs, while reducing PCB space compared to conventional SOP-5 packages. The AEC-Q102 qualified optocoupler is intended for isolated data communication, fast signal switching, ground signal isolation, and logic voltage level shifting in automotive, industrial, home and building control, and telecom equipment. In electric (EV), hybrid electric (HEV), and low-speed electric (LSEV) vehicles, it can be used for communication bus isolation across CAN, LIN, I[2]C, and SPI interfaces, as well as in isolated drive circuits such as intelligent power module (IPM) drivers. The new SOP-5 package is 3.6 mm wide, compared to the 4.4 mm width of earlier versions, helping reduce PCB area while supporting stackable designs. According to the company, the optocoupler's minimum guaranteed CMTI of 40 kV/μs is more than twice that of the closest competing device, improving immunity to electrical transients, RF interference, and EMI. Its maximum repetitive peak isolation voltage of 707 Vpeak also exceeds the 567 Vpeak offered by comparable devices, making it suitable for 400 V battery systems. The VOMHA43A integrates a GaAlAs infrared-emitting diode, an optically coupled photodetector, and a high-speed transistor. The photodetector is junction-isolated from the transistor to reduce Miller capacitance effects. An open-collector output allows designers to adapt load conditions for different logic systems, while a Faraday shield on the detector chip helps suppress high input-to-output common-mode transient voltages. The optocoupler is RoHS compliant, halogen-free, and operates from -40°C to +125°C. It is also pin-to-pin compatible with leading competing devices, allowing it to be used as a direct replacement without electrical or mechanical redesign.