Summer 2027

RF Technology Development Automation Engineer Intern

Summer 2027

Posted on 9/3/2026

GlobalFoundries

GlobalFoundries

10,001+ employees

Semiconductor foundry delivering specialized chips

Compensation Overview

$20 - $40/hr

Company Does Not Provide H1B Sponsorship

Malta, NY, USA

In Person

Bachelor's, Master's, PhD

Category
Software Engineering
Required Skills
Bash
CAD
Python
Software Testing
Data Visualization
Git
Version Control
Perl
Pandas
DevOps
Linux/Unix

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Requirements
  • The candidate must be at least a sophomore at the time of application and actively pursuing a Bachelor's, Master's, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related field through an accredited degree program during the internship.
  • The candidate must have an overall GPA of at least 3.0 and be in good academic standing.
  • The candidate must be fluent in written and verbal English.
  • The candidate must be able to work at least 40 hours per week during the internship.
  • The candidate must be comfortable writing Python and reading and debugging code written by others.
  • The candidate must be familiar with Linux, command-line environments, and version control using Git.
  • The candidate must demonstrate interest in programming through personal projects, open-source contributions, competitions, research, coursework, or independently developed automation.
  • The candidate must be able to break down a loosely defined manual process into clear steps and implement those steps in code.
Responsibilities
  • Write and maintain Python, Shell, and Tcl scripts that automate design manual generation, ground-rule validation builds, process design kit builds and releases, and regression checks.
  • Build internal tools and dashboards that consolidate spreadsheets and logs into a current view of project status.
  • Automate data extraction and reporting from test-site, design-manual, and verification sources to reduce manual data entry and improve consistency.
  • Develop and extend regression test suites so kit and deck changes are validated automatically before release.
  • Improve version-control and continuous-integration practices through repeatable builds, code review, and reusable scripts.
  • Translate complex manual engineering workflows into documented automation that can be maintained and reused by the team.
  • Own assigned deliverables, collaborate with engineering stakeholders, and present project results to the broader technology development organization at the end of the internship.
  • Perform activities safely and responsibly and support Environmental, Health, Safety, and Security requirements and programs.
Desired Qualifications
  • Prior related internship or co-op experience.
  • Prior leadership experience in the workplace, school projects, competitions, or similar settings.
  • Interest in leveraging artificial intelligence tools and emerging technologies to enhance productivity, streamline workflows, and support decision-making.
  • Project management skills, including the ability to innovate and execute solutions that matter and navigate ambiguity.
  • Strong written and verbal communication skills.
  • Strong planning and organizational skills.
  • Exposure to semiconductor device physics, very-large-scale integration design, layout, or computer-aided design tool flows.
  • Scripting experience with Tcl, SKILL, Perl, or Shell in addition to Python.
  • Experience with data-handling libraries such as pandas or with plotting and dashboard tools.
  • Exposure to continuous integration, test automation, or build systems.
  • Curiosity about semiconductor manufacturing and technology development; prior industry experience is not required.

GlobalFoundries is a semiconductor foundry that manufactures chips for a broad range of customers, focusing on feature-rich, reliable technologies for cars, IoT, 5G, and other high-growth markets. It operates by fabricating silicon wafers for customer designs, offering mature, specialized processes rather than chasing the most advanced nodes. This makes it different from peers that prize the latest process nodes; GlobalFoundries emphasizes diversification across a global manufacturing footprint (U.S., Europe, Singapore) and stable supply for essential applications. Its goal is to be a leading supplier of high-volume, specialty manufacturing that enables reliable chips for everyday devices and growing tech markets.

Company Size

10,001+

Company Stage

IPO

Headquarters

Town of Malta, New York

Founded

2009

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Simplify Jobs

Simplify's Take

What believers are saying

  • Q2 2026 revenue reached $1.786 billion, and gross margin expanded to 29.9%.
  • Communications infrastructure and data center revenue surged 62% year over year in Q2 2026.
  • The Commerce Department approved $300 million in CHIPS funding for AI infrastructure R&D.

What critics are saying

  • Smart mobile devices were 36% of Q2 2026 revenue and should decline low-teens.
  • Memory pricing and handset shortages already hit the largest end market in 2026.
  • If silicon photonics execution slips in 2027, GF loses its main growth engine.

What makes GlobalFoundries unique

  • GF's 2026 silicon photonics and SiGe focus beats commodity foundries on specialty mix.
  • Dresden's EU-only secure flow and Vermont GaN production target trusted-supply customers.
  • FDX and 9SW platforms serve automotive, IoT, and RF front ends better than leading-edge logic.

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Benefits

Professional Development Budget

Growth & Insights and Company News

Headcount

6 month growth

-2%

1 year growth

-1%

2 year growth

-1%
Associated Press
Sep 2nd, 2026
GlobalFoundries and RAAAM tape out GCRAM chip, achieving 40% area shrink and 60% power reduction vs SRAM

GlobalFoundries and RAAAM Memory Technologies have announced a collaboration to develop Gain-Cell RAM (GCRAM) technology on GlobalFoundries' FDX platform. The partnership has achieved a significant milestone with the successful tape-out of a GCRAM test vehicle. The technology addresses growing on-chip memory demands for edge AI, automotive, and IoT devices. Using RAAAM's patented GCRAM, the companies achieved a 40% memory area reduction and up to 60% power savings compared to SRAM. The firms have jointly designed and taped out a GCRAM test chip. They plan to provide GCRAM design access to lead customers in early 2027. NXP Semiconductors is evaluating the solution. Victor Wang, vice president of front end innovation at NXP, noted the technology's potential for increasing on-chip memory capacities and improving system-level efficiency.

PR Newswire
Sep 2nd, 2026
QuickLogic launches enhanced eFPGA Hard IP for GlobalFoundries 12LP with 250K+ LUT scalability

QuickLogic has released an enhanced embedded FPGA Hard IP for GlobalFoundries' 12LP process. The new offering includes a DSP Multiply-and-Accumulate unit with enhanced preadder, cascade connections, and SIMD functionality for applications such as phased array radar, electronic warfare, and satellite communications. The eFPGA fabric can now scale beyond 250,000 LUTs for designs requiring larger embedded programmable logic. An optional Configuration Bit Health Monitor detects and corrects errors induced by Single Event Upsets whilst the design is active. The technology enables programmable logic to be embedded directly within SoCs, allowing hardware functions and interfaces to be updated post-manufacturing. QuickLogic showcased the enhanced IP at the GlobalFoundries Technology Summit North America in Santa Clara, California, on 2 September 2026.

Associated Press
Sep 1st, 2026
Navitas ships Gen 5 GaNFast semiconductors from US factory in GlobalFoundries partnership for AI infrastructure

Navitas Semiconductor has begun shipping its fifth-generation GaNFast gallium nitride power semiconductors manufactured in the United States through a partnership with GlobalFoundries. The first shipments from GlobalFoundries' Burlington, Vermont facility are scheduled for September, with strategic customer samples expected before year-end. The collaboration, announced in November 2025, combines Navitas' proprietary GaN technology with GlobalFoundries' 200mm manufacturing capabilities. The partnership aims to strengthen the domestic supply chain for AI infrastructure and critical national security applications. The initial product family includes 650V GaN FETs with various resistance specifications. Navitas has pioneered GaN power semiconductor innovation since 2014 and holds more than 300 issued and pending patents across GaN and silicon carbide technologies. The partnership marks a significant milestone in establishing trusted US-based production of advanced power semiconductors for AI infrastructure, high-performance computing, and industrial applications.

Crypto Briefing
Aug 27th, 2026
GlobalFoundries secures $1.5B credit facility led by JPMorgan, maturing in 2031

GlobalFoundries has secured a $1.5 billion credit facility led by JPMorgan, maturing in 2031. The semiconductor manufacturer recently prepaid approximately $664 million in outstanding term loans in early 2025. The company maintains a strong financial position with roughly $3.3 billion in cash and marketable securities against total debt of approximately $1.1 billion. Its most recent quarterly revenue exceeded $1.7 billion. The new facility expands GlobalFoundries' borrowing capacity from a previous $1 billion revolving credit arrangement. JPMorgan, which already maintains relationships with the company through equity research and structured products, now takes on a lead lending role. GlobalFoundries produces specialised semiconductors for automotive, IoT, and communications infrastructure sectors. The expanded credit line provides additional financial flexibility amid industry-wide buildout plans and shifting trade dynamics.

Yahoo Finance
Aug 11th, 2026
GlobalFoundries stock swings as tiny 16% segment drives 62% growth

GLOBALFOUNDRIES shares fell 7.2% on Monday to $50.05, despite beating June-quarter revenue estimates and raising its outlook for its fastest-growing segment. The semiconductor foundry's communications infrastructure and data centre market grew 62% year-over-year, driven by demand for silicon photonics and silicon germanium chips used in optical networking equipment. However, this high-growth segment represents only 16% of total revenue, approximately $290 million of the $1.786 billion reported for the quarter. Meanwhile, the company's largest segment, smart mobile devices at 36% of revenue, is expected to decline by a low-teens percentage in 2026 due to memory pricing pressures. Overall company revenue grew just 6% year-over-year. The foundry said it is oversubscribed on silicon germanium capacity through 2027 and is expanding within existing facilities. The stock has shown significant volatility, moving in different directions across four trading sessions following the earnings report.