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Qualcomm Mechanical Engineering Internships - (Summer 2022)
Posted on 12/2/2021
San Jose, CA, USA
Experience Level
Desired Skills
  • Experience with Finite Element Analysis (FEA) and commercial tools: ANSYS preferred. Comsol and Abaqus experience heavily valued
  • Familiar with Cadence Sip, AutoCAD and Solidworks
  • Coursework in Solid Mechanics, Mechanics of Materials and Finite Element Analysis
  • Solid knowledge in mechanics, thermal and material science
  • Knowledge of IC packaging structures, chip-package and package-board interaction
  • Familiar with electronic packaging process and typical failure modes
  • Solid knowledge in electromagnetic field theory, analog and digital circuits
  • Coursework in Electromagnetism, Finite Element Analysis and signal and power integrity
  • Experience with Finite Element Analysis (FEA) and commercial tools: ANSYS EM, Cadence Sigrity etc
Desired Qualifications
  • Familiarity with oscilloscope, vector network analyzer or spectrum analyzer is a plus
  • In study towards a Bachelor master student or PHD in electrical engineering, mechanical engineering, material science or related fields
  • Must be available for 3 months during Summer 2022 (May-September) with a graduation date of December 2022 or later

10,001+ employees

Digital wireless telecommunications products and services.
Company Overview
Qualcomm's mission is to lay the foundation for wireless growth. The company provides a host of telecommunication tools and services.
  • Premium-free health coverage
  • Onsite health & fitness centers
  • Retirement programs
  • Disability & life insurance programs
  • Tuition reimbursement
  • Product discounts
  • Flexible time off
  • Parental leave
Company Values
  • Purposeful Innovation
  • Passionate Execution
  • Collaborative Community
  • Unquestioned Integrity