Full-Time

Head of Test Development Engineering

Updated on 9/3/2026

Ethernovia

Ethernovia

51-200 employees

Automotive Ethernet system for autonomous safety

Compensation Overview

$220k - $280k/yr

+ Pre-IPO ISO options

San Jose, CA, USA

Hybrid

Hybrid role based in San Jose, California.

Bachelor's, Master's

Category
Engineering Management (1)
Required Skills
Software Testing
Computer Networking
Robotics

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Requirements
  • A Bachelor's or Master's degree in Electrical Engineering or a related technical field is required.
  • At least 12 years of experience in fabless semiconductor operations, specifically with complex, high-performance systems-on-chip or networking integrated circuits, is required.
  • Expertise with the ATE 93K platform, Smartest, test method libraries, and test hardware design with robust signal integrity and power integrity for wafer and final test is required.
  • Expertise with iJTAG, Scan (SSN), MBIST, sensor, SerDes, LSIO/HSIO testing, security fusing, and test automation for multi-site x8 and x16 parallel testing is required.
  • Expertise in SLT testing using bare-metal, functional DVFS, and benchmark testing, as well as multi-site handler automation frameworks and test-log standards, is required.
  • Experience characterizing analog parameters of high-speed communication chips on ATE and system-level test is required.
  • Experience defining DFT, DFM, and DFD requirements for Ethernet PHY and switch products, including scan and memory dump for debug, is required.
  • Experience navigating the automotive electronics ecosystem, including IATF 16949, ISO 26262, safe launch, and PPAP, is required.
  • Understanding of high-bandwidth datapath products such as Ethernet, switching, or high-speed SerDes is required.
  • Expert-level experience with ATE and SLT test hardware, test-program development, high-speed I/O analog characterization, and test automation is required.
  • Understanding of the product life cycle from concept to end of life, including leading pre-silicon reviews and readiness for post-silicon bring-up, is required.
Responsibilities
  • Own end-to-end test architecture, infrastructure, hardware, and methodology from pre-silicon through post-silicon, working with architecture, design, design verification, DFT, security, software/firmware, system, product, and quality and reliability teams.
  • Own early engagement with architecture/DFT, system/software, and security teams on ATE and SLT test architecture and DFM/DFD to ensure debug capability and testability to specification.
  • Deliver manufacturing test programs from NPI bring-up through high-volume manufacturing for high-speed Ethernet switch and PHY products while maintaining signal-integrity and power/performance standards at scale.
  • Own test-board design and ensure signal integrity, power integrity, and test implementation across wafer test, final test, and system-level test, while ensuring robustness and meeting test-time requirements.
  • Manage test labs, OSAT test houses, and vendor engagements for testers, probers, probe cards, load boards, system boards, sockets, handlers, change kits, and TCUs.
Desired Qualifications
  • Experience with simulation, pattern generation, and pattern conversion.
  • Experience delivering high-speed SerDes products to Tier-1 automotive original equipment manufacturers.
  • Experience negotiating with and managing hardware vendors and OSATs.

Ethernovia builds a complete Ethernet network system for cars. It provides high-bandwidth, unified Ethernet hardware and software that fits into vehicles and follows industry safety standards, so car makers can meet the needs of future autonomous technology. The system is designed to be flexible and scalable, adapting as network requirements evolve, and it includes both the physical components and the software that manage and ensure safe operation. Ethernovia differentiates itself by offering an end-to-end, standards-based solution rather than just parts: a single architecture that combines hardware, software, and safety features, plus long-term services and maintenance for automotive customers. The company’s goal is to enable safe, reliable, and scalable in-vehicle networks that support autonomous driving and other advanced automotive functions.

Company Size

51-200

Company Stage

Series B

Total Funding

$154M

Headquarters

San Jose, California

Founded

2018

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Simplify Jobs

Simplify's Take

What believers are saying

  • Revelio counted 102 employees in March 2026, up 82.1% since 2023.
  • Ethernovia’s March 2026 HSB platform is available for evaluation now.
  • Porsche SE and Qualcomm Ventures stayed in, signaling follow-on conviction through 2026.

What critics are saying

  • Broadcom, Marvell, and NXP can undercut Ethernovia before 2027 OEM design wins.
  • Automotive qualification cycles stretch years; Continental’s 2023 partnership still lacks visible series production.
  • If funding dries after 2026, Ethernovia’s packet-processor roadmap stalls before revenue scale.

What makes Ethernovia unique

  • Ethernovia’s January 2026 Series B topped $90 million, backing commercialization.
  • March 2026 HSB board integrates NVIDIA Holoscan and Omniverse into one sensor pipeline.
  • Its 7nm automotive PHYs span 10G, 5G, 2.5G, and 1G in one device.

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Benefits

Flexible Work Hours

Stock Options

Growth & Insights and Company News

Headcount

6 month growth

0%

1 year growth

0%

2 year growth

0%
Telematics Wire
Mar 18th, 2026
Ethernovia unveils high-speed networking board for NVIDIA Holoscan AI platforms.

Ethernovia unveils high-speed networking board for NVIDIA Holoscan AI platforms. 2 minutes read 18th March 2026 Ethernovia has introduced a new high-performance networking board designed to work seamlessly with NVIDIA's Holoscan platforms, marking a significant advancement in real-time AI data processing. The newly launched HSB-enabled (Holoscan Sensor Bridge) platform is built to handle massive volumes of sensor data with ultra-low latency, enabling faster and more efficient edge AI operations. The solution leverages Ethernet-based connectivity to transport high-bandwidth data from multiple sensors directly into GPU memory, allowing real-time perception, decision-making, and control in complex systems. The platform was showcased at NVIDIA's GTC 2026 conference, where Ethernovia demonstrated how its technology can simplify system architecture while improving performance. By using a unified Ethernet backbone, the board ensures synchronized data flow from sensors such as cameras, radars, and lidar critical for applications like autonomous vehicles, robotics, industrial automation, and medical imaging. A key highlight of the new system is its ability to connect real-world sensor data with digital simulation environments. The platform integrates with NVIDIA Omniverse libraries, enabling developers to create digital twins and run real-time simulations using live or recorded data. This allows faster validation of AI models, improved testing of perception systems, and shorter development cycles. Additionally, the solution supports a scalable, software-defined architecture that reduces complexity and enhances flexibility for developers building next-generation "physical AI" systems. By enabling seamless data streaming, simulation, and AI model refinement within a single pipeline, Ethernovia aims to accelerate the deployment of intelligent machines across industries. Overall, this development reflects a growing industry focus on high-speed data infrastructure as the backbone of autonomous and AI-driven systems. As applications demand faster processing and real-time responsiveness, solutions like Ethernovia's HSB networking platform are expected to play a crucial role in advancing edge AI and next-generation mobility technologies. The new networking solution from Ethernovia for NVIDIA Holoscan platforms brings several important benefits, especially for AI-driven and autonomous systems: Key benefits (short and clear): * Faster data processing: Handles huge sensor data (camera, radar, lidar) in real time with very low delay * Better system performance: Direct data transfer to GPU improves AI decision-making speed * Simplified architecture: Uses a single Ethernet-based system instead of complex wiring * Improved accuracy: Synchronized sensor data leads to better perception in autonomous systems * Supports real-time simulation: Enables digital twins and faster AI model testing * Scalable solution: Easy to expand for different use cases like vehicles, robotics, and healthcare Post Views: 108

Tech in Asia
Jan 21st, 2026
Porsche, Qualcomm join $90m series B for chip startup Ethernovia

Porsche, Qualcomm join $90m series B for chip startup ethernovia. Ethernovia, a Silicon Valley-based semiconductor startup, has closed a series B funding round exceeding US$90 million, led by Maverick Silicon and including Socratic Partners, Conduit Capital, and CDIB-TEN Capital. Existing investors such as Porsche SE, Qualcomm Ventures, and Fall Line Capital also participated. The company develops Ethernet-based packet processors designed to support real-time sensor, AI, and control data for autonomous vehicles, robots, and intelligent machines. The new funding will be used to accelerate product development, expand software capabilities, and support customer projects across automotive, robotics, and industrial markets. How would you feel if you could no longer use Tech in Asia?

FinSMEs
Jan 20th, 2026
Ethernovia Raises Over $90M in Series B Funding

Ethernovia raises over $90M in Series B funding. Ethernovia, a San Jose, CA-based semiconductor startup building Ethernet-based, packet processor-centric networking solutions, raised over $90M in Series B funding. The round was led by Maverick Silicon with participation from Socratic Partners, Conduit Capital, CDIB-TEN Capital, Porsche SE, Qualcomm Ventures and Fall Line Capital. The company intends to use the funds to accelerate development and production of its new packet processor family, expand its software and systems capabilities, and support customer engagements across automotive, robotics and industrial markets. Led by CEO Ramin Shirani, Ethernovia develops automotive and edge packet processors designed to serve new physical AI systems. Designed to handle massive volumes of real-time sensor and AI traffic, its platform enables a unified Ethernet-based architecture that can deterministically move, process, and orchestrate data at the edge, delivering connectivity and capabilities including reliable autonomy, over-the-air services, and AI-powered applications.

SiliconANGLE Media
Jan 20th, 2026
Ethernovia raises more than $90M to advance Ethernet packet processors for automotive and edge AI

Ethernovia raises more than $90M to advance Ethernet packet processors for automotive and edge AI. Semiconductor startup Ethernovia Inc. revealed today that it has raised more than $90 million in new funding to accelerate development and production of its next-generation packet processor family, expand software and systems capabilities, and support customer engagements across automotive, robotics and industrial markets. Founded in 2018, Ethernovia is focused on transforming how data moves within complex systems like vehicles and intelligent machines. The company was built to tackle the limitations of traditional in-vehicle networks. They can struggle with the massive volumes of high-bandwidth sensor, vision and artificial intelligence data required by modern autonomous and software-defined systems. Ethernovia designs and develops advanced packet processors and Ethernet networking chips that act as the "nervous system" of vehicles and edge devices. It says they intelligently aggregate, route and manage data streams from cameras, radar, LiDAR, control units and AI accelerators. The platform is built to handle increasingly complex workloads while maintaining low latency and high reliability. The company's product lineup includes high-performance Ethernet physical layer transceivers and scalable packet processors that support multigigabit speeds across single-pair automotive cabling. The semiconductor solutions provide the physical connectivity and data transport capabilities needed for next-generation automotive applications such as advanced driver assistance systems, centralized vehicle computing and over-the-air software updates. Ethernovia also builds products for software-defined vehicles and edge AI workloads that meet the need for flexible, programmable networking. The company's packet processors and network infrastructure allow original equipment manufacturers and system developers to deploy platforms that can be updated and reconfigured throughout the life of the product while meeting safety-critical performance standards. "The industry is entering the era of physical AI where intelligence must sense, reason and act in the real world with predictable, real-time performance," said co-founder and Chief Executive Ramin Shirani. "Legacy in-vehicle and industrial networks were never designed for AI-driven workloads. However, our packet processor platform is purpose-built to eliminate these constraints, enabling zonal and centralized architectures that scale autonomy and dramatically simplify vehicle system design." The Series B round was led by Maverick Silicon with Socratic Partners also participating. "As autonomous systems become more complex, latency, power efficiency and architectural flexibility are no longer optional - they are essential," said Kenneth Safar, managing director of Maverick Silicon. "Ethernovia has fundamentally reimagined the nervous system of intelligent machines with its packet processing platform, solving a critical networking bottleneck in automotive, robotics and industrial AI." Prior to the new funding announced today, Ethernovia had raised a single round of $64 million in May 2023, according to data from Tracxn. Investors in that round included Porsche SE, Qualcomm Ventures, VentureTech Alliance, Advanced Micro Devices Inc., Western Digital Corp., Fall Line Capital Management, Taiwania Capital Management Corp. and Enea AB. Image: Ethernovia. A message from John Furrier, co-founder of SiliconANGLE: Support its mission to keep content open and free by engaging with theCUBE community. Join theCUBE's Alumni Trust Network, where technology leaders connect, share intelligence and create opportunities. * 15M+ viewers of theCUBE videos, powering conversations across AI, cloud, cybersecurity and more * 11.4k+ theCUBE alumni - Connect with more than 11,400 tech and business leaders shaping the future through a unique trusted-based network. SiliconANGLE Media is a recognized leader in digital media innovation, uniting breakthrough technology, strategic insights and real-time audience engagement. As the parent company of SiliconANGLE, theCUBE Network, theCUBE Research, CUBE365, theCUBE AI and theCUBE SuperStudios - with flagship locations in Silicon Valley and the New York Stock Exchange - SiliconANGLE Media operates at the intersection of media, technology and AI. Founded by tech visionaries John Furrier and Dave Vellante, SiliconANGLE Media has built a dynamic ecosystem of industry-leading digital media brands that reach 15+ million elite tech professionals. Its new proprietary theCUBE AI Video Cloud is breaking ground in audience interaction, leveraging theCUBEai.com neural network to help technology companies make data-driven decisions and stay at the forefront of industry conversations.

Tech Funding News
Jan 20th, 2026
Ethernovia raises $90M to build networking chips for AI-powered robots and autonomous vehicles

Ethernovia, a Silicon Valley startup building Ethernet-based networking chips for autonomous systems, has raised over $90 million in Series B funding led by Maverick Silicon and Socratic Partners. Existing backers Porsche SE, Qualcomm Ventures and Fall Line Capital participated, alongside new investors Conduit Capital and CDIB-TEN Capital. Founded by Ramin Shirani, previously at Aquantia, Ethernovia develops packet-processing platforms that handle high-bandwidth sensor data for AI systems in vehicles, robots and industrial machines. The company's chips feature deterministic Ethernet architecture and programmable data paths designed to eliminate latency bottlenecks. The funding will support scaling production of next-generation processors as Ethernovia transitions from development to commercial deployment. The company maintains engineering teams across Europe, China, Australia and India, with nearly 90% of staff in technical roles.