Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future. 

ADI At A Glance

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $12 billion in FY23 and approximately 26,000 people globally working alongside 125,000 global customers, ADI ensures today’s innovators stay Ahead of What’s Possible. Learn more at www.analog.com and on LinkedIn.

Job Description

This role involves developing advanced packaging solutions for semiconductor devices across various market segments. These packaging solutions must meet demanding product requirements while balancing reliability and cost-effectiveness. Candidates will be expected to:

• Perform electrical or mechanical simulations of IC packages, uModules or systems using various commercial software tools.
• Work with cross-functional team to understand packaging needs, identify customer requirements, and resolve complex problems.
• Develop advanced packaging solutions (package design, material selections, qualification, and release to manufacturing) for various product groups.
• Work with the quality and reliability groups to establish the reliability criteria for semiconductor products going into various markets.
• Manage qualifications activities, document process flows and control plans for electronics packages at company’s external suppliers.

Qualifications

• Minimum of Master’s degree in Electrical Engineering or Mechanical Engineering.
• Good understanding of IC packaging materials and their behaviors.
• Familiar with RLC extraction, signal and power integrity analysis, EM and circuit simulation. 
• Hands-on experience with major mechanical FEM tools, ANSYS preferred.
• Hands-on experience with major electrical simulation tools such as EMPro, ADS, Sigrity, HFSS.
• Experience with Cadence Allegro is a plus.
• Experience with AutoCAD and SolidWorks is a plus.
• Prior internship experience in semiconductor IC or electronics assembly would be a distinct advantage.
• Strong organizational and communication skills.

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For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export  licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls.  As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type: Graduate JobRequired Travel: Yes, 10% of the time