Full-Time

Staff/Senior Staff Electro-Optic Link Codesign Engineer

Updated on 9/3/2026

Lightmatter

Lightmatter

201-500 employees

Photonic computing hardware for AI acceleration

Compensation Overview

$180k - $260k/yr

+ New-hire equity grant + Annual performance-based equity

Boston, MA, USA + 2 more

More locations: Toronto, ON, Canada | Mountain View, CA, USA

Hybrid

Flexible hybrid workplace; required office schedule is not specified.

Master's, PhD

Category
Electrical Engineering (1)
Required Skills
Python

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Requirements
  • A PhD in Electrical Engineering, Applied Physics, Physics, or a closely related photonics or optics discipline and 5+ years of experience; or an MS and 8 years of directly relevant industry experience at a photonic integrated circuit, transceiver, or optical interconnect company.
  • Deep expertise in photonic device physics and system-level optical link design, including silicon photonic modulators, germanium photodetectors, passive wavelength-division multiplexing components, optical amplifiers, and coherent or intensity-modulated link topologies.
  • Hands-on proficiency with photonic simulation tools such as VPI Photonics, Lumerical finite-difference time-domain or INTERCONNECT, or equivalent optical propagation and circuit co-simulation tools.
  • Experience with analog and mixed-signal simulation using Cadence Virtuoso or Spectre, Verilog-A behavioral modeling, or Keysight Advanced Design System for electrical-optical co-simulation.
  • Demonstrated experience developing and executing optical link budgets, corner analyses, and simulation-to-measurement closure workflows.
  • Demonstrated high-speed laboratory skills with vector network analyzers and S-parameter characterization, optical spectrum analyzers, high-bandwidth real-time oscilloscopes, bit-error-rate test sets, optical modulation analyzers, and optical power meters.
  • Proficiency in Python for simulation scripting, measurement automation, and statistical post-processing.
  • Ability to drive architecture and specification discussions with device and circuit teams.
  • Familiarity with serializer/deserializer architecture, including feed-forward equalization, decision feedback equalization, continuous-time linear equalization, clock and data recovery, and mixed-signal physical-layer co-design for high-speed interfaces.
  • Capacity to comply with federally mandated requirements of United States export control laws.
Responsibilities
  • Develop, own, and continuously improve electro-optic link simulation models covering photonic device, propagation, and channel bit-error rate from electron to photon to electron.
  • Build multiphysics models combining optical propagation, analog circuit behavior, and behavioral modeling into a coherent link analysis framework.
  • Execute comprehensive corner analysis, Monte Carlo variation sweeps, and process-voltage-temperature studies to bound link margin and generate specification-tightening recommendations for device and circuit teams.
  • Work closely with analog circuit designers to co-optimize transmitter drivers and receiver front ends for the photonic device interface, driving joint simulation across the optical-electrical boundary.
  • Contribute to end-to-end photonic link budgets covering optical power, modulation efficiency, receiver sensitivity, noise floor, and signal-to-noise ratio or optical signal-to-noise ratio margins.
  • Contribute to simulation-to-silicon closure methodology for Passage optical links; author test protocols, define measurement sequences, and iterate link models against measured data across process splits and device corners.
  • Identify and diagnose root causes of link performance gaps, distinguishing photonic, electrical, and integration origins, and drive corrective design actions.
  • Author and review photonic link architectural specifications, co-design interface requirements, and design-entry criteria for photonic and circuit teams.
  • Contribute to Passage product-level link planning by proposing photonic and electronic co-design opportunities to improve link margin, power efficiency, or yield.
Desired Qualifications
  • Silicon photonics tape-out and post-silicon characterization experience, with familiarity with process design kit-level device models and extracted simulation-to-measurement correlation.
  • Exposure to co-packaged optics, near-package optics, or optical input/output chiplet integration challenges.
  • Signal processing knowledge, including digital signal processing for optical communications, forward error correction, or PAM-4, NRZ, and coherent modulation format trade-offs and simulation.
  • Experience with Monte Carlo and statistical design methodologies for photonic-electronic system co-design.

Lightmatter develops photonic computing hardware to speed up AI workloads using light-based processing. Their photonic systems run AI tasks faster and use about 90% less energy than traditional processors. They target AI and autonomous vehicle workloads and collaborate with universities to advance electro-photonic systems. Revenue comes from hardware sales, software licenses, and partnerships, with a goal of bringing scalable photonic computing to market for faster, energy-efficient AI and AV applications.

Company Size

201-500

Company Stage

Series D

Total Funding

$822M

Headquarters

Boston, Massachusetts

Founded

2017

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Simplify Jobs

Simplify's Take

What believers are saying

  • June 2026 NVLink Fusion partnership opens hyperscaler deployment paths immediately.
  • Guide DR samples in Q4 2026 can convert evaluation kits into orders.
  • Open Compute Project CPO initiative, launched June 2, 2026, legitimizes Lightmatter’s architecture.

What critics are saying

  • Broadcom, NVIDIA, and Ayar Labs compress Lightmatter’s pricing and design-win window.
  • ASE and Amkor packaging yields determine volume ramps; any defect delays 2026 shipments.
  • If hyperscalers standardize on pluggables or Broadcom optics, Lightmatter becomes a niche laboratory vendor.

What makes Lightmatter unique

  • Lightmatter’s Passage platform validated 1.6 Tbps per fiber by June 2026.
  • NVIDIA NVLink Fusion selected Lightmatter photonics on June 3, 2026.
  • Guide DR and vClick target rack density and CPO manufacturability simultaneously.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Life Insurance

Disability Insurance

Health Savings Account/Flexible Spending Account

Unlimited Paid Time Off

Flexible Work Hours

Remote Work Options

Paid Vacation

Paid Sick Leave

Paid Holidays

Sabbatical Leave

Hybrid Work Options

Stock Options

Company Equity

401(k) Retirement Plan

Wellness Program

Mental Health Support

Gym Membership

Phone/Internet Stipend

Home Office Stipend

Commuter Benefits

Training & Development

Conference Attendance Budget

Professional Development Budget

Family Planning Benefits

Fertility Treatment Support

Adoption Assistance

Childcare Support

Elder Care Support

Relocation Assistance

Employee Referral Bonus

Tuition Reimbursement

Professional Certification Support

Mentorship Program

Meal Benefits

Employee Discounts

Company Social Events

Growth & Insights and Company News

Headcount

6 month growth

-1%

1 year growth

-2%

2 year growth

-1%
Yahoo Finance
Jun 3rd, 2026
Lightmatter joins NVIDIA NVLink Fusion ecosystem with photonic interconnects for AI infrastructure

Lightmatter, a photonic computing specialist, has joined NVIDIA's NVLink Fusion ecosystem to deliver high-performance optical connectivity for AI infrastructure. The company will provide Co-Packaged Optics and Near-Packaged Optics products compatible with NVIDIA's optical and SerDes technologies. Lightmatter's bi-directional optical link architecture will create a unified platform for semi-custom AI factories whilst reducing fibre and connector requirements by 50%. The technology enables semi-custom XPUs to connect with NVIDIA switch silicon through Lightmatter's products, creating seamless high-bandwidth connectivity for chips from various suppliers. The partnership combines Lightmatter's Passage CPO solutions with NVIDIA's NVLink Fusion architecture. Analysts view this collaboration as a critical milestone in the maturation of co-packaged optics, providing hyperscalers with a blueprint to overcome traditional I/O bottlenecks and scale AI clusters.

Business Wire
May 21st, 2026
Lightmatter unveils Guide DR: liquid-cooled laser NIC quadruples rack density for AI datacentres

Lightmatter has unveiled Guide DR, a high-density laser network interface card that quadruples rack density compared to conventional external laser small form factor pluggables. The liquid-cooled LNIC relocates the light source from the faceplate into the chassis, solving scaling bottlenecks whilst leveraging existing cooling infrastructure. Built to OCP NIC 3.0 dimensions, a single Guide DR module can support up to 51.2 Tbps of aggregate bandwidth. Four modules in a 1 RU switch tray enable 204.8 Tbps of switching bandwidth, eliminating the need for larger 4 RU chassis with liquid-cooled lasers. The module supplies 200 mW of optical power per fibre across up to 64 fibres, driving 256 lanes at 200G each, with zero front-panel footprint. Guide DR will begin sampling in Q4 2026.

Associated Press
Apr 27th, 2026
Lightmatter hires ex-Google AI director Roy Kim to scale photonic interconnects globally

Lightmatter, a photonic computing company, has appointed Roy Kim as Vice President of Product to lead deployment of its photonic interconnect platform. Kim brings over 15 years of AI infrastructure experience from Google, AMD and NVIDIA. At Google since 2021, Kim served as Director of AI Infrastructure Product Management. He previously led Data Center GPU Product Management at AMD and spent eight years at NVIDIA in AI and high-performance computing roles. At Lightmatter, Kim will oversee product roadmap, management, marketing and strategy. The appointment follows significant product launches, including the Guide light engine in January and the Passage L20 optical engine in March. Lightmatter's technology aims to eliminate data bottlenecks in AI data centres through photonic interconnects.

Business Wire
Mar 11th, 2026
Lightmatter achieves record 1.6 Tbps per fiber with photonic interconnect chiplet

Lightmatter has achieved a record-breaking 1.6 Tbps throughput per fibre with its Passage Co-Packaged Optics chiplet, marking a significant milestone in AI interconnect performance. The technology, developed in collaboration with Qualcomm Technologies, uses a 16-wavelength DWDM architecture and delivers up to eight times more bandwidth per fibre than existing solutions. The silicon-proven platform combines Lightmatter's photonic engine with Qualcomm Technologies' 112G PAM4 optical SerDes chiplet, addressing interconnect bottlenecks limiting AI model scaling. The architecture reduces power consumption whilst enabling connectivity for next-generation processors and switches, with Passage L-Series photonic engines on track to deliver 100 Tbps and beyond. The record-breaking Passage L-Series photonic interconnects are now available through evaluation kits for lead customer testing.

Associated Press
Mar 11th, 2026
Lightmatter launches vClick Optics, first detachable fiber array for high-volume CPO production with <1.5 dB loss

Lightmatter has unveiled vClick Optics, the industry's first detachable fibre array unit for co-packaged optics advanced packaging. The technology enables high-volume manufacturing of 3D CPO-enabled chips by allowing manufacturers to verify optical engines before final integration, reducing yield loss risks. vClick Optics achieves insertion loss below 1.5 dB and supports high-bandwidth Dense Wavelength Division Multiplexing for 32-100Tbps optical interconnects. The technology integrates SENKO's connector solutions with Lightmatter's photonic technology and is compatible with advanced packaging flows from major foundries. Developed in partnership with ASE and SENKO Advanced Components, vClick transforms permanent fibre attachment into a plug-and-play solution. Lightmatter will showcase the technology at the Optical Fiber Communication conference in Los Angeles from 15-19 March 2026.