Salary Range: 127000 to 190000 (Currency: CAD) (Pay period: per-year-salary)

Staff Packaging Development Engineer

Direct Hire / Full time, Hybrid / In-Office / Burnaby BC Canada

D-Wave (NYSE: QBTS) is a leader in the development and delivery of quantum computing systems, software, and services, and is the world’s first commercial supplier of quantum computers—and the only company building both annealing quantum computers and gate-model quantum computers. Our mission is to unlock the power of quantum computing today to benefit business and society. We do this by delivering customer value with practical quantum applications for problems as diverse as logistics, artificial intelligence, materials sciences, drug discovery, scheduling, cybersecurity, fault detection, and financial modeling. D-Wave’s technology has been used by some of the world’s most advanced organizations including Mastercard, Deloitte, Davidson Technologies, ArcelorMittal, Siemens Healthineers, Unisys, NEC Corporation, Pattison Food Group Ltd., DENSO, Lockheed Martin, Forschungszentrum Jülich, University of Southern California, and Los Alamos National Laboratory.

Our company and its innovations have appeared in the pages of Time Magazine, Fast Company, MIT Technology Review, Forbes, INC Magazine and Wired. As of August 8, 2022, our company is publicly traded on the New York Stock Exchange as $QBTS.

About the role:

D-Wave’s Processor Development team is seeking a talented IC packaging development engineer to join our chip packaging team and contribute to the development of advanced cryogenic microelectronic packages for superconductor-based quantum computers. You will work closely with quantum processor scientists, superconducting IC designers, and mechanical, cryogenic, and electrical engineers to arrive at the requirements. You will be responsible for evaluating and developing and debugging next generation cryogenic quantum computing processor packaging technologies. You are a problem solver with strong engineering physics, willing to tackle difficult problems. You will work closely with an integrated product team to drive package development, electrical design, modeling and characterization, including consideration of signal integrity, and cryogenic power distribution, manufacturing and assembly tolerances.

What you’ll do:

Develop and manage relationships with outside vendors and collaborators who you will work with to build flip-chip assemblies
Perform cryogenic testing of flip-chip assemblies in D-Wave’s lab – for both robustness and functionality. We have a world-class cryogenics team to work with you.
Use the results to develop and validate a flip-chip packaging process from the chip pad metallization to PCBs to final packaged chip.
Once you have developed a successful process, you will work with D-Wave’s R&D leadership and technical team to work out the best approach to ensuring secure access to it.

About you

Bachelor’s degree in Electrical or Mechanical Engineering, Applied Physics, or related fields and 5-10 years of related professional experience

-Or-

Master’s degree and/or PhD in Electrical or Mechanical Engineering, Applied Physics, or related fields with 3-5 years of experience
Strong fundamentals in EM, transmission lines and microwave theory
Understanding the frequency domain and time domain, and knowledge of high speed signaling
Experience with VNA and TDR measurements
Experience with high-speed electronic packaging for digital and analog ICs
Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS is a plus
Knowledge of the thermal and mechanical analysis of the IC package development is a plus
Experience with 2.5D/3D package development, including flip-chip, bump bonding
Hands-on experience in various wafer level, package level assembly process, materials, and equipment. Specifically, focus on chip-on-board
Broad exposure, including as many as possible of: MEMS or MOEMS packaging, photonics / optoelectronics, micro- and nano-fluidics, sensors, thick film/ceramic, heterogenous integration and other niche applications
Strong IC packaging materials background including characterization and failure analysis
Strong communication, presentation, and documentation skills
Ability to work both independently, and with multi-function teams

A D-Waver’s DNA

We look at the future and say “why not”; we see possibilities where others see problems or routines. We show the way ahead and are committed to achieving ambitious goals.
We practice straight talk and listen generously to each other with empathy. We value different opinions and points of views. We ensure that we connect outside as well as inside to learn from others and inspire each other.
We hold ourselves accountable for delivering results. We make decisions and take responsibility, so that we can act and support each other.
As leaders, we motivate and engage our teams to go beyond what was originally thought possible, by developing our people and creating the conditions for them to grow and empower themselves through enabling and coaching.

We celebrate diverse perspectives to drive innovation in our pursuit. Our employees range from distinguished domain experts with decades of experience in their respective fields, to bright and motivated graduates eager to make their mark.

Our diverse and innovative team will make you feel appreciated, supported and empower your career growth at D-Wave.

No 3rd party candidates will be accepted.

It is D-Wave’s policy to provide equal employment opportunity (EEO) to all persons regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, genetic information, physical or mental disability, protected veteran status, or any other characteristic protected by federal, state/provincial, local law.

Staff Packaging Development Engineer

D-Wave Systems

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