Salary Range: 127000 to 190000 (Currency: CAD) (Pay period: per-year-salary)

What you’ll do:

• Develop and manage relationships with outside vendors and collaborators who you will work with to build flip-chip assemblies  
• Perform cryogenic testing of flip-chip assemblies in D-Wave’s lab – for both robustness and functionality. We have a world-class cryogenics team to work with you. 
• Use the results to develop and validate a flip-chip packaging process from the chip pad metallization to PCBs to final packaged chip. 
• Once you have developed a successful process, you will work with D-Wave’s R&D leadership and technical team to work out the best approach to ensuring secure access to it. 

About you

• Bachelor’s degree in Electrical or Mechanical Engineering, Applied Physics, or related fields and 5-10 years of related professional experience  
-Or-
• Master’s degree and/or PhD in Electrical or Mechanical Engineering, Applied Physics, or related fields with 3-5 years of experience  
• Strong fundamentals in EM, transmission lines and microwave theory  
• Understanding the frequency domain and time domain, and knowledge of high speed signaling 
• Experience with VNA and TDR measurements 
• Experience with high-speed electronic packaging for digital and analog ICs 
• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS is a plus  
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus 
• Experience with 2.5D/3D package development, including flip-chip, bump bonding 
• Hands-on experience in various wafer level, package level assembly process, materials, and equipment. Specifically, focus on chip-on-board 
• Broad exposure, including as many as possible of: MEMS or MOEMS packaging, photonics / optoelectronics, micro- and nano-fluidics, sensors, thick film/ceramic, heterogenous integration and other niche applications  
• Strong IC packaging materials background including characterization and failure analysis  
• Strong communication, presentation, and documentation skills  
• Ability to work both independently, and with multi-function teams 

A D-Waver’s DNA

• We look at the future and say “why not”; we see possibilities where others see problems or routines. We show the way ahead and are committed to achieving ambitious goals. 
• We practice straight talk and listen generously to each other with empathy. We value different opinions and points of views. We ensure that we connect outside as well as inside to learn from others and inspire each other. 
• We hold ourselves accountable for delivering results. We make decisions and take responsibility, so that we can act and support each other. 
• As leaders, we motivate and engage our teams to go beyond what was originally thought possible, by developing our people and creating the conditions for them to grow and empower themselves through enabling and coaching.