Full-Time

Staff Engineer

Workspace Specialist

Posted on 8/18/2026

Renesas Electronics

Renesas Electronics

10,001+ employees

Automotive-focused MCUs, SoCs, analog devices

No salary listed

Bengaluru, Karnataka, India

In Person

Bachelor's

Category
DevOps & Infrastructure (1)
Required Skills
Power BI
Printed Circuit Board (PCB) Design
ERP
Version Control
Tableau
JIRA

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Requirements
  • A B.E., B.Tech, M.E., or M.Tech degree is required, along with at least 10 years of professional experience.
  • Deep experience, knowledge, and skills in Altium Workspace platforms, including Altium 365 and Concord Pro, are required.
  • Strong hands-on experience with JIRA data and Agile metrics reporting is required.
  • Strong proficiency in Power BI, Tableau, or an equivalent tool is required.
  • Proven experience leading tool migration or digital transformation initiatives and owning and managing Workspace environments at the project or organizational level is required.
  • Strong understanding of PCB design processes and their integration with workflows is required.
  • Proven ability to mentor engineers and drive adoption of tools and workflows across teams is required.
  • Demonstrated expertise in design data management, configuration control, and engineering change management, including ECO processes, is required.
Responsibilities
  • Act as the primary subject matter expert and advisor for engineering leadership, PCB designers, and cross-functional teams.
  • Engage with engineering departments, program managers, and stakeholders to drive migration and adoption.
  • Lead discussions, workshops, and demonstrations that articulate the business and technical value of Workspace solutions.
  • Implement Workspace/EDM deployments across multiple teams and establish enterprise-wide governance.
  • Recommend and implement scalable Workspace architectures that support growing engineering teams, multiple projects, and evolving design requirements.
  • Address concerns related to migration, performance, workflows, and governance.
  • Identify risks and develop mitigation plans to minimize disruption to ongoing engineering work.
  • Support pilot rollouts and scale adoption across multiple teams and sites.
  • Establish best practices for library management, version control, collaboration, and lifecycle management.
  • Guide integration with PLM, ERP, and other enterprise systems.
  • Develop and deliver training programs, documentation, and onboarding materials.
  • Gather feedback and continuously optimize workflows and configurations.

Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.

Company Size

10,001+

Company Stage

IPO

Headquarters

Tokyo, Japan

Founded

2002

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Simplify Jobs

Simplify's Take

What believers are saying

  • TIER IV chose R-Car Gen 5 on August 20, 2026 for autonomous driving.
  • Gen 3 MRDIMM samples shipped in 2026, targeting 16,000 MT/s AI datacenter demand.
  • Irida Labs and Pictorus acquisitions in 2026 deepen Renesas' edge-AI software stack.

What critics are saying

  • Navitas sued Renesas on August 10, 2026, threatening GaN product margins and shipments.
  • Takasaki's 6-inch line closes within two to three years, disrupting analog supply continuity.
  • SiTime's timing-business acquisition removes a cash-generating segment, shrinking Renesas' diversification and leverage.

What makes Renesas Electronics unique

  • Renesas leads automotive MCUs with R-Car Gen 5 and RH850 platform depth.
  • Renesas 365 unifies embedded hardware, cloud modeling, and lifecycle software after Pictorus.
  • Winning Combinations bundle semiconductors, software, and reference designs for faster automaker integration.

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Benefits

Health Insurance

Life Insurance

Mental Health Support

Professional Development Budget

Meal Benefits

Growth & Insights and Company News

Headcount

6 month growth

-22%

1 year growth

-30%

2 year growth

-30%
PR Newswire
Aug 20th, 2026
TIER IV partners with Renesas to build open AI computing platform for autonomous vehicles

TIER IV is collaborating with Renesas Electronics to build an open AI-native computing platform for software-defined vehicles. The partnership combines TIER IV's Autoware autonomous driving software and reference AI models with Renesas' R-Car Gen 5 automotive system-on-chips. The collaboration aims to deliver scalable solutions spanning Level 2+ advanced driver assistance through Level 4 autonomous driving. TIER IV will port and optimise Autoware on R-Car Gen 5 SoCs and deploy its end-to-end autonomous driving AI models on the platform. The companies will jointly promote this integrated hardware and software platform to automakers and Tier 1 suppliers worldwide. TIER IV plans to demonstrate Autoware and its reference AI models running on Renesas' R-Car X5H at Automotive World 2026 in September at Makuhari Messe near Tokyo.

Bloomberg
Aug 11th, 2026
SiTime CEO credits AI data centers for triple-digit revenue growth ahead of Renesas deal

SiTime reported triple-digit year-over-year revenue growth, driven largely by AI demand and the expanding data centre market, according to Chairman and CEO Rajesh Vashist. The company's timing synchronisation technology is critical for data centre components including TPUs, GPUs, switches, accelerator cards, optical modules, and cables. Vashist explained that the technology ensures high performance and cost efficiency across these systems. He discussed the company's growth trajectory and market position during an interview on Bloomberg's "The Close" programme.

Yahoo Finance
Aug 11th, 2026
Renesas targets 29-day recovery after quake halts chip factory, six days faster than 2016

Renesas Electronics has nearly returned to its pre-earthquake stock level following a magnitude 7.1 quake that struck its Kumamoto facility on 28 July. The Japanese chipmaker halted production at the Kawashiri plant after the tremor caused wall cracks and water supply disruption. The company scheduled a phased restart from 5 August, targeting full wafer-input capacity within approximately three weeks. This marks a faster recovery than the 2016 earthquake at the same plant, which affected 35% of wafers and cost an estimated ¥14 billion in sales. Renesas shares fell initially but jumped 13.45% on 3 August after strong second-quarter results showed non-GAAP revenue rising 24.9% year-on-year. The stock closed at ¥3,825 on 10 August, just 1.1% below pre-quake levels.

Yahoo Finance
Jul 31st, 2026
Renesas to close Takasaki factory's 6-inch wafer production within three years

Renesas Electronics will phase out production at its Takasaki Factory in Japan within two to three years due to challenges with its 6-inch wafer line. The semiconductor manufacturer cited aging equipment, deteriorating utility facilities, and discontinued support for production materials as key factors behind the decision. The company plans to maintain and strengthen research and development functions at the site, focusing on analogue ICs and power semiconductors for data centres and automotive applications. Renesas will build inventory to ensure stable supply for customers during the transition. The firm committed to supporting affected employees through reassignment, career support, and other employment opportunities. Specific timing and details of the closure have not been finalised.

Associated Press
Jul 30th, 2026
Renesas launches Gen 3 MRDIMM chipset with 16,000 MT/s DDR5 speeds for AI datacentres

Renesas Electronics announced its third-generation DDR5 MRDIMM chipset solutions, delivering speeds up to 16,000 mega transfers per second for AI data centres and cloud infrastructure. The Gen 3 solutions provide 25% higher memory bandwidth than the previous generation whilst maintaining compatibility with existing DDR5 infrastructure. The chipset includes Multiplexed Registering Clock Driver and Multiplexed Data Buffer devices, designed to address growing memory bandwidth demands from AI workloads. Renesas offers a complete platform spanning MRCD, MDB, power management ICs, SPD hubs, and temperature sensors. The Gen 3 MRCD and MDB are currently sampling to select customers, including major DRAM suppliers. Production availability is expected in the second half of 2027. Renesas will showcase the solutions at FMS 2026 in Santa Clara, California, from 4-6 August.

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