Full-Time

ASIC Analog Design Principal Engineer

Posted on 5/9/2026

Micron Technology

Micron Technology

10,001+ employees

Memory and storage semiconductor manufacturer

No salary listed

Bengaluru, Karnataka, India

In Person

Category
Electrical Engineering (2)
,
Requirements
  • Circuit design experience in analog/mixed signal CMOS circuits in deep sub-micron technologies (2 – 28 nm) in High speed Memory interfaces (DDR3/4/5, LPDDR5/6, GDDR5/6/7) or SerDes Interfaces (PCIe, MIPI, HDMI, USB, SATA etc)
  • Prior experience in taking full ownership of at least on of the sub-blocks like PLL, DLL, CDR, high speed receiver with equalization, transmitter front end and high speed data path
  • The candidate is encouraged to possess a deep understanding of analog and mixed signal circuits along with experience in high speed link
  • Candidate must have experience in Serdes/Parallel Interface
  • Experience with TX RX Equalization (FFE/CTLE/DFE) is must
  • Experience with various CDR and Clocking architecture
  • Candidate should have experience in finfet 10nm and below
  • Able to create block level specification based on link budget
  • Able to create system level modeling using VerilogA/Python
  • Should be able to work with Packaging/Board team
  • Should have knowledge of ESD
  • Experience in lab testing and work with validation team to analysis data
  • High speed I/O cell designs such as DDR, LVDS, HSTL, CML
  • Power Delivery circuits such as Bandgap, LDO, Bias circuits
  • Strong fundamental knowledge for AMS design, Advanced CMOS and FinFet technologies
  • Understanding of Mismatch analysis & Monte-Carlo methodology/sims, transistor level Circuit level noise analysis. Understanding of device physics & deep-sub micron issues
  • Supervision of complex and/or critical analog layout and defining IP floorplan
  • Experience with industry standard tools such as Cadence ADE, Spectre, AMS verification, EM/IR flows, MATLAB, Calibre etc.
  • Working knowledge of Mixed mode simulation, Signal Integrity and ESD desired
  • MS/MS Technonlogy, BS/BE (Electronics)
  • Experience Required : 5+ Years
Responsibilities
  • Take ownership of analog sub-blocks inside the PHY and drive the specification and implementation. It includes transistor and block level design, simulation, reliability and mixed mode simulations etc.
  • Drive layout of sophisticated blocks through mask designers. Conform to complex process rules as well as DFM or equivalent experience.
  • Participate in design reviews both internally and potentially with customers to explain design choices and robustness. Work with people across multiple sites including overseas.
  • Help with creating IP EDA views: Behavioral/Verilog-A, timing views, abstract etc.
  • Participate in silicon bring up, characterization, & perform correlations against models & simulations.
  • Mentor and supervise entry-level engineers.
  • Leads all aspects of definition, design, verification, and documentation for ASIC development. Determines architecture design, logic design, and system simulation. Defines module interfaces/formats for simulation.
  • Contributes to the development of multidimensional designs involving the layout of complex integrated circuits.
  • Evaluates all aspects of the process flow from high-level design to synthesis, place and route, and timing and power use.
  • Analyzes equipment to establish operation data, conducts experimental tests, and evaluates results.
  • May also review vendor capability to support development.

Micron Technology designs and manufactures memory and storage products, including DRAM, NAND, and NOR flash. These products power devices across computing, networking, automotive, industrial, and mobile markets. The company sells to OEMs, distributors, and end users worldwide and funds ongoing research and development to meet evolving needs. Micron aims to provide scalable memory solutions and maintain an inclusive, growth‑oriented workplace for its employees.

Company Size

10,001+

Company Stage

IPO

Headquarters

Boise, Idaho

Founded

1978

Simplify Jobs

Simplify's Take

What believers are saying

  • HBM4 36GB 12H enters volume shipments in Q1 2026 with full 2026 sold out.
  • Fiscal Q3 2026 revenue guides to $33.5 billion with 81% margins.
  • Acquired Powerchip’s P5 site on March 15, 2026, expanding Taichung campus.

What critics are saying

  • SK Hynix launches 12-layer HBM4E in Q3 2026, capturing 60% Nvidia Blackwell Ultra.
  • US-China controls force Xi’an facility relocation, costing $2B+ in 12 months.
  • Taiwan earthquake halts Taichung fab’s 30% DRAM output for 4-6 months.

What makes Micron Technology unique

  • Micron ships 245TB Micron 6600 ION SSD using G9 QLC NAND.
  • Micron samples 256GB DDR5 RDIMM on 1-gamma DRAM for AI servers.
  • Micron produces SOCAMM2 192GB for NVIDIA Vera Rubin platforms.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Disability Insurance

Parental Leave

Unlimited Paid Time Off

Paid Holidays

Flexible Work Hours

Company News

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