Thermal Design Engineer High Performance Workstation Computing

Description -

At HP Advanced Compute and Solutions (ACS), we are a globally dynamic business dedicated to serving professional compute users across all industry segments. We deliver best-in-class mission-critical client computing and related solutions, empowering our customers to excel in their most demanding applications. Our contributions span diverse domains, including Architecture and Engineering, Product Design, Finance Systems, Medical Equipment, Military & Defense, Emergency Services, and more.

Are you ready to play a pivotal role in our inclusive Workstation engineering team? We are seeking a talented Thermal Design Engineer with a minimum of 4 years of experience, specializing in computer system thermal design, fan control and acoustics. Your expertise will help us bring cutting-edge technologies, architectures, and high-performance computing systems to market. As the demand for premium compute performance continues to rise, your specialized knowledge in thermal design will be instrumental in maximizing performance, minimizing acoustics, and ensuring world-class reliability.

Key Responsibilities: As a vital member of our team, you will:

• Design Excellence: Apply established engineering principles to architect thermal and acoustic solutions that deliver best-in-class system performance.

• Thermal Expertise: Leverage your specialized knowledge in thermal design and computer system fan control to identify technologies of interest and create innovative thermal and acoustic solutions.

• Performance Optimization: Develop and execute test plans to validate and ensure optimal system thermal management, fan control and acoustic performance.

• Expert Collaboration: Collaborate effectively with internal and external development partners leveraging your expertise to shape thermal design strategies and co-create solutions that excel.

• Strategic Planning:  Shape the landscape of thermal solutions by managing architectures and strategically planning best-in-class designs while adhering to budgetary and project scope requirements.

Education and Experience:

• Education: bachelor’s or master’s degree in mechanical engineering.

• Experience: Minimum of 4 years in a related discipline, with a strong emphasis on thermal design and computer system fan control.

Skills and Knowledge:

• Proficiency in using ProEngineer or other 3D CAD software for mechanical design.

• Strong analytical and problem-solving skills, with the ability to apply them effectively.

• Experience with Computational Fluid Dynamics (CFD) and thermal mockups to validate thermal solutions.

• Skillful in conveying design proposals and negotiating options effectively.

• Exceptional written and verbal communication skills in both English and the local language.

Why Join Us? This is your chance to thrive in a dynamic, team-oriented, and fast-paced environment, where you will be at the forefront of technology innovation. Your work will directly impact the performance and reliability of mission-critical computing systems used by our customers across multiple industry segments.  Additionally, you’ll have the opportunity to collaborate with industry partners and technology leaders to influence strategies and drive innovation in thermal design.

Make Your Mark: If you are an experienced Thermal Design Engineer with a passion for innovation, a knack for problem-solving, and a desire to shape the future of computing, we want to hear from you. Join us at HP ACS and be part of a team that transforms challenges into achievements and sets new standards for excellence in high performance workstation computing.

Apply Now and Elevate Your Career with HP Advanced Compute and Solutions

The base pay range for this role is $104,800.00 to $149,350.00 annually with additional opportunities for pay in the form of bonus and/or equity (applies to US candidates only).  Pay varies by work location, job-related knowledge, skills, and experience.

Benefits:

HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including; 
  • 4-12 weeks fully paid parental leave based on tenure
  • 11 paid holidays
  • Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.

Job Posting Expiration Date: 06/01/2025

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (United States of America)

Travel -

Not Specified

Relocation -

Yes

Equal Opportunity Employer (EEO) - 

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’sEEO Policyor your EEO rights as an applicant under the law, please click here:Equal Employment Opportunity is the LawEqual Employment Opportunity is the Law – Supplement