Full-Time

Senior EDA Engineer

Electronic Design Automation, Texas Institute for Electronics

Posted on 5/9/2026

University of Texas at Austin

University of Texas at Austin

No salary listed

Company Does Not Provide H1B Sponsorship

Austin, TX, USA

Hybrid

Hybrid option with 30–50% travel; subject to UT Austin policy and applicable laws.

Category
Electrical Engineering (2)
,
Required Skills
JIRA
Requirements
  • BS in Electrical Engineering, Computer Engineering, or related discipline.
  • 8+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, or advanced packaging workflows.
  • Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and heterogeneous integration.
  • Hands-on experience building and deploying packaging-related PDKs/ADKs. Strong understanding of modeling, simulation, and qualification across electrical, RF, mechanical, and thermal domains.
  • Exceptional communication skills.
  • Startup DNA. You are energized by ambiguity, act with urgency, and take personal ownership of technical outcomes.
  • Execution mindset. You have demonstrated experience working in a hands-on role driving technical progress across multiple initiatives.
  • Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%.
  • MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
  • 12+ years of experience in Electronic Design Automation (EDA), semiconductor design enablement, advanced packaging workflows, or related technical leadership.
  • Demonstrated expertise with Synopsys, Cadence, Ansys, or Siemens design flows. Proven ability to guide tool strategy, qualification methodology, and integration roadmaps.
  • Proven track record of designing, deploying, and managing PDK/ADK programs at scale. Deep expertise in multi-physics modeling, simulation qualification, and cross-domain validation strategies.
  • Strong program management experience. Demonstrated success defining program scope, managing multi-stakeholder dependencies, holding teams accountable to milestones, and delivering results in complex environments.
  • Proven vendor and partner management skills. You can clearly define expectations, structure Statements of Work with quantifiable deliverables, and hold teams accountable to milestones and quality standards.
  • Exceptional communication and executive presence. You simplify the complex, inspire confidence in both technical and business audiences, and are a sought-after technical leader.
  • Entrepreneurial mindset and demonstrated ability to build technical programs and teams from the ground up. You thrive in ambiguous environments and drive results with urgency.
Responsibilities
  • Support the EDA implementation roadmap for TIE; multi-component and chiplet integration platforms, working hands-on with design kits, simulation tools, and reference flows.
  • Develop and maintain comprehensive process design kits (PDKs) and assembly design kits (ADKs), including modeling, verification, and enablement collateral to accelerate customer adoption.
  • Work directly with EDA tools (Synopsys, Cadence, Ansys, Siemens) and packaging design teams to integrate electrical, thermal, and mechanical simulation workflows. Serve as a technical resource in design reviews and customer engagements.
  • Work on Jira, Version Control tools to enable the Internal and External Development teams.
  • Apply AI based deployment of the EDA flows, PDK development.
  • Collaborate with engineering, packaging design, product marketing, and EDA vendors to ensure design enablement flows are validated, documented, and continuously refined.
  • Create detailed technical documentation, user guides, reference flows, and onboarding materials to support customer design teams.
  • Assist in program planning activities covering scope, schedules, risk mitigation, and resource allocation to support predictable execution.
  • Monitor EDA market trends and competitive developments, providing technical insights to guide tool integration decisions and platform improvements.
  • Support program transparency and accountability, ensuring technical deliverables are on track and stakeholders are informed of progress and risks.
  • Drive strategic vision and implementation roadmap for EDA; multi-component and chiplet integration platforms—spanning design kits, simulation tools, and reference flows from concept to production deployment.
  • Lead technical development of comprehensive process design kits (PDKs) and assembly design kits (ADKs), including multi-physics modeling, qualification strategies, and customer enablement collateral.
  • Own roadmap decisions and quality standards.
  • Set technical direction for EDA packaging workflows, establishing best practices and qualification criteria that span electrical, RF, thermal, and mechanical simulation domains.
  • Represent TIE as a technical authority in industry working groups, customer design reviews, and ecosystem partnerships.
  • Manage relationships with TIE subcontractors, vendors, and EDA partners (Synopsys, Cadence, Ansys, Siemens).
  • Define clear Statements of Work (SoW) with quantifiable metrics, monitor milestone progress, and adjust deliverables and payable milestones as needed to ensure accountability.
  • Drive cross-functional collaboration with engineering, packaging design, product marketing, and major EDA vendors to align design enablement flows, establish validation protocols, and continuously improve platform capabilities.
  • Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication.
  • Deliver predictable outcomes in fast-paced, multi-stakeholder engagements.
  • Own the creation of comprehensive technical documentation, reference architectures, onboarding frameworks, and strategic collateral that position TIE as an EDA innovator and strengthen customer confidence.
  • Monitor EDA market trends, competitive developments, and emerging technologies. Provide actionable strategic insights to guide tool integration roadmap, design enablement priorities, and platform differentiation.
  • Champion a culture of accountability and transparency across all program workstreams. Ensure stakeholders are informed, expectations are clearly defined and communicated, and commitments are met.
  • Mentor junior technical staff and build high-performing teams.
Desired Qualifications
  • MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
  • Prior experience supporting program planning, milestone tracking, and cross-functional coordination in complex technical projects.
  • Exposure to vendor and partner collaboration on design enablement initiatives.
  • Prior experience as a technical leader or principal engineer in semiconductor, EDA, or advanced packaging contexts.
  • Demonstrated mentoring and team-building capabilities; you have developed junior technical talent and fostered high-performing engineering organizations.
  • Visibility in industry forums, standards bodies, or EDA vendor partnerships. Strong reputation as a technical innovator and thought leader in chiplet and heterogeneous integration.
University of Texas at Austin

University of Texas at Austin

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