Full-Time

Metrology Development Engineer 2

Texas Institute for Electronics

Posted on 5/9/2026

University of Texas at Austin

University of Texas at Austin

Compensation Overview

$100k/yr

Company Does Not Provide H1B Sponsorship

Austin, TX, USA

In Person

Category
Process Engineering
Required Skills
Metrology
Data Analysis
Requirements
  • Bachelor’s degree in Mechanical Engineering, materials science, chemical engineering, electrical engineering, or other relevant discipline.
  • Minimum 5 years of experience working in Mechanical R&D roles with prior experience in metrology labs and semiconductor industry.
  • Skilled in all aspects of thermal and mechanical metrologies spanning fundamental theory and design to practical application of novel measurement methods.
  • Mission oriented approach with ability to manage multiple projects simultaneously.
  • Excellent written and verbal communication skills.
  • Demonstrated ability to work successfully in a collaborative team environment.
  • Experience writing and working with project level requirements and specifications.
  • Excellent analytical and problem-solving skills, as well as attention to detail.
  • Relevant education and experience may be substituted as appropriate.
Responsibilities
  • Lead the selection, procurement, installation and qualification of metrology equipment and systems.
  • Develop a TIE-specific metrology tool set that effectively measures electrical, thermal, and mechanical performance metrics for 3DHI systems.
  • Support TIE by providing accurate and actionable measurement data to sister groups working on process development.
  • Provides vision and direction in developing forward-looking measurement technologies and establish a robust metrology roadmap.
  • Drive corrective actions as a part of cross-functional teams to identify systemic yield and reliability issues. This includes performing failure analysis to troubleshoot/root-cause.
  • Participate in the hiring process for technicians and junior engineers to support the workforce development of TIE.
  • Other related functions as assigned.
Desired Qualifications
  • Experience in a startup or research and development environment.
  • Prior experience in semiconductor design, characterization, and/ or process integration.
  • Solid understanding of semiconductor packaging technologies, including wire bonding, flip-chip, wafer-level packaging, and 3DHI a plus.
  • Prior experience in software development for hardware control and instrumentation.
  • Experience leading teams, working with contractors and managing people.
University of Texas at Austin

University of Texas at Austin

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