WHAT YOU’LL DO:

• Work with engineers package, test and assemblies custom infrared image sensors in a class 10,000 clean room environment.
• Handle and test Si wafers in automated UF200 probe test station
• Handle, mount and wirebond image sensors into custom ceramic packages using an F&S 53XX BDA ball bonder.
• Visual and electrical inspection of fully packaged sensor chip assemblies (SCAs).
• SCA installation into liquid nitrogen high vacuum test station.
• Manage cleanroom and the equipment/activities within.
• Assemble non-production camera systems
• Collect image data using automated tools

REQUIRED QUALIFICATIONS

• 5+ years experience as a technician working on complex microelectronics assemblies
• Experience with building and troubleshooting cables and wiring harnesses.
• Familiar and comfortable with soldering, crimping, assembling cables and connectors
• Experience working with delicate microelectronics assemblies and performing ultra fine motor skill tasks
• Ability to work through R&D tasks with limited oversight (evaluate, design, order materials, execute)
• U.S. Person status is required as this position needs to access export controlled data

PREFERRED QUALIFICATIONS

• Experience with the alignment and characterization of optical systems
• Experience with 3D printing for prototyping
• Experience with test and measurement equipment (Instron, CMM, optical, etc.)
• Proficiency with Solidworks and scripting/automation languages (Matlab, Python, Labview)