Responsibilities: 

• Own end-to-end RF module and system-in-package (SiP) development for embedded and consumer products from concept to mass production. 
• Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development, and performing cost/technology/performance analysis.
• Develop module architecture, schematics, and layouts, and work with vendors for DFM and manufacturing.
• Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of RF modules/SIPs.  
• Design, simulate and validate advanced RF packaging/module/SIP 
• Collaborate closely with cross-functional teams and vendors to ensure RF performance is met at component, board, and system levels.

Qualifications: 

• 3+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries. 
• Experience with advanced packaging technologies and RF module/SiP design
• Experience in RF schematics, layouts, and DFM. 
• Work experience with RF lab equipment for device characterization, debug, and component/system performance validation.
• Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
• Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g. network analyzers, communication testers, spectrum analyzers, and oscilloscopes)
• Experience with Wi-Fi, BT, GPS, and cellular RF implementation is a plus.
• Experience in bringing RF modules/SiPs to production is a plus.

Education: 

• At least BSc in related engineering discipline; MS or PhD in EE with emphasis on advanced packaging or RF design is a plus.