Senior Principal Test Engineer

Rambus recognized by Forbes as one of america's Most Successful Mid-Cap Companies for 2026. Rambus is proud to announce that Rambus has been named one of Forbes' Most Successful Mid-Cap Companies for 2026, ranking #21 out of 100 companies nationwide. This recognition highlights Rambus' sustained financial performance, disciplined execution, and continued focus on delivering differentiated semiconductor technologies that address the world's most demanding compute challenges. Each year, Forbes evaluates publicly traded mid-cap companies with market capitalizations between $5 billion and $20 billion, using data from FactSet. To qualify, companies must demonstrate positive sales growth over the past year and meet additional financial criteria. The final rankings are based on earnings growth, sales growth, return on equity, and total stock return over the past five years, with greater emphasis placed on the most recent year's performance. All data for the 2026 ranking reflects results as of December 5, 2025. Rambus' placement on this list reflects the strength of its long-term strategy and the impact of its product portfolio across memory interface chips, interface IP, and security IP solutions. As data volumes continue to grow and system complexity increases, Rambus technologies help enable higher performance, greater efficiency, and stronger security across data centers, AI systems, networking infrastructure, and edge devices. This recognition is also a testament to the people behind the technology. The Rambus team continues to innovate with purpose, working closely with customers and partners across the semiconductor ecosystem to solve real world challenges and accelerate the future of compute. Consistent execution, technical excellence, and a focus on delivering value have been central to its growth. Being named to the Forbes list reinforces its commitment to building sustainable success while advancing the technologies that matter most to its customers and the industry. Rambus is honored to be recognized alongside other high-performing companies that are shaping the future of technology and business. To learn more about the Forbes 2026 Most Successful Mid-Cap Companies list and the full ranking methodology, visit the Forbes website: https://www.forbes.com/lists/best-mid-cap-companies/ Rambus thank its employees, customers, and partners for being part of this journey and look forward to continuing to deliver innovation that drives performance, efficiency, and security in the years ahead.

Embedded World 2026: Rambus announces HBM4E controller IP for next-gen AI workloads. At Embedded World 2026 in Nuremberg, Rambus Silicon IP Division Sr. Director of Product Marketing Bart Stevens walked through the company's newly announced HBM4E Controller IP, targeting the memory bandwidth demands of next-generation AI accelerators, GPUs, and high-performance compute applications. The headline spec is 16 Gbps per pin, which translates to 4.1 TB/s of throughput per memory device. In an eight-device AI accelerator configuration, that adds up to more than 32 TB/s of memory bandwidth. Stevens framed the announcement in the context of how quickly the HBM standard has been leapfrogging JEDEC baselines from HBM3's 8 Gbps per pin to 9.6 with HBM3E, back to 8 Gbps but with 2048 pins per device in HBM4, and now scaling pin rates from 12 to 13.2 to 16 Gbps with HBM4E. "We have a couple of architectural options for our customers to choose from. It is a huge leap because it's now a doubling of capacity and performance," said Stevens. Reliability gets as much attention as raw performance. As memory density and stacking increase, thermal stress becomes a real concern. The Rambus controller includes built-in telemetry and RAS (reliability, availability, and serviceability) features that probe PHY registers for signal-integrity metrics and monitor for single-bit errors, catching degradation trends before they escalate into data loss. Stevens described this deep system visibility as a key differentiator. For customers designing in the IP, Rambus offers pre-integration and pre-validation with customer-selected PHYs, supporting both 2.5D and 3D packaging configurations. The controller supports AXI and ARM-coherent interfaces and offers options for single- or dual-controller configurations, depending on latency and burst-size requirements. Optional inline memory encryption is available for multi-tenant compute environments where data isolation is a requirement. Early-access customers are designing with the IP now, and broader availability is expected later this year. The HBM roadmap continues: Stevens noted that HBM5 drafts are in circulation, with an expected focus on data integrity as densities continue to climb.