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Full-Time

Staff Engineer

Mechanical/Thermal Design

Confirmed live in the last 24 hours

Tenstorrent

Tenstorrent

201-500 employees

Develops AI/ML hardware accelerators and software

Hardware
AI & Machine Learning

Senior, Expert

Toronto, ON, Canada

US Citizenship Required

Category
Manufacturing Engineering
Thermal and Fluid Systems Engineering
Mechanical Engineering
Required Skills
Printed Circuit Board (PCB) Design
CAD
Communications
SolidWorks
Requirements
  • Bachelor's degree in Mechanical Engineering or equivalent, with 8+ years of experience in design
  • Experience designing cooling solutions and enclosures for electronics.
  • Exposure to thermal simulation tools such as IcePak (preferred), FlowTherm, or SW Flow Simulation.
  • Experience designing with vapor chambers, thermal interface materials, fans, heat pipes, pumps, heat exchangers, chillers, etc.
  • Proficiency with SolidWorks and 3DExperience are preferred. With wire harness and surfacing experience.
  • Experience with various part manufacturing processes such as injection molding, die-casting, extrusions, stamping, and 3D printing.
  • Proficient with creating part and assembly drawings. Deep knowledge of GD&T.
  • Strong problem-solving skills and an ability to think critically.
  • Excellent written and verbal communication skills.
Responsibilities
  • Design and validate complex mechanical/thermal solutions for high performance PCIe Cards and high-power multi-chip Server Systems.
  • Running and evaluated thermal simulations involving air-cooled and liquid cooled systems.
  • Validating designs with product level reliability testing
  • Designing complex parts and assemblies using 3D CAD software
  • Managing complex BOMs and part lifecycles in a PLM system
  • Collaborate with PCB engineers to ensure PCB design compatibility with enclosures, thermal systems, and other mechanical components.
  • Participate in design reviews and provide input on mechanical design considerations.
  • Document design processes and provide training to other team members as necessary.
  • Collaborating with world class suppliers, contractors, and test labs

Tenstorrent specializes in developing high-quality AI/ML accelerators, including individual PCIe cards, workstations, servers, and ultra-dense Galaxy pods, featuring industry-standard chiplets and a modular RISC-V CPU. Their products also incorporate a BUDA software framework designed for open-source collaboration, enabling efficient and scalable hardware for deep learning applications.

Company Stage

Series C

Total Funding

$334.5M

Headquarters

Toronto, Canada

Founded

2016

Growth & Insights
Headcount

6 month growth

10%

1 year growth

30%

2 year growth

116%
Simplify Jobs

Simplify's Take

What believers are saying

  • The launch of next-generation Wormhole-based developer kits and workstations could attract a significant developer community, driving innovation and adoption.
  • Collaborations with industry giants like Hyundai and Rapidus indicate strong growth potential and access to advanced manufacturing technologies.
  • The introduction of specialized AI inference acceleration boards like the Grayskull e75 and e150 can capture a niche market in AI and machine learning applications.

What critics are saying

  • The competitive landscape in AI hardware is intense, with major players like NVIDIA and Intel posing significant challenges.
  • Dependence on strategic partnerships for advanced manufacturing and technology development could lead to vulnerabilities if these partnerships falter.

What makes Tenstorrent unique

  • Tenstorrent's use of RISC-V architecture in their AI processors offers a unique alternative to traditional x86 and ARM architectures, providing flexibility and open-source benefits.
  • Their focus on high-performance AI chips and scalable developer kits positions them as a key player in the AI hardware market, particularly for developers seeking robust multi-chip solutions.
  • Strategic partnerships with global entities like Rapidus and C-DAC enhance their capabilities in cutting-edge semiconductor technology and edge AI processing.