Full-Time

Sr Staff – Product/Program Management

Semiconductor NPI, Analog/Power

Posted on 8/20/2026

Renesas Electronics

Renesas Electronics

10,001+ employees

Automotive-focused MCUs, SoCs, analog devices

No salary listed

Bengaluru, Karnataka, India

In Person

Bachelor's

Category
Business & Strategy (1)
Required Skills
SharePoint
Product Management
JIRA
Assembly
Confluence

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Requirements
  • A bachelor's degree in Electrical Engineering.
  • At least 7 years of hands-on technical program or project management experience leading cross-functional teams developing broad-market or custom power, analog, or mixed-signal products for commercial, industrial, or automotive applications, with at least 10 years of semiconductor-domain experience.
  • Solid understanding of semiconductor manufacturing, development, and management.
  • Ability to work in a team setup comprising other functional groups.
  • Strong time management skills enabling on-time project delivery.
  • Demonstrated ability to build strong, influential relationships.
  • Ability to work effectively in a fast-paced and rapidly changing environment.
  • Ability to take initiative and drive results.
  • Strong problem-solving, verbal, and written communication skills.
  • Ability to manage multiple projects and maintain project schedules.
  • Familiarity with JEDEC and AEC qualification standards.
  • Familiarity with automated test equipment tester platforms, including Teradyne and Eagle.
  • Knowledge of statistics and tools such as Spotfire to analyze characterization data, determine and set production test limits, and predict yield data.
  • Knowledge of back-end semiconductor processes such as wafer fabrication, bump, packaging, assembly, and test.
  • Experience working in a high-pressure environment with competing priorities and tight turnaround times.
  • Strong communication, presentation, and leadership skills, including the ability to lead technical discussions and summarize outcomes for executive-level status reporting.
  • Proficiency with industry-standard project management tools such as Microsoft Project, Jira, SharePoint, Design Failure Mode and Effects Analysis, root cause analysis, Confluence, and Microsoft OneNote.
Responsibilities
  • Manage the development of new industrial and automotive products and deliver all program commitments from inception through execution, tape-out, and start of production.
  • Develop and maintain project schedules, budgets, and resource allocations to ensure on-time project completion within budget constraints and quality requirements.
  • Drive cross-functional teams including design, test, product engineering, validation, marketing, systems, applications, operations, planning, factories, and vendors as program manager to meet milestones and objectives.
  • Manage several key projects in parallel or one large program.
  • Review program progress, proactively identify risks, and collaboratively develop and drive risk-mitigation efforts.
  • Collaborate with cross-functional peers and other business groups to drive collaboration and apply best practices and lessons learned using company methodologies, tools, and systems.
  • Drive execution initiatives and process improvements at the functional, cross-functional, and business-group levels.
  • Monitor and report project progress, including key performance indicators and metrics, to senior management and stakeholders.
  • Collaborate with design, applications, test, marketing, manufacturing, quality, and reliability teams across new product development and production release to accomplish goals and objectives.
  • Design bench-evaluation printed circuit boards and generate characterization programs for bench evaluations.
  • Perform integrated-circuit evaluation, debugging, and characterization to ensure compliance with product-requirement specifications and manufacturing requirements.
  • Work with failure analysis to determine the root cause of reliability and qualification failures.
  • Work with process and package technology development to develop and qualify technologies for new product development.
  • Work with global manufacturing facilities to address customer-specific product quality, yield-management, and cost-reduction issues on mature products, including product spins and derivatives.
Desired Qualifications
  • Knowledge of back-end semiconductor processes such as wafer fabrication, bump, packaging, assembly, and test is an asset.

Renesas Electronics designs and manufactures semiconductor components, including microcontrollers, system-on-a-chip solutions, and analog and power devices for automotive, industrial, infrastructure, and IoT markets. Its chips serve as building blocks inside customers’ electronic products, and it offers Winning Combinations—pre-tested system architectures that combine Renesas parts with technologies from its acquisitions to speed development. The company differentiates itself through a broad, integrated portfolio built via acquisitions and a planned unified digital design platform that streamlines integration with hardware and software. Its goal is to be a leading supplier of MCUs, SoCs, and analog/power devices while providing a single, connected design ecosystem that shortens customers’ development cycles.

Company Size

10,001+

Company Stage

IPO

Headquarters

Tokyo, Japan

Founded

2002

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Simplify Jobs

Simplify's Take

What believers are saying

  • TIER IV chose R-Car Gen 5 on August 20, 2026 for autonomous driving.
  • Gen 3 MRDIMM samples shipped in 2026, targeting 16,000 MT/s AI datacenter demand.
  • Irida Labs and Pictorus acquisitions in 2026 deepen Renesas' edge-AI software stack.

What critics are saying

  • Navitas sued Renesas on August 10, 2026, threatening GaN product margins and shipments.
  • Takasaki's 6-inch line closes within two to three years, disrupting analog supply continuity.
  • SiTime's timing-business acquisition removes a cash-generating segment, shrinking Renesas' diversification and leverage.

What makes Renesas Electronics unique

  • Renesas leads automotive MCUs with R-Car Gen 5 and RH850 platform depth.
  • Renesas 365 unifies embedded hardware, cloud modeling, and lifecycle software after Pictorus.
  • Winning Combinations bundle semiconductors, software, and reference designs for faster automaker integration.

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Benefits

Health Insurance

Life Insurance

Mental Health Support

Professional Development Budget

Meal Benefits

Growth & Insights and Company News

Headcount

6 month growth

-22%

1 year growth

-30%

2 year growth

-30%
PR Newswire
Aug 20th, 2026
TIER IV partners with Renesas to build open AI computing platform for autonomous vehicles

TIER IV is collaborating with Renesas Electronics to build an open AI-native computing platform for software-defined vehicles. The partnership combines TIER IV's Autoware autonomous driving software and reference AI models with Renesas' R-Car Gen 5 automotive system-on-chips. The collaboration aims to deliver scalable solutions spanning Level 2+ advanced driver assistance through Level 4 autonomous driving. TIER IV will port and optimise Autoware on R-Car Gen 5 SoCs and deploy its end-to-end autonomous driving AI models on the platform. The companies will jointly promote this integrated hardware and software platform to automakers and Tier 1 suppliers worldwide. TIER IV plans to demonstrate Autoware and its reference AI models running on Renesas' R-Car X5H at Automotive World 2026 in September at Makuhari Messe near Tokyo.

Bloomberg
Aug 11th, 2026
SiTime CEO credits AI data centers for triple-digit revenue growth ahead of Renesas deal

SiTime reported triple-digit year-over-year revenue growth, driven largely by AI demand and the expanding data centre market, according to Chairman and CEO Rajesh Vashist. The company's timing synchronisation technology is critical for data centre components including TPUs, GPUs, switches, accelerator cards, optical modules, and cables. Vashist explained that the technology ensures high performance and cost efficiency across these systems. He discussed the company's growth trajectory and market position during an interview on Bloomberg's "The Close" programme.

Yahoo Finance
Aug 11th, 2026
Renesas targets 29-day recovery after quake halts chip factory, six days faster than 2016

Renesas Electronics has nearly returned to its pre-earthquake stock level following a magnitude 7.1 quake that struck its Kumamoto facility on 28 July. The Japanese chipmaker halted production at the Kawashiri plant after the tremor caused wall cracks and water supply disruption. The company scheduled a phased restart from 5 August, targeting full wafer-input capacity within approximately three weeks. This marks a faster recovery than the 2016 earthquake at the same plant, which affected 35% of wafers and cost an estimated ¥14 billion in sales. Renesas shares fell initially but jumped 13.45% on 3 August after strong second-quarter results showed non-GAAP revenue rising 24.9% year-on-year. The stock closed at ¥3,825 on 10 August, just 1.1% below pre-quake levels.

Yahoo Finance
Jul 31st, 2026
Renesas to close Takasaki factory's 6-inch wafer production within three years

Renesas Electronics will phase out production at its Takasaki Factory in Japan within two to three years due to challenges with its 6-inch wafer line. The semiconductor manufacturer cited aging equipment, deteriorating utility facilities, and discontinued support for production materials as key factors behind the decision. The company plans to maintain and strengthen research and development functions at the site, focusing on analogue ICs and power semiconductors for data centres and automotive applications. Renesas will build inventory to ensure stable supply for customers during the transition. The firm committed to supporting affected employees through reassignment, career support, and other employment opportunities. Specific timing and details of the closure have not been finalised.

Associated Press
Jul 30th, 2026
Renesas launches Gen 3 MRDIMM chipset with 16,000 MT/s DDR5 speeds for AI datacentres

Renesas Electronics announced its third-generation DDR5 MRDIMM chipset solutions, delivering speeds up to 16,000 mega transfers per second for AI data centres and cloud infrastructure. The Gen 3 solutions provide 25% higher memory bandwidth than the previous generation whilst maintaining compatibility with existing DDR5 infrastructure. The chipset includes Multiplexed Registering Clock Driver and Multiplexed Data Buffer devices, designed to address growing memory bandwidth demands from AI workloads. Renesas offers a complete platform spanning MRCD, MDB, power management ICs, SPD hubs, and temperature sensors. The Gen 3 MRCD and MDB are currently sampling to select customers, including major DRAM suppliers. Production availability is expected in the second half of 2027. Renesas will showcase the solutions at FMS 2026 in Santa Clara, California, from 4-6 August.

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