Keiron Printing Technologies, based in Eindhoven, Netherlands, has closed a €20.7 million Series A funding round. The company aims to solve solder paste printing issues, which cause over 70% of defects in the €600 billion global electronics assembly market. The round was co-led by Invest-NL, DeepTechXL and Waves Capital, with participation from Ramphastos Investments, ATUM Ventures, Cottonwood Technology Fund and TNO Ventures. Keiron's HF2 LiFT printer replaces traditional stencil printers, jet printers and inspection systems with a single digital, non-contact platform. The technology increases first-pass yield from approximately 60% to above 95%, doubles production uptime, and accelerates programming by 10 times. The solution particularly addresses challenges in next-generation AI hardware, where components with up to 10,000 interconnects exceed conventional printing capabilities.

Eindhoven-based deeptech company Keiron Printing Technologies has raised €20.7 million in Series A funding to scale its digital assembly technology for printed circuit boards. Invest-NL invested €6.9 million and acts as lead investor alongside DeepTechXL and Waves Capital. Ramphastos, TNO Ventures, ATUM Ventures, and Cottonwood also participated. Keiron developed a digital production method for applying solder paste to circuit boards, replacing traditional metal stencils. The technology enables direct, precise application without physical tooling. The funding will support customer validation, production scale-up of initial systems, and development of an international service organisation. The company previously received innovation credit from RVO. Keiron's technology addresses growing demand for flexible production as electronics manufacturing shifts towards smaller batches, more complex designs, and sustainable processes for Europe's high-tech industry.