BBachmann Chemical and Engineering provides eco-friendly light-curable solutions, including Dymax materials, dispensing equipment, and UV/LED curing systems that are designed to work together as an integrated system for manufacturing. The products cure when exposed to UV or LED light, and the materials and equipment are matched to optimize performance in production lines. The company supports customers with product and process design, testing, initial production runs, system integration, and ongoing service for the life of the process. It serves sectors such as aerospace and defense, energy, medical devices, and electronics. The goal is to help engineers improve manufacturing efficiency and reliability by offering a coordinated, end-to-end light-curing solution.
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Dymax has launched 9208-W and 9209-W, two light-curable materials for consumer wearable device assembly. The products are designed to protect electronics in smartwatches, fitness trackers, and AR/VR headsets. Both formulations combine UV/visible light curing with secondary moisture cure to reach shadowed areas beneath PCB components. They are LED curable and bond to standard electronics substrates. The 9208-W is an electronic coating providing protection from moisture, humidity, corrosion, and thermal stress. It bonds to flexible circuit boards and fluoresces blue for quality control. The 9209-W is a reworkable encapsulant enabling component repair or replacement after assembly errors. The IBOA-free formulation protects chips and wire bonds whilst being suitable for skin-proximity applications. Dymax manufactures light-curable materials and curing systems for medical device, electronics, aerospace, automotive, and industrial sectors.
Dymax expands light-curable product portfolio for consumer wearable assembly. September 30, 2026 - Introduces two dual-curable, wearable-friendly formulations: 9208-W electronic coating and 9209-W reworkable encapsulant for printed circuit board applications. SINGAPORE, Sept. 30, 2026 /PRNewswire/ - Dymax, a global manufacturer of light-curing adhesives and equipment, launches 9208-W and 9209-W, the newest additions to its 9200-Series product line. The materials are designed to protect board-level electronics found in consumer wearable devices such as smart watches, fitness trackers, and AR/VR headsets. Both 9208-W and 9209-W combine UV/visible light curing with secondary moisture cure to support cure in shadowed areas commonly found beneath PCB components and within complex part geometries. The materials are LED curable at specific wavelengths, bond to typical electronics substrates, and offer selective protection from environmental exposure that can affect long-term device reliability. Dymax 9208-W is a wearable-friendly electronic coating that provides a durable barrier from moisture, humidity, corrosion, and thermal stress. The product bonds well to flexible circuit boards to accommodate the repeated bending encountered during everyday device use, and features room-temperature stability to support simplified handling and storage. It also fluoresces blue to facilitate inspection and quality control processes. Dymax 9209-W is a reworkable encapsulant that helps reduce scrap by enabling repair or replacement of components on printed circuit boards following assembly errors or failed inspections. It protects chips, wire bonds, and sensitive electronics where moisture, thermal, and impact resistance are critical. The IBOA-free formulation is designed for applications with close proximity to the skin. "Manufacturers need products that help protect increasingly sophisticated electronic assemblies without adding complexity to the production process," said Doug Katze, Senior Electronics Business Development Manager at Dymax. "9208-W and 9209-W were developed to address real-world assembly challenges, from achieving cure in shadowed areas to protecting sensitive electronics and supporting component repair when needed." Together, they expand the options available to manufacturers assembling next-generation wearable devices." Dymax adds 9208-W coating and 9209-W encapsulant to its line of consumer wearable assembly products. Dymax is a global manufacturer and innovator of light-curable materials, dispensing equipment, and UV/LED light-curing systems. The company's solutions help manufacturers improve process efficiency, enhance product performance, and accelerate production. Major markets served include the medical device, electronics, aerospace and defense, automotive, and industrial sectors. For additional information on Dymax, visit www.dymax.com or call us at +65 6752 2887.
Dymax launches BlueWave(R) FX Line Emitters to boost throughput in high-speed linear UV/Visible curing. - New 75 mm and 150 mm line emitters deliver up to 4.2 W/cm[2] with 365/385/405 nm options and FX controller compatibility for scalable automation. SINGAPORE, Sept. 10, 2026 /PRNewswire/ - Dymax, a global manufacturer of light-curing materials and equipment, today announced the BlueWave(R) FX Line Emitter series, purpose-built to deliver fast, uniform linear UV/Visible exposure in automated production environments. Designed for high-speed manufacturing, the new emitters help teams improve process consistency and throughput by delivering a uniform, high-intensity UV/Visible curing profile along a defined line. They're well suited for bonding, printing, and coating applications where a high dose of uniform UV/Visible exposure is critical. Key Features: * Up to 4.2 W/cm[2] intensity at a 25-mm working distance for fast curing * 75-mm and 150-mm lengths with a 25-mm curing width to fit common line configurations * 365 nm, 385 nm and 405 nm wavelength options to match material and process needs * The emitters are low noise, offer good uniformity, and feature global regulatory marks * When integrated with Dymax FX series controllers, FX Line Emitters support scalable, automated integration while providing dual-channel control, flexible wavelength configuration, and an intuitive 7-inch touchscreen interface. "Manufacturers are under constant pressure to cure faster without sacrificing uniformity," said Jason Tomei, Dymax Global Equipment Product Manager. "BlueWave(R) FX Line Emitters are engineered to deliver the high-intensity, line-shaped exposure needed to keep automated lines moving - while giving integrators flexible wavelength and controller options." The emitters support both adhesive and non-adhesive curing processes. Typical applications include medical device assembly (such as needle bonding and catheter tubing) as well as ink printing, lacquers, paints, and other UV-curable coatings. The systems are CE and UKCA marked to support global deployment. BlueWave(R) FX Line Emitters are available now; contact Dymax to discuss your application and integration requirements. Dymax develops innovative rapid and light-curable materials, dispensing equipment, and UV/LED light-curing systems. The company's adhesives, coatings, and equipment are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiencies. Major markets include aerospace and defense; medical device; and consumer and automotive electronics. For additional information on Dymax, visit www.dymax.com or call BambuUP at +65 6752 2887. SOURCE Dymax
Dymax launches 9310 adhesive for high-reliability PCB reinforcement. - Fast light curing, reflow durability, and controlled edge bonding for reliable PCB reinforcement in advanced electronic assemblies. SINGAPORE, July 31, 2026 /PRNewswire/ - Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards. Designed for advanced electronics and AI hardware, 9310 cures in seconds with light, delivering a fast, streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies. Dymax 9310 maintains adhesion through high-temperature reflow. It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments. The adhesive's high viscosity and thixotropic profile enable precise edge bonding without unwanted flow. This improves placement control and overall process consistency. The material is also reworkable at relatively low temperatures, supporting greater manufacturing flexibility. "9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill," said Doug Katze, Senior Electronics Business Development Manager for Dymax. Dymax develops innovative rapid and light-curable materials, dispensing equipment, and UV/LED light-curing systems. The company's adhesives, coatings, and equipment are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiencies. Major markets include aerospace and defense; medical device; and consumer and automotive electronics. For additional information on Dymax, visit www.dymax.com or call Daily Bulletin at +65 6752 2887. SOURCE Dymax
Dymax launches 9310 adhesive for high-reliability PCB reinforcement. Fast light curing, reflow durability, and controlled edge bonding for reliable PCB reinforcement in advanced electronic assemblies. Torrington, CT - July 30, 2026... Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards. Designed for advanced electronics and AI hardware, 9310 cures in seconds with light, delivering a fast, streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies. Dymax 9310 maintains adhesion through high-temperature reflow. It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments. The adhesive's high viscosity and thixotropic profile enable precise edge bonding without unwanted flow. This improves placement control and overall process consistency. The material is also reworkable at relatively low temperatures, supporting greater manufacturing flexibility. "9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill," said Doug Katze, Senior Electronics Business Development Manager for Dymax. Get in touch. Interested in learning more or have questions? Dymax want to hear from you. Back to top
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Industries
Company Size
201-500
Company Stage
N/A
Total Funding
N/A
Headquarters
null
Founded
1980
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