Baya Systems and Kandou AI partner to tackle AI Memory Wall. July 14, 2026 Press play to listen to this content Baya's WeaveIP fabric and WeaverPro software accelerating architecture development for Kandou's 448G copper AI connectivity platform SANTA CLARA, Calif. and SAINT-SULPICE, Switzerland, July 14, 2026 - Baya Systems, a leader in software-defined fabric IP for AI and high-performance computing, and Kandou AI, a pioneer in high-speed connectivity for AI infrastructure, today announced a strategic IP licensing agreement. Kandou AI has licensed Baya's WeaveIP fabric and WeaverPro software platform and is actively deploying both across its architecture and development workflow for the next generation of its connectivity platforms to overcome the memory wall constraining further AI development. The collaboration also demonstrates how software-defined fabric architecture and advanced connectivity work together to address the data movement bottleneck limiting next-generation AI systems. Attacking the Memory Wall AI model growth has outpaced memory bandwidth by orders of magnitude. While compute has scaled 60,000x over two decades, interconnect has managed just 30x. This clear mismatch is stymieing further AI development, since data simply can't move at the speeds compute requires. Kandou AI's patented Copper MIMO technology (aka Chord Signaling) is closing that gap by sending correlated signals at real-time data processing speeds of 448 Gbps and beyond, providing the industry with strong alternatives to optical interconnects for a broad class of AI infrastructure applications. By using Copper Multiple Input Multiple Output (MIMO) technology, Kandou can deliver 10X the efficiency of conventional alternatives at reduced power, costs and greater scalability. The economic impact is direct: faster, denser, cheaper AI systems. While Kandou advances the physical layer of AI connectivity, Baya's software defined fabric platform optimizes data movement for complex heterogeneous compute, memory, I/O on die and across multiple chiplets. Together, the technologies enable customers to architect AI systems that are not only faster, but also easier to design, validate, and scale. "Solving the memory wall is a system-level challenge. Our breakthrough signaling technology is only one part of a broader AI system. We need a fabric architecture that can move data with the precision and efficiency our products demand," said Srujan Linga, Co-Founder and CEO of Kandou AI. "Baya's WeaveIP complements our interconnect technology. We provide physical scalability, with WeaveIP providing logical scalability to system design. Users are seeing in practice that WeaverPro significantly accelerates development timeline". Software-Driven Architecture, Faster to Silicon Kandou AI selected WeaverPro to assist the exploration and validation of on-chip interconnect configurations, such as traffic class partitioning, QoS policy and protocol adaptation, before reaching the critical Register-Transfer Level phase of design and development. Because Baya's tiled implementation methodology assembles verified fabric primitives into a configurable architecture, Kandou AI anticipates significant acceleration of development cycles and time to market. "The tiled implementation approach is a genuine competitive advantage for teams working at our pace," Linga continued. "Baya's technical expertise and collaborative engagement has made them a true extension of our own engineering organization." A Partnership Built on Technical Alignment The engagement reflects a broader convergence: both companies are building for an AI infrastructure landscape where data movement, which gates the scaling of compute, is the chief challenge to be solved. It accelerates the trend in the semiconductor industry towards modular AI architectures, where innovation depends on combining best in class connectivity, compute, memory and system fabrics. "Kandou AI represents exactly the kind of customer Baya was designed to serve," said Dr. Sailesh Kumar, Founder and CEO of Baya Systems. "They are attacking a real and fundamental problem, and they need a fabric platform that pushes beyond the data movement limitations of traditional NoC and enables them to realize their ambition. WeaveIP and WeaverPro offer the architectural freedom and implementation velocity to achieve that without compromise." The engagement further validates Baya's growing role as the architectural foundation for next-generation AI infrastructure. As customers increasingly adopt chiplets, heterogeneous compute, and custom AI accelerators, software-defined fabrics are becoming a critical layer for optimizing data movement across the entire system. About Kandou AI Kandou AI is pioneering the next generation of connectivity for AI infrastructure. Its innovative Copper MIMO (aka Chord Signaling) technology - developed over more than a decade and rooted in information theory - enables high-speed, energy-efficient copper-based interconnects that extend performance beyond what conventional SerDes can achieve. Kandou AI is backed by leading technology investors including Maverick Silicon, BVP, Capital Group, SoftBank, Synopsys, Cadence and Alchip. About Baya Systems Baya Systems is a Series B semiconductor IP company pioneering software-defined, chiplet-ready fabric technology for AI, HPC, automotive and edge applications. Its WeaveIP fabric and WeaverPro software platform deliver a unified, protocol-agnostic interconnect solution purpose-built for the demands of next-generation AI systems. Headquartered in Santa Clara, California, Baya Systems is backed by leading technology investors and has been recognized by Frost & Sullivan for Technology Innovation Leadership in Semiconductor IP Interconnect Solutions. Scientists have relied on HPC facilities to help them process large volumes of data, execute... Raw performance has long been the benchmark for success in HPC. However, as AI and... It's easy to get bogged down micromanaging HPC infrastructure. But focus too much on one... The buzz of Hamburg, Germany over the past two days has been LineShine, the Chinese... 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SoftBank, Synopsys join $225m funding round in Kandou AI. Kandou AI, a fabless semiconductor company building high-speed connectivity chips and IP for data centers and AI systems, said it closed a US$225 million strategic funding round, described as an oversubscribed series A, led by Maverick Silicon with participation from SoftBank Group Corp., Synopsys, Cadence Design Systems, and Alchip Technologies. The company, which is headquartered in Saint-Sulpice, Switzerland, said it will use the money to ramp manufacturing, deepen work with hyperscalers and other AI infrastructure customers, and fund new versions of its SerDes and related interconnect products. Kandou AI also said it recently taped out a next-generation SerDes design, saw increased momentum in its retimer businesses, and opened a design center in Hyderabad, India. Food for thought. Implications, context, and why it matters. This is not a typical Series A round. * Calling this a "Series A" looks odd. Kandou AI is past that stage and previously raised a $92.3 million Series C, taking total funding then to $132.8 million 1. * The technology has been in use for years. Glasswing SerDes (serializer/deserializer) IP reached test silicon in 2017 2. * Commercial use is already in place. Coherent Logix picked Kandou AI's SerDes IP for its processors 1. * The lineup goes beyond SerDes. It includes the Regli retimer for PCIe (Peripheral Component Interconnect Express) 5.0 and CXL (Compute Express Link) 2.0 plus DIMMGuard memory error correction IP 3. The funding backs chiplet-based AI systems. * Synopsys and Cadence Design Systems joined the strategic round. Their involvement puts Kandou AI's interconnect work closer to the center of future AI hardware design 3. * Glasswing SerDes targets die-to-die links inside a shared multi-chip module (MCM) package. Multiple dies must exchange data with low delay to act as one system 2. * Other teams are moving the same direction. Ayar Labs, a startup building optical interconnects for AI and data-center systems, announced what it called the industry's first UCIe (Universal Chiplet Interconnect Express) optical interconnect chiplet to ease bottlenecks in AI scale-up architectures 4. * Support for interconnect specialists rests on a clear wager. High-bandwidth electrical links, and sometimes optical I/O meaning optical input/output links, can help assemble large heterogeneous accelerator packages 4. How would you feel if you could no longer use Tech in Asia? Share, tag us, and land on our Wall of!

$225 million for Kandou AI to power the next era of AI connectivity. 23.03.2026 15:45 Rita Longobardi Kandou AI, a Venture Kick alumnus, ranked among the Top 100 Swiss Startups and a leader in high-speed, energy-efficient connectivity for AI infrastructure, announced today the closing of a $225 million strategic funding round, showing strong confidence in its approach to solving critical data movement challenges. As AI models grow larger and more complex, memory and interconnect bandwidth have become the main constraints in high-performance computing. Traditional networking and interconnect technologies, designed for a pre-AI era, are increasingly unable to keep up. Kandou AI, a Venture Kick alumnus and ranked among the Top100 Swiss Startups for several years in a row, has developed patented silicon and signaling technologies engineered to overcome these bottlenecks, delivering higher bandwidth, longer reach, and improved energy efficiency compared with traditional copper interconnects. "Venture Kick was instrumental in the early days. It gave us not only the funding to move from simulation to first silicon, but also the structure and visibility to refine our business case." Amin Shokrollahi, Co-Founder and CEO of Kandou AI The $225 million funding will allow Kandou AI to scale production of its high-performance connectivity chips, expand partnerships with hyperscale and AI infrastructure customers, and accelerate the development of its next-generation chip and IP portfolio to enable multi-terabit connectivity. The company has recently achieved key milestones, including the tapeout of its next-generation SerDes technology, growth in its retimer business, the opening of a new design center in Hyderabad, India, and the addition of industry veterans to its leadership team. By rethinking how data moves across copper interconnects, Kandou AI is enabling more efficient, cost-effective AI systems, supporting broader adoption of AI infrastructure worldwide. "The staged support of Venture Kick forced us to focus on milestones, sharpen our story, and engage with a network of mentors and investors. That combination, capital plus guidance, helped transform a research idea into a company ready to compete in the semiconductor industry," highlighted Amin. Kandou: COO Taher Madraswala, CEO and co-founder Srujan Linga, and CTO and co-founder Amin Shokrollahi Get in touch. You have questions about Top100 or would like to exchange ideas with TOP 100 Startups? Feel free to contact me.