
Work Here?
Lumentum makes photonic components such as diode lasers and optical modules for data networks, data centers, sensing, and manufacturing. These devices turn electrical signals into light to enable high-speed data transmission and 3D sensing, or to power optical communications in networks and devices. It differentiates itself with a broad, high-volume photonics platform that includes silicon photonics and laser diodes for 3D sensing, designed for scalable, reliable supply to tech ecosystems. Its goal is to improve the speed, flexibility, and efficiency of communication networks and sensing systems to handle growing data traffic.
Industries
Hardware
Industrial & Manufacturing
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
San Jose, California
Founded
2015
See people who can refer or advise you
Help us improve and share your feedback! Did you find this helpful?
Total Funding
$6.1B
Above
Industry Average
Funded Over
8 Rounds
Wellness Program
Flexible Work Hours
Mentorship Program
Professional Development Budget
Lumentum Holdings announced a joint demonstration with Qualcomm Technologies and Corning at ECOC 2026 in Málaga, Spain. The companies will showcase a high-density optical die-to-die system designed for AI scale-up systems, combining Qualcomm's chip-to-chip interface technology, Lumentum's 1060-nanometre VCSEL lasers, and Corning's high-density fibre connections. The demonstration uses 32-gigabit-per-second optical channels and can move about 1 terabit of data per second per millimetre of chip edge. The companies say the design could eventually reach 4 Tb/s/mm. Lumentum shares rose 2.4% in premarket trading after the announcement. Lumentum stock has gained 155% this year, driven by growing demand for optical components in AI data centres. The company reported fiscal Q4 2026 revenue of $1.006 billion, up 109.3% year-over-year.
ECOC: Lumentum Brings 8-Wavelength DWDM ELSFP to OCI. Lumentum is demonstrating an eight-wavelength DWDM ELSFP external laser source aligned with OCI MSA requirements for emerging CPO and NPO AI Scale Up architectures, with initial availability targeted for the first half of 2027. Lumentum is demonstrating an eight-wavelength DWDM External Laser Small Form Factor Pluggable (ELSFP) module at ECOC 2026 in Málaga, extending its high-power laser portfolio toward the emerging Optical Compute Interconnect (OCI) architecture for AI Scale Up networks. The module provides the external optical source for co-packaged optics (CPO) and near-packaged optics (NPO), separating the laser from the high-temperature environment surrounding switch and accelerator silicon while retaining a pluggable, field-serviceable light source. Initial availability of the new DWDM ELSFP with an OCI MSA optical interface is expected in the first half of 2027. The module generates eight simultaneous wavelengths divided between two four-channel bands centered near 1311 nm and 1331 nm. Lumentum specifies wavelength accuracy of +/-0.2 nm and demonstrates optical output of up to 24 dBm, approximately 250 mW, per wavelength at the fiber. All eight channels operate simultaneously from one pluggable module consuming approximately 12 W. The design uses Lumentum's Ultra High Power (UHP) laser platform, which is already in production, configured here as an eight-channel source. The wavelength arrangement is significant because the OCI 200G Optical PHY specification defines eight external-laser wavelengths split into two four-wavelength groups spanning approximately 1308-1315 nm and 1328-1335 nm. The external-laser architecture addresses several physical constraints that become more important as optics moves closer to AI accelerators and switching ASICs. Removing the laser from the optical engine provides thermal isolation from high-power compute silicon and makes the light source independently replaceable without requiring replacement of the CPO or NPO assembly. Using multiple DWDM wavelengths from a single ELSFP also increases optical bandwidth density while reducing the number of laser modules and associated fiber routing required around densely packaged compute and switching systems. Lumentum will demonstrate the module at stand #2050 during ECOC 2026, September 21-23. | Lumentum DWDM ELSFP - Key Specifications | | Architecture | DWDM ELSFP external laser source for CPO/NPO | | Wavelengths | 8 simultaneous DWDM wavelengths | | Bands | Two four-channel groups centered near 1311 nm and 1331 nm | | Accuracy | +/-0.2 nm | | Output | Up to 24 dBm (~250 mW) per wavelength at the fiber | | Module Power | Approximately 12 W | | Laser Platform | Lumentum Ultra High Power (UHP) | | Interface | Designed for applicable OCI MSA requirements | | Availability | Initial availability targeted for 1H 2027 | "CPO and NPO are becoming defining architectures for AI scale-up, and external laser sources are a critical building block of that shift," said Sri Venkat, Senior Vice President and General Manager of Components at Lumentum. "This demonstration shows our progress toward a standards-based DWDM ELSFP module, positioning Lumentum to serve customers as the CPO/NPO market scales." Analysis. The eight-channel implementation represents a more specific step toward OCI than Lumentum's earlier CPO-ready ELSFP demonstrations. At ECOC 2025, the company demonstrated ELSFP modules based on ultra-high-power 1310 nm lasers. At OFC 2026, it showed a 16-channel DWDM UHP architecture using two ELSFP modules. The ECOC 2026 implementation packages eight wavelengths into one ELSFP and aligns its optical interface with the OCI MSA architecture. OCI makes the external laser source part of its optical Scale Up model rather than leaving the light-source architecture entirely vendor-specific. Its 200G Optical PHY specification calls for an external laser source using the OIF ELSFP implementation and defines two groups of four wavelengths. This creates an important distinction between interface standardization and implementation: the OCI wavelength and optical interface can be standardized while laser design, output power, packaging, reliability engineering and manufacturing remain areas for supplier differentiation. The timing also fits Lumentum's broader AI optical roadmap. The company said in August that it expects NPO deployments to begin around late 2027 and views 2028 as an important transition period for optical Scale Up. Lumentum has also reported an initial external-laser-source order for CPO and is expanding UHP laser manufacturing capacity. The new ELSFP is therefore positioned between current demonstrations and the larger CPO/NPO deployments Lumentum expects around the next generation of accelerator and SerDes platforms. At ECOC, Lumentum is also showing its R300 optical circuit switch and a Scale Across networking display. Together, these illustrate the widening range of optical technologies being positioned for AI infrastructure: ELSFP sources and CPO/NPO move optics toward the accelerator and switch ASIC for Scale Up, while OCS and coherent technologies address connectivity across larger clusters and distributed AI data centers. | Profile: Lumentum | | NASDAQ: LITE | | Lumentum develops optical and photonic technologies for AI and cloud data centers, telecommunications networks, industrial applications and sensing. Its portfolio includes high-power and continuous-wave lasers, optical transceivers, coherent optical components, wavelength-management products and optical circuit switching. | | Headquarters | San Jose, California, USA | | President & CEO | Michael Hurlston | | Established | 2015, following spin-off from JDS Uniphase | | Markets | AI Infrastructure - Cloud/Data Centers - Optical Networking - Telecom - Industrial Photonics | | Related Converge Digest Coverage | | August 11, 2026 · AI Infrastructure Lumentum: AI Scale-Up Drives Optics Deeper Into the Data Center Lumentum outlines its 200G/lane, 1.6T, NPO, CPO and OCS roadmap. | | March 26, 2026 · Optical Lumentum to Build North Carolina Fab for InP Lasers The planned Greensboro facility expands U.S. capacity for CW and ultra-high-power InP lasers. | | March 18, 2026 · Optical Lumentum Showcases 1060nm VCSEL Optical Scale-Up Demo A complementary optical Scale Up approach targeting short-reach accelerator connectivity. | | March 17, 2026 · Optical Marvell and Lumentum Demo Optical Circuit Switching Rack-scale OCS demonstration for AI clusters. | | September 29, 2025 · ECOC25 ECOC25: Lumentum Brings CPO-Ready ELSFP and Ultra-Wide Tunable Lasers The direct predecessor to the new OCI-oriented DWDM module. | Converge Digest is tracking the latest developments from ECOC 2026 in Málaga, including 1.6T optics, CPO/NPO, external laser sources, 448G electrical interfaces, coherent networking and the technologies shaping next-generation AI infrastructure. Help others discover this reporting. Editorial responsibility Jim Carroll. Editor & Publisher Every article published by Converge Digest is researched, curated, fact-checked and editorially reviewed by Jim Carroll, Editor & Publisher. AI-assisted drafting may be used to accelerate production, but all content is reviewed, refined and approved prior to publication. From the Frontier You just read about Keysight Technologies. They held this record once. 448 Gb/s per optical lane (224 GBd PAM4) Keysight Technologies; NTT Innovative Devices; Lumentum · April 2025 Generated on a Keysight M8199B AWG and captured on an N1032A DCA-X; bench instrumentation, not a power-realistic DSP. Instrumented Lab Demo On this day. September 21 From 25 years of the Converge Digest archive.
ECOC: Lumentum, Qualcomm and Corning push optical D2D. Lumentum, Qualcomm Technologies and Corning demonstrate a high-density 1060 nm VCSEL optical D2D architecture at ECOC 2026, targeting AI scale-up connectivity over tens of meters. Lumentum, Qualcomm Technologies and Corning are demonstrating a high-density optical die-to-die (D2D) interconnect at ECOC 2026 that extends chip-level connectivity over multimode fiber for distances of tens of meters. The board-level proof of concept combines Qualcomm Technologies' D2D interface IP subsystem, Lumentum's 1060 nm VCSEL optical engine and Corning's high-density multimode fiber connectivity. The proof of concept uses massively parallel optical channels operating at 32 Gbps NRZ. The companies say the architecture supports approximately 1 Tbps/mm of shoreline bandwidth density today, with a path toward approximately 4 Tbps/mm. Lumentum's optical engine provides approximately 10 Tbps of aggregate transmit and receive capacity. | - 1060 nm VCSEL optical engine - 32 Gbps NRZ channels - ~10 Tbps aggregate Tx/Rx - ~1 Tbps/mm today; path toward ~4 Tbps/mm - Tens-of-meters multimode reach - Target: AI Scale-Up, UCIe, NPO and CPO | Analysis. The ECOC demonstration evolves Lumentum's earlier 1060 nm VCSEL work by adding Qualcomm Technologies' D2D interface technology and Corning's physical fiber connectivity. The massively parallel architecture shifts engineering emphasis toward VCSEL-array density, photodetector density, optical packaging and fiber connectivity. The demonstration is a proof of concept rather than a production product announcement. The companies have not disclosed a commercialization schedule for the joint architecture. Help others discover this reporting. Editorial responsibility Jim Carroll. Editor & Publisher Every article published by Converge Digest is researched, curated, fact-checked and editorially reviewed by Jim Carroll, Editor & Publisher. AI-assisted drafting may be used to accelerate production, but all content is reviewed, refined and approved prior to publication. Builders & Visionaries The people who opened the doors to the networks Converge Digest run today. Which of these co-founded Qualcomm? On this day. September 21 From 25 years of the Converge Digest archive.
Lumentum Holdings has surged 452% over the past year, positioning itself as a potential major winner in the AI infrastructure boom. The company manufactures optical networking and photonic products essential for high-speed networking in AI data centres. Demand for Lumentum's products has outpaced supply, driving its non-GAAP operating margin to 29.8% in fiscal 2026, triple the previous year. Non-GAAP earnings per share increased more than fourfold to $8.67. Goldman Sachs projects the optical networking market will grow from $15 billion in 2026 to $154 billion in 2028. This growth is driven by fast networking requirements for AI data centres. Forbes reports hyperscalers and AI companies hold over $3 trillion in purchase commitments. PwC estimates AI data centre investments could rise from $800 billion annually in 2026 to $1.8 trillion by 2050.
LITE, QCOM, GLW Team Up for AI Optical D2D Breakthrough at ECOC 2026. Lumentum Holdings (NASDAQ: LITE) said Monday it will team up with Qualcomm Technologies (NASDAQ: QCOM) and Corning Incorporated (NYSE: GLW) to demonstrate a high-density die-to-die ("D2D") optical interconnect aimed at AI scale-up architectures at ECOC 2026 in Málaga, Spain. The board-level demonstration will combine Qualcomm's D2D interface IP subsystem with Lumentum's VCSEL-based optical interconnect platform and Corning's multimode fiber connectivity. Attendees can see the showcase at Lumentum's booth #2050 and Qualcomm's booth #1050/MB28. In a joint statement, the companies said the demo will feature a massively parallel optical D2D architecture designed for future co-packaged optics ("CPO") and near-packaged optics ("NPO") implementations, supporting emerging D2D interfaces such as UCIe. By extending high-density D2D connectivity over optical links spanning tens of meters - while maintaining low latency and power consumption - the architecture aims to deliver highly scalable bandwidth density as AI systems push interconnect requirements beyond the practical limits of today's electrical connectivity. On the technical front, the proof-of-concept configuration uses optical channels operating at 32 Gb/s NRZ, illustrating how the massively parallel design can scale through higher channel counts and increasing per-lane data rates. The architecture is engineered to support roughly 1 Tb/s/mm of shoreline bandwidth density today, with a line of sight to approximately 4 Tb/s/mm through higher lane rates and denser channels. Lumentum's optical engine is built on advanced-packaged 1060 nm VCSEL technology, with approximately 10 Tb/s of aggregate transmit and receive capacity and high-density two-dimensional VCSEL and photodetector arrays featuring backside lens technology. The platform leverages Lumentum's ultra-high-volume 3D sensing manufacturing base and is designed for board-level and system-level AI scale-up architectures. Corning is contributing multimode fiber glass ferrules to provide the high-density fiber connectivity used in the demonstration, underscoring the growing importance of fiber density as optical links move closer to compute devices and advanced packaging environments. Shares of Corning rose 3% in premarket trading, Lumentum gained 2.4%, and Qualcomm added 1.3%. "This demonstration shows how Lumentum's 1060 nm VCSEL platform can bring high-density optical connectivity closer to AI compute," said Matt Sysak, Chief Technology Officer of Lumentum. "By combining advanced VCSEL packaging with Qualcomm Technologies' D2D interface technology and Corning's fiber connectivity, we are showing a practical path toward compact, energy-efficient optical D2D links for next-generation AI scale-up architectures." "AI scale-up requires die-to-die connectivity that delivers high bandwidth density while minimizing latency, power, and area," said Tony Chan Carusone, SVP of Technology at Qualcomm Technologies. "This collaboration shows how Qualcomm Technologies' D2D interface technology can extend those capabilities into optical links for future AI system architectures." "As optical links move closer to compute devices, fiber connectivity must support increasing density, precision, and scalability," said Claude Echahamian, Vice President and General Manager of Emerging Businesses and EMEA at Corning Optical Communications. "Corning's multimode fiber solutions and industry-leading MMC connectivity help enable this demonstration and support the evolution of high-density optical interconnects for AI infrastructure."
Find jobs on Simplify and start your career today
Industries
Hardware
Industrial & Manufacturing
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
San Jose, California
Founded
2015
Find jobs on Simplify and start your career today