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Thistle Technologies builds a security platform for IoT and embedded device manufacturers. It offers a suite of security tools and services designed to address the security risks that come with embedded devices, which often lack the strong security features of general-purpose operating systems. The platform works by providing integrated security tools and services that manufacturers can adopt into their product development process to identify, prevent, and respond to security issues, with the aim of improving security resilience while reducing development time. The company differentiates itself by focusing specifically on the security needs of IoT and embedded devices and offering specialized solutions tailored to manufacturers, rather than broad consumer security products. Its goal is to help manufacturers mitigate vulnerabilities and build more secure products efficiently.
Industries
Hardware
Cybersecurity
Company Size
1-10
Company Stage
Seed
Total Funding
$2.5M
Headquarters
San Francisco, California
Founded
2020
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$2.5M
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Secure Boot on MediaTek Genio, its partnership with Grinn. 2026-04-03 At Thistle, Thistle believe secure boot should be easy to implement and not a multi-week engineering project. MediaTek Genio platforms like the Grinn Genio 700 SOM are gaining traction in edge AI and IoT deployments, but enabling secure boot on these boards has traditionally required deep platform knowledge, manual key management, and a fragile chain of signing steps. In order to streamline this process, Thistle partnered with Grinn with the aim to simplify Secure Boot integration work to a single command. The problem with secure boot today. Secure boot on embedded platforms typically involves generating and safeguarding cryptographic key pairs, configuring multiple signing stages (TF-A, U-Boot, kernel), and carefully orchestrating the signing of each artifact in the right order with the right key. On MediaTek Genio specifically, the boot chain includes a Root of Trust key, eFuse keys, and FIT image keys, each serving a different role in the chain of trust from ROM to Linux. Implementation time usually spans several weeks (if not months) and the result is a process that's error-prone, hard to automate, and tempting to skip entirely despite the security benefits. One command. Thistle extended its CLI tool trh (Thistle Release Helper) with a new sign subcommand. The entire secure boot signing flow for a MediaTek Genio board looks like this: $ trh factory-sign mediatek -soc=mt8390 -input ./build/tmp/deploy/images/genio-700 -output ./signed-output Point trh at your Yocto build directory, tell it where to put the output signed build, and it handles the rest: packaging the right artifacts, calling the signing service, and writing back a complete set of signed images ready to flash. Under the hood, trh configures all the signing parameters: the Root of Trust key, eFuse key, U-Boot FIT image keys, anti-rollback counters, media type. Thistle leverage its Cloud signing KMS (Key Management System), so that key management is done right from the beginning, and no software (or human being!) has access to the private signing keys. What you get back. The output directory contains fully signed boot artifacts. Flash them to the board using the standard Grinn/MediaTek flashing tools, the same genio-flash workflow you already use, just with signed images instead of unsigned ones. The board boots with a verified chain of trust from ROM through TF-A and U-Boot all the way to Linux. Why this matters. Secure boot adoption on embedded platforms is low, and it's not because teams don't care about security. It's because the tooling has historically made it painful. By collapsing the signing workflow into a single CLI call, backed by managed keys architecture, Thistle remove the two biggest barriers: complexity and key management risk. If you're building on MediaTek Genio and want to enable secure boot without the usual overhead, check out the full setup guide or reach out to Thistle directly!
Thistle Technologies has announced comprehensive secure Edge AI enablement for IMDT's system-on-modules and single-board computers built on the Qualcomm Dragonwing QCS8550 platform. The announcement was made at Embedded World 2026. Thistle's security platform automates secure boot provisioning, cryptographic key generation, certificate lifecycle management and multi-image signing required by Snapdragon/Dragonwing architectures. The platform integrates into existing CI/CD workflows and enables secure over-the-air updates whilst maintaining chain of trust from factory to field deployment. For AI-driven systems, the platform supports model signing, encryption and version management, allowing firmware and AI models to be updated independently whilst maintaining cryptographic verification. IMDT CEO Avi Shimon said the partnership enables customers to deploy secure, scalable Edge AI solutions faster with reduced complexity.
Thistle Technologies enables production-ready Secure Edge AI on IMDT Qualcomm QCS8550 soms. * 6 hrs ago Security must be integrated from the start. By working with Thistle Technologies, its customers can deploy secure and scalable Edge AI solutions faster and with significantly less complexity." - Avi Shimon SAN FRACISCO, CA, UNITED STATES, March 9, 2026 /EINPresswire.com/ - At Embedded World 2026, Thistle Technologies announces comprehensive Secure Edge AI enablement for IMDT's high performance system on modules and single board computers built on the Qualcomm Dragonwing(TM) QCS8550 platform. IMDT's Qualcomm based SOM portfolio delivers exceptional AI performance, industrial reliability, and rapid deployment capabilities for robotics, smart city, industrial vision, medical, and autonomous systems. By combining this powerful compute foundation with Thistle's automated security platform, customers can move from development to production with hardware rooted security enabled in hours instead of months. The Thistle Security Platform automates Secure Boot provisioning, eFuse configuration, cryptographic key generation, certificate lifecycle management, and multi image signing required by Snapdragon/Dragonwing architectures. The platform integrates directly into existing CI and CD workflows and leverages hardware security modules to securely sign bootloaders, firmware, operating systems, and trusted components. In addition to device level protection, the platform enables secure over- the- air updates that preserve the chain of trust from factory provisioning through field deployment. Customers can perform staged rollouts, manage rollback protection, and recover safely from failed updates without compromising device integrity. For AI driven systems, the platform extends protection to the AI workload itself by supporting model signing, encryption, and version management. IMDT and Qualcomm customers can independently update firmware or AI models while maintaining cryptographic verification and full auditability. "IMDT's mission is to accelerate Edge AI innovation by delivering powerful, production-ready platforms built on Qualcomm technologies," said Avi Shimon, CEO of IMDT. "Security must be integrated from the start. By working with Thistle Technologies, our customers can deploy secure and scalable Edge AI solutions faster and with significantly less complexity." By unifying Secure Boot, key management, image signing, OTA lifecycle control, and AI model protection in a single automated platform, Thistle reduces months of specialized embedded security engineering to a repeatable and streamlined process. The result is faster time to market, reduced operational risk, simplified compliance with emerging regulations, and production grade security for Edge AI devices built on IMDT's Qualcomm SOM ecosystem. Raul Vergara Thistle Technologies Legal Disclaimer: EIN Presswire provides this news content "as is" without warranty of any kind. Mycarrollcountynews do not accept any responsibility or liability for the accuracy, content, images, videos, licenses, completeness, legality, or reliability of the information contained in this article. If you have any complaints or copyright issues related to this article, kindly contact the author above.
Thistle Technologies, a provider of security infrastructure for embedded devices, has announced Thistle Security Platform, a set of tools and services that bring software updates and other security functionality to the world of embedded devices.
The Internet of Things has a security problem. The past decade has seen wave after wave of new internet-connected devices, from sensors through to webcams and smart home tech, often manufactured in bulk but with little — if any — consideration to security. Worse, many device manufacturers make no effort to fix security flaws, while others simply leave out the software update mechanisms needed to deliver patches altogether.
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Industries
Hardware
Cybersecurity
Company Size
1-10
Company Stage
Seed
Total Funding
$2.5M
Headquarters
San Francisco, California
Founded
2020
Find jobs on Simplify and start your career today