HyperLight Corporation, a thin-film lithium niobate photonics company, has raised $80 million in a Series C round led by MediaTek. The round included participation from UMC Capital, Jabil, Foxconn, EDBI, CDIB-TEN Capital and Qatar Investment Authority, alongside strategic investors from silicon IC and networking firms. The company develops TFLN technology for AI infrastructure optical interconnects, offering higher bandwidth and lower power consumption. Its TFLN Chiplet Platform supports 200G-per-lane operation, with 400G-per-lane solutions now sampling. HyperLight recently announced a manufacturing partnership with UMC and Wavetek for high-volume production on six-inch and eight-inch wafers. The funding will expand manufacturing capacity, accelerate customer qualification and scale the platform. CEO Mian Zhang said the round brings together companies across the AI infrastructure value chain.

It raised $80m in its Series A funding round in November.

GridCARE raised a $64M Series A led by Sutter Hill Ventures and John Doerr, highlighting that power, not compute, is AI's bottleneck.