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Brooks Automation

Semiconductor automation and vacuum solutions

Technical Program Manager - Atmospheric & Advanced Packaging

Program ManagementUpdated on Nov 11
Full-timeChelmsford, MA, USAHybrid

About the Job

Requirements

  • A bachelor's degree in Mechanical, Electrical, Software, Systems, Mechatronics, Manufacturing Engineering, or a related technical discipline is required; an advanced degree is valued but not required.
  • At least 6 years of experience spanning technical program management, systems engineering, product development, engineering leadership, applications engineering, or operations, including at least 3 years owning complex cross-functional programs.
  • Direct experience with semiconductor capital equipment, factory automation, robotics, advanced packaging, mechatronics, medical devices, aerospace, or similarly complex electromechanical hardware/software systems.
  • Technical fluency in systems combining mechanisms and structures, precision motion or robotics, end effectors, electrical controls, sensors and vision, embedded or application software, safety systems, manufacturing, and field integration.
  • Ability to read and interrogate requirements, configurations, bills of materials, drawings and specifications, interface definitions, failure mode and effects analysis and finite element analysis outputs, verification matrices, test reports and data, defect records, engineering changes, deviations, and manufacturing- and field-readiness evidence.
  • Demonstrated ability to lead technical design and program reviews, question design changes and engineering assumptions, and convert unresolved work into explicit program risk, schedule impact, resource demand, and decision requirements.
  • Demonstrated ownership of integrated master schedules, critical-path management, resource loading and leveling, global dependencies, recovery planning, baseline control, and formal change control.
  • Experience managing customer-facing programs with evolving requirements, custom configurations, development hardware, field qualification, global installation, and production transfer.
  • Ability to influence without authority and challenge functional leaders, customers, or senior stakeholders with facts, alternatives, quantified consequences, and a clear recommendation.
  • Ability to connect technical execution to non-recurring engineering, product cost, margin, volume, revenue timing, customer value, quality, throughput, yield, and return on investment.
  • Hands-on proficiency with Smartsheet or Microsoft Project, plus Excel, PowerPoint, Teams, SharePoint, and dashboard tools; tool fluency must be paired with technical judgment and program leadership.
  • Periodic travel to Brooks sites, suppliers, original equipment manufacturer partners, manufacturing locations, and customer facilities is required.
  • Regular collaboration across North American, Asian, and European time zones is expected, with increased travel during builds, integration, qualification, recovery, and production-transfer phases.

Responsibilities

  • Lead assigned atmospheric and advanced-packaging programs across the full lifecycle, from opportunity and requirements definition through feasibility, initiation, detailed planning, phase-gate readiness, design release, prototype and alpha/beta builds, DVT and SQA readiness, production transfer, customer shipment, installation, qualification, ramp, field stabilization, and closure.
  • Establish and control the integrated program baseline, including customer and system requirements, measurable acceptance criteria, product configuration, interfaces, milestones, critical path, named resource assumptions, bill-of-materials maturity, cost targets, quality objectives, customer commitments, and decision rights.
  • Build and maintain an integrated master schedule across Product Management, Applications, Systems Engineering, mechanical, electrical, software and controls Engineering, Operations, Supply Chain, Quality, Service, regional teams, suppliers, OEM partners, and the customer; distinguish requested dates, target dates, and approved commitments.
  • Turn rough-order-of-magnitude estimates and functional inputs into executable plans by probing task logic, identifying named resources and allocations, leveling constrained capacity, validating material and test lead times, and obtaining explicit functional commitment.
  • Own the program risk, issue, assumption, dependency, decision, action, and change-control system; convert red status into technical and business consequences, recovery options, a recommendation, a decision owner, and a required decision date.
  • Lead phase-gate readiness as an evidence-based decision and make incomplete deliverables, residual risks, waivers, deviations, temporary workarounds, open defects, and conditional approvals explicit, owned, scheduled, and closed.
  • Control post-baseline changes by quantifying impacts to system architecture, interfaces, design, verification, software, bill of materials, tooling, fixtures, documentation, service, spares, schedule, resources, product cost, non-recurring engineering, quality, throughput, yield, revenue timing, and customer commitments before approval and re-baselining.
  • Lead customer-facing program, design-readiness, build-readiness, installation, and recovery reviews; push back constructively when requirements, acceptance criteria, dates, or trade-offs are not supportable while maintaining the customer relationship.
  • Create concise executive communication showing baseline versus forecast, critical-path movement, configuration maturity, top technical and commercial risks, recovery scenarios, recommendations, and decisions required.
  • Drive complete program closure, including as-built/as-shipped configuration, manufacturing and service readiness, field actions, verification closure, lessons learned, ownership transfer, and retirement of temporary workarounds.
  • Develop sufficient system-level understanding to engage credibly with mechanical, electrical, controls, software, systems, test, manufacturing, quality, applications, and supplier engineers; detect gaps, question unsupported conclusions, and recognize when a local answer does not close system or customer risk.
  • Lead technical program reviews connecting customer requirements, system architecture, subsystem interfaces, design maturity, build configuration, verification evidence, manufacturing readiness, field conditions, cost, schedule, and customer acceptance.
  • Understand atmospheric automation architecture, including front-end equipment modules, robots and end effectors, load ports, aligners, vision and mapping, motion/control systems, safety systems, host and equipment interfaces, configuration files, and interaction between Brooks equipment and the customer or OEM tool.
  • Understand advanced-packaging handling challenges sufficiently to question requirements and decisions involving panel or wafer size, thickness, weight, warpage or bow, materials, surface conditions, pitch, slot utilization, vacuum handling, acceleration, vibration, repeatability, positioning, mapping, contamination, throughput, and breakage or yield risk.
  • Challenge design changes by asking what requirement or field problem is being solved, what measurable acceptance criterion applies, what alternatives were evaluated, which interfaces are affected, what must be reverified, and how the change affects throughput, reliability, bill of materials, lead time, tooling, software, documentation, service, schedule, and customer commitments.
  • Understand product and configuration structures well enough to reconcile selection guides, system requirements, configuration matrices, engineering and manufacturing bills of materials, as-built/as-shipped records, software and parameter versions, engineering change orders, deviations, substitutions, effectivity, and field-upgrade content.
  • Probe engineering estimates and recovery plans using system dependencies, design and release cycles, finite element analysis or analysis completion, prototype-learning cycles, supplier lead time, fixture and tooling readiness, software integration, tuning, test capacity, DVT/SQA sequence, defect closure, rework, logistics, and installation constraints.
  • Use technical artifacts as program evidence, including marketing requirements documents and customer requirements, selection guides, architecture and interface documents, drawings and specifications, design-review outputs, failure mode and effects analysis, finite element analysis, verification matrices, DVT/SQA plans and results, throughput and repeatability data, defect records, engineering change orders, deviations, bills of materials, build documentation, and field procedures.
  • Ensure field fixes, customer-specific software or parameter changes, temporary workarounds, technical debt, open defects, waivers, and undocumented tribal knowledge are captured, reproducible, risk-assessed, owned, and closed or formally accepted.
  • Translate technical choices into schedule, cost, quality, throughput, yield, capacity, customer, and business consequences so leadership can make informed decisions without losing engineering reality.
  • Improve front-end readiness by challenging incomplete selection guides, undefined substrate or interface requirements, unclear acceptance criteria, unsupported dates, immature configurations, and weak resource assumptions before the organization commits.
  • Help define a practical readiness review before PCM so large cross-functional teams are not used to discover basic scope gaps; ensure PCM receives decision-quality inputs and produces an explicit acceptance, rejection, or conditional path.
  • Create disciplined configuration and change control across customer requests, product definitions, bills of materials, software/configuration files, as-shipped systems, and field upgrades; prevent customer-specific one-offs from becoming invisible product obligations.
  • Use Smartsheet as the execution source and SharePoint as the governed home for program artifacts; use enterprise data and concise program views to make decisions rather than manually recreating status across reports.
  • Apply common minimum controls with governance tailored by novelty, customer exposure, technical risk, and complexity; protect non-negotiable controls for requirements, configuration, safety, verification, manufacturing readiness, financial exposure, and customer acceptance.
  • Reduce firefighting, hidden priority shifts, repeated schedule reconstruction, field rework, engineer travel, and dependence on individual heroics by fixing mechanisms that create recurring execution failure.
  • Help prepare programs for scale, including global production transfer and volume ramp, so successful prototypes do not depend on the original engineering team to build, tune, install, or sustain every system.

Desired Qualifications

  • Experience leading globally distributed teams in Asia, Europe, and North America is strongly preferred.
  • Experience with front-end equipment modules, wafer or panel handling robots, end effectors, load ports, aligners, vision/mapping, motion control, industrial software, equipment interfaces, or customer-tool integration.
  • Experience with advanced-packaging substrates, including panels, bonded wafers, film frames, JEDEC trays, heavy or warped payloads, metrology, mapping, and high-throughput handling.
  • Experience recovering a distressed technical or customer program with measurable improvement in schedule, cost, quality, throughput, field stability, or customer outcome.
  • Experience scaling from prototype or customer-specific development to repeatable production, global installation, service readiness, and high-volume demand.
  • Experience improving phase-gate governance, PCM or intake readiness, requirements and configuration control, portfolio prioritization, or executive operating cadence.
  • PMP, PgMP, systems-engineering, quality, Lean, or equivalent credentials are valued, but demonstrated technical judgment and ownership are more important.

About the Company

Brooks Automation

Semiconductor automation and vacuum solutions

Brooks Automation provides automation and vacuum solutions for the semiconductor manufacturing industry. It operates in two main product lines: automation (including robotic systems and equipment for wafer handling and transport) and vacuum and instrumentation solutions (products to control and monitor the manufacturing environment). The way its products work is by using robotic systems to move and manage wafers through manufacturing steps, while vacuum systems and instrumentation regulate and observe the process environment to maintain clean, stable conditions and precise process control. The company differentiates itself by delivering integrated, high-performance automation and vacuum solutions that help semiconductor manufacturers boost productivity, improve yields, and reduce manufacturing costs. Brooks Automation’s goal is to enable customers to make their fabrication processes more efficient, reliable, and cost-effective in a global semiconductor market.

Company size
1,001-5,000
Company stage
Not listed
Total funding
$5.6M
Headquarters
Chelmsford, MA
Founded
1978

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