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Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Software Design Engineer

Software EngineeringUpdated on Nov 15
Full-timeEindhoven, Netherlands

About the Job

Requirements

  • A degree in computer science, software engineering, or a related field, or equivalent experience.
  • Four to eight years of professional software development experience.
  • C# skills and experience with WPF and Python, plus familiarity with gRPC and structured text.
  • Ability to take technical ownership and lead by example in a small, hands-on team.
  • Actively applies AI tooling across coding, testing, DevOps/CI-CD, performance tuning, GUI development, and documentation.

Responsibilities

  • Act as technical lead for the equipment control software platform by setting direction, making architectural decisions, and coordinating with the architect and engineering team.
  • Turn high-level measurement instructions into precise commands for the machine's hardware, including converting between different positioning reference frames.
  • Develop and refine automated routines that position, align, and calibrate the system, and build user interface components operators use to run them.
  • Design and maintain interfaces between the software that controls the hardware and the software above it, connecting teams and components.
  • Work with the architect to assess deliverables, validate effort estimates, and plan and track progress.
  • Take on adjacent responsibilities as the team grows, such as CI/CD ownership or product-owner-style backlog and stakeholder coordination.

About the Company

Invisix Measuring Systems

Non-destructive 3D nanoscale chip imaging

Invisix Measuring Systems builds a soft X-ray metrology platform for non-destructive 3D imaging of buried nanoscale chip structures, designed for high-volume semiconductor manufacturing. It uses High Harmonic Generation to produce soft X-ray signals and applies proprietary reconstruction algorithms and machine learning to turn that data into 3D images. This enables viewing buried features that optical tools can’t resolve, with a focus on throughput suitable for complex 3D devices. The company has validated its approach with Intel and imec and recently closed a €20 million seed round with strategic investors to accelerate commercial systems and scale customer demonstrations.

Company size
11-50
Company stage
Seed
Total funding
$22M
Headquarters
Veldhoven, Netherlands
Founded
2025

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