Director of High-Performance Computing Power Modules

We are seeking great talent to help us build The DNA of tech.®

Vishay manufactures one of the world's largest portfolios of discrete semiconductors and passive electronic components that are essential to innovative designs in the automotive, industrial, computing, consumer, telecommunications, military, aerospace, and medical markets. We help the world's most in-demand technologies come to life. Every day our products touch your life and the lives of people across the world, though you likely do not know it. Come join us and help us build The DNA of tech.™

Vishay Intertechnology, Inc. is a Fortune 1,000 Company listed on the NYSE (VSH). 

Do you want to help us build the DNA of tech.?  Vishay is currently seeking applicants for Director of High- Power Computing Power Modules. 

As Director, HPC Power Modules you will lead the strategy, development, and execution of next-generation power module solutions designed for High-Performance Computing (HPC), Artificial Intelligence (AI), data center, networking, and other high-power-density applications.

This role will be responsible for establishing and executing the product and technology roadmap for advanced power modules, including high-current and high-power-density solutions supporting next-generation processors, GPUs, AI accelerators, servers, and data-center infrastructure.

You will lead a cross-functional organization spanning product development, applications engineering, semiconductor technology, packaging, thermal management, reliability, manufacturing, and customer engagement. The successful candidate will combine deep technical expertise in power electronics with strong business acumen and the ability to translate emerging customer requirements into differentiated products and technologies.

Job Location: This position will be filled near our Vishay offices in San Jose, CA.     

What you will be doing:

Technology & Product Strategy

• Develop and execute the long-term HPC power module technology and product roadmap aligned with market and customer requirements.
• Identify emerging trends in AI, HPC, data centers, GPU/CPU power delivery, networking, and power architecture.
• Define product strategies addressing increasing requirements for higher current, higher power density, improved thermal performance, lower losses, and increased efficiency.
• Drive technology differentiation through innovative module architecture, semiconductor integration, advanced packaging, interconnects, and thermal solutions.
• Establish technology partnerships and development strategies with key customers, semiconductor suppliers, technology partners, and internal R&D organizations.

Product Development

• Lead development of next-generation power modules from concept through qualification, production release, and market adoption.
• Establish product requirements, technical specifications, development schedules, and performance targets.
• Direct cross-functional engineering teams responsible for:
  • Power semiconductor technologies
  • Module/package design
  • Electrical and thermal design
  • Mechanical design
  • Materials and interconnect technologies
  • Reliability and qualification
  • Manufacturing and process development
  • Application engineering
• Ensure products achieve targeted performance, cost, quality, reliability, and time-to-market objectives.
• Establish design-for-manufacturing and design-for-reliability principles throughout the development process.

HPC & Data Center Applications

• Develop a strong understanding of evolving AI accelerator, GPU, CPU, server, and data-center power architectures.
• Engage directly with strategic customers to understand future power requirements and influence next-generation system designs.
• Support customers in defining power module architectures and performance requirements.
• Identify opportunities for advanced power modules in:
  • AI servers
  • GPU/accelerator platforms
  • High-performance computing
  • Data-center power systems
  • Networking and communications
  • Cloud infrastructure
  • High-current processor power delivery
• Translate system-level customer requirements into module-level electrical, thermal, mechanical, and reliability specifications.

Technical Leadership

• Serve as a senior technical authority for HPC power module technology.
• Provide technical direction on semiconductor selection, module architecture, thermal management, packaging, and system integration.
• Drive innovation in areas such as:
  • High-current power modules
  • Low-inductance designs
  • High-frequency switching
  • Advanced thermal management
  • High-density packaging
  • Advanced interconnect technologies
  • Si, SiC, GaN, and other emerging semiconductor technologies
• Evaluate emerging technologies and determine their potential commercial application.
• Lead technology reviews and provide recommendations to executive leadership.

Organizational Leadership

• Build, lead, and develop a high-performing global engineering organization.
• Establish organizational capabilities required to support rapidly evolving HPC and AI markets.
• Recruit, mentor, and retain high-caliber technical talent.
• Establish clear objectives, accountability, development plans, and performance expectations.
• Promote a culture of innovation, collaboration, urgency, and continuous improvement.
• Develop technical leaders and succession plans within the organization.

What you will bring along:

• Bachelor's degree in Electrical Engineering, Power Electronics, Materials Science, Mechanical Engineering, or related technical discipline.
• Advanced degree preferred.
• 15+ years of relevant experience in semiconductor, power electronics, power modules, advanced packaging, or related technology.
• Demonstrated experience leading complex product development organizations.
• Strong technical understanding of power semiconductor devices and power module technologies.
• Experience with high-power or high-current applications.
• Experience with advanced semiconductor packaging and thermal management preferred.
• Demonstrated experience working directly with major customers and technology partners.
• Strong understanding of product development processes from concept through production.
• Proven ability to lead global, cross-functional engineering organizations.

Preferred Technical Experience

Experience in several of the following areas is highly desirable:

• HPC / AI / data-center power applications
• GPU and CPU power delivery
• Power modules and integrated power solutions
• MOSFETs, IGBTs, SiC, and/or GaN
• High-current DC/DC power conversion
• Voltage regulator modules (VRMs)
• Power stages and multiphase architectures
• Advanced semiconductor packaging
• Thermal management and cooling technologies
• Electrical and thermal simulation
• High-frequency switching
• Low-parasitic/low-inductance module design
• Reliability qualification
• Automotive, industrial, or data-center power electronics
• High-volume semiconductor manufacturing

What can we offer you for your talent:

Vishay offers a comprehensive suite of benefit programs including health care coverage, financial support programs and other resources designed to help you achieve your personal and professional goals. With us, you'll experience unique career paths, an open and collaborative culture, a stable business that will be there for you, and opportunities to work globally and locally.  

Do you have the skills we need? Are you ready to power your career as you power the world? If so, apply today.

Vishay committed to a workplace free of harassment and unlawful discrimination. We do not engage in discrimination or harassment based on race, color, age, gender, sexual orientation, gender identity and expression, ethnicity or national origin, disability, pregnancy, religion, political affiliation, union membership, covered veteran status, protected genetic information or marital status in hiring and employment practices.

It is the policy of Vishay to provide equal employment and advancement opportunities to all colleagues and applicants for employment without regard to race, color, ethnicity, religion, gender, pregnancy/childbirth, age, national origin, sexual orientation, gender identity or expression, disability or perceived disability, genetic information, citizenship, veteran or military status or a person’s relationship or association with a protected veteran, including spouses and other family members, marital or domestic partner status, or any other category protected by federal, state and/or local laws.