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Micron Technology

Makes memory and storage chips for AI and PCs

Director – ITP AI Forward Deployed Engineering

Engineering LeadershipPosted on Nov 10
Full-timeRichardson, TX, USANo salary listedIn-person

About the Job

Requirements

  • A Master's degree in Computer Science, Electrical Engineering, Computer Engineering, Data Science, or a similar field.
  • 15 years of experience in software engineering, artificial intelligence and machine learning, data science, or engineering solutions, including more than 7 years managing engineering teams.
  • Proven experience owning production operations for enterprise-critical systems, including on-call operations, incident management, observability, root-cause analysis, service-level objectives, and production reliability.
  • Demonstrated experience deploying artificial intelligence and machine learning, generative artificial intelligence, or related artificial intelligence-enabled solutions into production and driving adoption across multiple engineering or product teams.
  • Demonstrated technical leadership across artificial intelligence and machine learning engineering, production software and infrastructure, data systems, automation, and operational reliability.

Responsibilities

  • Direct forward deployed delivery for ITP product teams by integrating FDE engineers into engineering departments. Discover high-impact use cases and develop production-ready solutions covering AI agents, agentic workflows, data science, custom models such as small language models, and AI-powered engineering and CAD workflows.
  • Advance AI solutions from pathfinding through pilot and into production, incorporating operational readiness, monitoring, runbooks, support, security, scalability, and reliability from day one. Produce repeatable deployment instructions and reference architectures to speed up delivery cycles across ITP.
  • Partner with product team leaders to translate engineering challenges into prioritized AI opportunities and track improvements in adoption, efficiency, engineering cycle time, quality, reliability, and cost.
  • Develop and lead the FDE organization by sourcing, growing, and retaining forward deployed engineers, SRE and operations engineers, and AI and machine learning engineers. Handle team resources, priorities, and budget guided by ITP business value while partnering with architecture, platform, support, product, and Information Technology teams.
  • Own production operations and reliability for deployed ITP AI solutions by establishing service-level objectives, appropriate service-level agreements and error budgets, on-call rotations and blocking issue response models, incident management, root-cause analysis, corrective actions, and change, release, and rollback practices that protect production stability.
  • Provide accountable leadership during production incidents by driving rapid service restoration, communicating with impacted product teams, and helping prevent recurrence. Proactively identify and eliminate single points of failure, capacity risks, and operational toil through automation.
  • Drive telemetry, observability, and continuous optimization across the AI stack through logging, tracing, monitoring, alerting, dashboards, and health scorecards that provide access to production system health and usage. Use operational insights to continuously improve performance, reliability, cost efficiency, model quality, and ITP AI, data, and platform roadmaps.
  • Measure and communicate the success of deployed AI capabilities, including business value delivered as solutions move from pathfinding to production, production availability and SLO attainment, performance and cost improvements, solution adoption, and happiness among ITP engineers.

Desired Qualifications

  • A PhD or equivalent experience in Computer Science, Electrical Engineering, Computer Engineering, artificial intelligence and machine learning, Data Science, or a related technical area.
  • Experience in semiconductor, memory, storage, or related product development environments, with knowledge of complex engineering, building, verification, and CAD workflows.
  • Experience building and leading forward deployed, customer-embedded, SRE, production engineering, AI and machine learning, or similar technical groups.
  • Extensive background in AI agents and autonomous workflows, generative AI, machine learning models, compact language models, AI-assisted engineering processes, production AI monitoring, and model performance.
  • Demonstrated leadership grounded in ownership, operational excellence, technical depth, a builder approach, cross-functional collaboration, innovation, and customer focus.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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