Manufacturing Supervisor

TD SYNNEX has raised its fiscal 2026 outlook following a record second quarter driven by AI infrastructure demand and hyperscaler growth. The company reported non-GAAP earnings per share of $4.85, beating consensus estimates by 19.2%, whilst revenues reached $19.57 billion, exceeding expectations by 16.2%. The company's Hyve Solutions segment posted gross billings of $5.5 billion, up 117% year over year, reflecting strong demand from hyperscale data centres. TD SYNNEX is expanding US manufacturing capacity by over one million square feet to support anticipated programme ramps. For the third quarter, the company expects non-GAAP earnings per share of approximately $4.50 and revenues of about $18.6 billion. Management emphasised that AI-driven infrastructure investment remains a central growth catalyst across both its Distribution and Hyve segments.

Lightmatter forms consortium to seize CPO discourse power. Connects major manufacturers like Celestica, Dell, and Quanta to establish interoperability standards needed for next-generation AI systems. * 2026.03.18 * 03:00 * Industrial and Commercial Times, Li Juanping Silicon photonics startup Lightmatter, in collaboration with partners including Celestica, Corning, Dell, Flex, Foxconn Interconnect Technology, Hyve Solutions, Keysight, Qualcomm, and Quanta Cloud Technology, has launched the Co-Packaged Optics (CPO) Reference Architecture Initiative within the Open Compute Project (OCP). This initiative aims to promote open specifications and interoperability standards required for next-generation AI systems. With the rapid expansion of generative AI models, data centers face bottlenecks in bandwidth, power consumption, and spatial density in internal electrical interconnections, making CPO a crucial technological direction for next-generation AI infrastructure. Compared to traditional pluggable optical modules, CPO significantly enhances transmission bandwidth by tightly integrating photonic components into silicon chips and system ends, while also improving power efficiency and rack space utilization. It is regarded as a key solution for hyperscale cloud providers building AI clusters. The industry believes that moving CPO from technical validation to large-scale commercialization still faces several challenges. These include high complexity in component and system integration, insufficient cross-supply-chain interoperability, and incomplete reliability verification and mass production testing standards, all of which are critical factors affecting adoption speed. By leveraging the OCP platform to call for supply chain collaboration, Lightmatter aims to establish shared reference architectures, open standards at the component and system levels, and further build interoperability testing and certification frameworks to accelerate the deployment of CPO solutions. Nick Harris, founder and CEO of Lightmatter, stated that the AI industry is at a critical turning point, and the market requires solutions that can be manufactured, deployed on a large scale, and are interoperable, rather than single closed architectures. Open collaboration through the OCP community will help build a more comprehensive CPO ecosystem. Sameh Boujelbene, Vice President of Dell, also pointed out that the rapid growth of AI workloads has made data center interconnections a major bottleneck. If technological and supply chain gaps can be addressed through open collaboration, it will help expedite the adoption timeline for CPO. Lightmatter's collaboration with partners across servers, networking, fiber optics connectivity, measurement verification, and system manufacturing indicates that CPO development has shifted from isolated technological competition to ecosystem integration. If OCP-related specifications gradually take shape, they will facilitate the transition of hyperscale data centers from traditional pluggable optical modules to integrated optics. This will also bring a new wave of growth momentum to the supply chains of AI servers, silicon photonics, advanced packaging, and high-speed interconnections.