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Micron Technology

Makes memory and storage chips for AI and PCs

Next Generation HBM Platform Architecture Intern

Hardware Systems IntegrationConfirmed live in the last 24 hours
InternshipFolsom, CA, USA$50.24 /hrIn-person

About the Job

Requirements

  • Have 0–2 years of relevant experience through internships, research projects, coursework, or academic projects in electrical engineering, VLSI design, signal integrity, power integrity, thermal analysis, semiconductor design, or related technical fields.
  • Be currently pursuing a Bachelor's, Master's, or PhD degree in Electrical Engineering, Electronics Engineering, Computer Engineering, Computer Science, or a related field.
  • Have coursework or project experience in analog design, I/O design, signaling, DRAM technologies, high-speed interfaces, packaging, or 2.5D/3D integration technologies.
  • Understand electrical systems, signal integrity, power delivery, circuit analysis, or semiconductor design fundamentals.
  • Be able to read and interpret technical specifications, datasheets, interface standards, and hardware documentation.
  • Have analytical, problem-solving, and technical communication skills.
  • Have experience using AI-enabled tools and large language models such as Copilot, Claude, or ChatGPT in engineering workflows, and be able to validate and critically evaluate AI-generated outputs.

Responsibilities

  • Perform signaling and timing analysis for on-die and off-die interfaces across multiple system and packaging topologies.
  • Develop and evaluate thermal models to analyze heat transfer, thermal performance, and design trade-offs in advanced memory systems.
  • Analyze power delivery networks, including IR-drop, electromigration, power integrity, and power grid optimization for advanced HBM architectures.
  • Develop modeling, simulation, and automation tools to support power delivery, thermal analysis, and architecture evaluation activities.
  • Collaborate with architecture, design, packaging, and technology teams to evaluate system-level trade-offs and support future HBM technology development.

Desired Qualifications

  • Have familiarity with Cadence EDA tools, MATLAB, thermal analysis tools, signal integrity tools, or related engineering software.
  • Have knowledge of semiconductor packaging, assembly processes, heterogeneous integration, or advanced packaging technologies.
  • Have experience with analog design, I/O design, timing analysis, signal integrity, or system-level electrical modeling through coursework, research, or project work.
  • Have experience with thermal modeling, computational analysis, power delivery analysis, IR-drop, electromigration, or power integrity evaluations.
  • Have knowledge of HBM, DRAM, memory interfaces, advanced interconnects, or high-speed signaling technologies.
  • Have experience developing engineering automation tools, simulation environments, data analysis workflows, or modeling frameworks using Python or similar programming languages.
  • Demonstrate interest in semiconductor architecture, advanced memory technologies, AI infrastructure, and next-generation computing systems.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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