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Micron Technology

Makes memory and storage chips for AI and PCs

DRAM Device & Cell Technology Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • An M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field is required.
  • Understanding of semiconductor device physics, including MOSFETs, access devices, and capacitors, is required.
  • Experience with electrical measurement, device characterization, and data analysis is required.
  • Knowledge of DRAM fundamentals, including activation, sensing, retention, and interference mechanisms, is required.
  • Proficiency with data analysis and scripting applications including Python, MATLAB, or JMP is required.

Responsibilities

  • Develop DRAM cell and access device technologies to improve density, retention, and disturb immunity.
  • Build and complete silicon experiments; perform electrical characterization, data analysis, and interpretation.
  • Analyze array-level behavior and collaborate with circuit teams to optimize operating conditions and sequences.
  • Coordinate efforts among multiple departments to ensure developed solutions are scalable and manufacturable.
  • Contribute to technology roadmaps through benchmarking, technical evaluation, and strategic recommendations.

Desired Qualifications

  • Experience with DRAM or NAND device development.
  • Experience using TCAD simulation tools such as Synopsys Sentaurus or Silvaco.
  • Experience in semiconductor device fabrication or advanced BEOL integration.
  • Knowledge of device reliability mechanisms and variation analysis, including AI-enabled data analysis techniques.
  • Ability to present technical results and drive multifunctional alignment.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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