[직무명]
- 생산
[담당 업무]
- 산업용 컴퓨터 생산, 조립, 포장
- 시스템 조립 완제품에 대한 기능 검사
[자격 요건]
- 컴퓨터 조립에 대한 이해도
[우대사항]
- 직무 관련 1년 이상 경력자
- 전기/전자 및 공학 계열 전공자
- 엑셀 및 데이터 관리 능력 우수자
Advantech provides IoT intelligent systems and embedded platforms, focusing on edge computing and edge AI across five markets: Edge Intelligence Systems, Manufacturing, Energy & Utilities, iHealthcare, and iCity Services & iRetail. It combines hardware edge computing platforms with the WISE-IoT software stack and sector-specific Edge AI solutions, delivered through an orchestration model that connects devices, software, and domain expertise to form industrial ecosystems. Its approach differentiates itself by offering an integrated hardware-software stack plus orchestration to accelerate collaboration with partners. Its goal is to enable an Intelligent Planet by expanding edge infrastructure and co-creating ecosystems with partners for smarter, connected operations.
Company Size
1,001-5,000
Company Stage
IPO
Headquarters
Taipei, Taiwan
Founded
1983
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Advantech partners with DEKRA, signing MOU to Strengthen global industrial Cybersecurity Compliance in response to EU CRA. Oct 16, 2026, 02:00 ET TAIPEI, Oct. 16, 2026 /PRNewswire/ - As the European Union's Cyber Resilience Act (CRA) enters its implementation phase, cybersecurity compliance is becoming an increasingly important requirement for industrial equipment and Edge AI products entering global markets. Advantech (TWSE: 2395), a global leader in IoT intelligent systems and embedded platforms, announced the signing of a Memorandum of Understanding (MOU) with DEKRA, a trusted global expert in testing, inspection, and certification with more than 100 years of expertise. By combining the expertise in industrial computing, cybersecurity testing, and global certification, the partnership aims to help end customers and system integrators address cybersecurity requirements from the product design stage, accelerate compliance with EU CRA requirements and international standards such as IEC 62443, reduce compliance risks, and shorten time to market. Miller Chang, President of Advantech's Embedded Sector, said at the MOU signing ceremony: "As Edge AI continues to advance rapidly, compliance is evolving from a certification procedure before product launch into a critical consideration that customers need to address from the early stages of product design. By combining Advantech's expertise in industrial computing and Edge AI with DEKRA's global certification expertise, we aim to enable customers identify regulatory requirements earlier, reduce compliance risks, and shorten time to market, enabling trusted Edge AI innovations to reach global markets more efficiently." Stan Zurkiewicz, CEO of DEKRA, said: "Digital trust is essential for industrial innovation to succeed in global markets. As AI and connected technologies become integral to manufacturing, energy and transportation, companies need verifiable evidence of safety and cybersecurity to build confidence in new technologies. Our collaboration with Advantech combines its industry experience with DEKRA's third-party independent testing and certification expertise. DEKRA's role is to provide independent assurance, helping companies navigate evolving international requirements and build trust in new technologies." Addressing Cybersecurity Compliance from the Design Stage to Reduce Development Costs and Market Access Risks Advantech and DEKRA are bringing testing and compliance expertise into the early stages of product development, helping customers identify regulatory and technical requirements across different markets from the design stage, plan certification pathways in advance, and identify and address potential cybersecurity gaps throughout development. The collaboration covers technical and feasibility assessments, documentation review, certification preparation, vulnerability management, and secure development support. This approach helps customers reduce the time and costs associated with late-stage design changes while establishing a comprehensive compliance process from product concept and design development to testing, certification, and market deployment. First Milestone: Industrial Edge System Meet IEC 62443-4-2 SL2 Requirements As an initial outcome of the collaboration, Advantech's AFE-E630 industrial edge system has passed an independent assessment by DEKRA and received an Attestation of Conformity (AoC). Designed for commercial and industrial energy storage management applications, the AFE-E630 security functions meet IEC 62443-4-2 SL2 requirements within the assessed scope. This provides a verified basis for product cybersecurity in these applications and a reference for customers' subsequent product integration and system-level compliance assessments. Extending Collaboration to Edge AI, Semiconductors, Robotics, Energy, and Transportation to Strengthen Cyber Resilience and Expand into Global Markets Beyond established industrial applications, Advantech and DEKRA plan to extend the collaboration to emerging technology areas, including AI-enabled industrial systems, semiconductor manufacturing, robotics, drones, other mission-critical unmanned systems, as well as energy site equipment and transportation management, to accelerate global market access. As Edge AI becomes increasingly integrated with physical devices, product safety, functional safety, and cybersecurity requirements are becoming increasingly interconnected. Advantech and DEKRA will combine Advantech's edge computing platforms and industry application knowledge with DEKRA's expertise in cybersecurity, testing, and functional safety to enhance the safety and trustworthiness of next-generation intelligent devices. As cybersecurity regulations continue to evolve across global markets, Advantech and DEKRA will continue to combine their respective expertise to help customers address compliance requirements across different markets more efficiently, reduce risks associated with global deployment, and accelerate time to market, further supporting the expansion of Edge AI and intelligent industrial applications into global markets. About Advantech Advantech is a global leader in IoT intelligent systems and embedded platforms, with the corporate vision of "Enabling an Intelligent Planet." To embrace the trends of edge computing and artificial intelligence, Advantech fully deploys its sector-driven strategy and focus on Edge Computing and Edge AI, targeting five key markets: Edge Intelligence Systems, Manufacturing, Energy and Utilities, iHealthcare, and iCity Services & iRetail. In the meantime, Advantech is enhancing its global presence and core competitiveness by integrating its Edge Computing hardware platform, the WISE-IoT software platform, and sector-specific Edge AI solutions with domain expertise. The integration will form an "Orchestration" model for seamless industrial chain connections, benefiting both our partners and clients. Advantech is also working with business partners to co-create business ecosystems that accelerate the goal of industrial intelligence. About DEKRA For more than 100 years, DEKRA has been a trusted name in safety. Founded in 1925 with the original goal of improving road safety through vehicle inspections, DEKRA has grown to become the world's largest independent, non-listed expert organization in the field of testing, inspection, and certification. Today, as a global partner, the company supports its customers with comprehensive services and solutions to drive safety and sustainability forward. In 2025, DEKRA generated revenue of 4.4 billion euros. More than 48,000 employees are providing qualified and independent expert services in approximately 60 countries across five continents. DEKRA holds a Platinum rating from EcoVadis, placing it among the top 1% of the world's most sustainable companies. SOURCE Advantech
Advantech expands server chassis portfolio with Liquid Cooling and Compact Desktop solutions. Thursday, October 15th 2026 Advantech, a leading provider of industrial edge AI and high-performance computing solutions, today introduces two new tower server chassis - the HPC-7046 Closed-Loop Liquid-Cooling Tower Chassis and HPC-5422 Desktop Workstation Chassis - designed to tackle the growing demands of enterprise AI, machine vision, robotics, and edge computing. From advanced liquid cooling for high-performance, thermally demanding AI workloads to compact desktop workstation with high-power PSU support for power-hungry GPU computing, the new chassis portfolio delivers scalable performance, expansion capabilities, and deployment flexibility, enabling modern AI computing in a compact footprint across industrial and enterprise edge, including small and medium-sized businesses (SMB) offices and server rooms, development laboratories, factory automation, and embedded industrial equipment. HPC-7046: High-Performance Liquid Cooling for Next Generation AI Computing Modern AI and compute-intensive workloads are driving the adoption of higher-performance CPUs with increasing thermal design power (TDP), making thermal management and acoustic critical for high-performance tower systems. The HPC-7046 supports a closed-loop liquid-cooling solution for EATX/ATX server boards, integrating the liquid-cooling module, liquid cooler, and system fan options into the chassis to efficiently manage demanding single- and dual-processor configurations based on Intel and AMD platforms, while simplifying thermal integration without requiring external cooling equipment. Under full CPU and GPU load, with the fans operating at 100% duty, the HPC-7046 achieves an acoustic level of approximately 58 dBA, comparable to a moderate open office environment. Unlike traditional 7-slot chassis designs, the HPC-7046 features an optimized 9-slot expansion that supports a triple-width GPU while retaining system flexibility for additional add-in cards, making it ideal for AI, visualization, and edge computing. With 1350 W / 1650 W PSU options and support for up to 8 SATA/SAS drives, it provides a scalable foundation for GPU-accelerated AI, HPC, and other compute- and data-intensive workloads. The HPC-7046 also enables multiple platform configurations across server and workstation applications. Supported configurations include HPC-7046 + ASMB-928 EATX board with dual Intel Xeon 6, HPC-7046 + ASMB-808 CEB board with single Intel Xeon 600, and HPC-7046 + ASMB-831 ATX board with AMD EPYC Embedded 9004/9005, enabling scalable solutions across AI, HPC, workstation, storage, and edge applications. HPC-5422: Compact Desktop Workstation with High-Power PSU Support for Flexible Edge Computing As AI computing moves closer to the point of data generation, edge and workstation systems increasingly require higher computing performance within space-constrained environments. Compared with conventional IPC and workstation platforms, the HPC-5422 combines a compact desktop form factor with support for higher-power 850 W and 1200 W PSU, enabling the integration of more power-hungry GPUs in a space-efficient system. Supporting microATX and ATX motherboards as well as desktop and wall mount configurations, the HPC-5422 provides flexible deployment options for a wide range of edge and workstation applications. With up to five FHFL expansion slots, support for two 3.5" HDDs, and optional NVMe HDD backplane, the HPC-5422 provides flexible storage and expansion capabilities in a compact desktop form factor for GPU-accelerated edge computing, AI inference, industrial automation, and workstation applications. The chassis supports multiple industrial platform solutions, including HPC-5422 + ASMB-808 CEB board with Intel Xeon 600 for high-end AI workstation computing, HPC-5422 + ASMB-589 microATX board with Intel Core Ultra 9/7/5 for desktop workstation, and HPC-5422 + ASMB-831 ATX board with AMD EPYC Embedded 9004/9005 for right-sized server applications, providing flexible platform options for different performance and deployment requirements. Product Highlights: * HPC-7046 High-Performance Liquid Cooling for Next Generation AI Computing * Optimized thermal architecture for high-TDP CPUs * 9-slot expansion supporting a triple-width GPU * EATX/ATX motherboards support with up to 8 x SATA/SAS drives * Ideal for AI, HPC, workstation, and high-performance edge computing in SMB branches, development laboratories, factory automation, and embedded industrial environments * HPC-5422 Compact Desktop Workstation with High-Power PSU Support for Flexible Edge Computing * Compact desktop/wall mount design with high-power 850 W / 1200 W PSU support for power-hungry GPUs * microATX/ATX support with up to 5 x FHFL expansion slots and 2 x 3.5" HDDs * Support NVMe HDD backplane * Ideal for AI inference, industrial automation, and workstation applications in space-constrained edge deployments, such as SMB branches, embedded industrial environments
Advantech tops US$1 billion in third-quarter revenue as edge AI orders climb. Oct 9, 2026, 09:39 0 Credit: DIGITIMES Advantech reported on October 7 that third-quarter consolidated revenue reached NT$32.44 billion (approx. US$1.02 billion), a record high as demand for edge AI, semiconductor equipment, and robotics stayed strong... Picks for you
Advantech revolutionizes robot control with Qualcomm Dragonwing power! October 1, 2026. Advantech ushers in a new era of robot control. Advantech has unveiled its ASR-A503 and AFE-A503 platforms, integrating AI, vision processing, and robot control into a single architecture. These innovative solutions, powered by the Qualcomm Dragonwing(TM) IQ-9075M processor, are specifically designed to meet the system requirements of next-generation Autonomous Mobile Robots (AMRs), humanoid robots, and service robots. High performance and efficiency on a single chip. While AI performance (TOPS) often dominates edge computing discussions, Advantech's new platforms excel in balancing performance-per-watt, thermal design, and robust I/O. The ASR-A503 SBC delivers up to 100 dense TOPS (and 200 sparse TOPS), offering developers flexible integration. It also supports up to 8 camera inputs (GMSL and MIPI-CSI), GbE, CAN FD, digital I/O, and serial interfaces. Robust solution for industrial applications: AFE-A503. Designed for faster field deployment, the AFE-A503 packages the ASR-A503's architecture into a rugged, fully integrated industrial enclosure. It eliminates extensive hardware integration efforts with isolated interfaces, wide operating temperature range (-40 to 85°C), and 20 to 36 VDC power input. Ending hardware fragmentation in mobile robotics. One of the biggest engineering challenges in mobile robotics has been hardware fragmentation. Traditionally, building an AMR involved separate GPUs for AI inference, x86 processors for path planning, and dedicated microcontrollers (MCUs) for real-time motor control. This multi-chip approach consumed excessive space, required complex cooling, and rapidly depleted battery life. Integrated solution with Qualcomm Dragonwing IQ-9075M. The Qualcomm Dragonwing IQ-9075M addresses these issues by distributing these workloads across a single System-on-Chip (SoC). Its integrated Neural Processing Unit (NPU) and Image Signal Processor (ISP) handle perception tasks, while the Kryo CPU cores manage the complex mathematical operations of SLAM (Simultaneous Localization and Mapping) and path planning. Dedicated real-time subsystems provide deterministic I/O for motor control. By keeping all this data on a single chip with shared memory, Advantech's platforms significantly reduce power consumption and thermal output, offering a critical advantage for battery-powered humanoid robots and warehouse logistics robots.
Advantech has launched the ASR-D501, a compact AI companion computer for autonomous drones. The platform integrates edge AI processing, multi-sensor connectivity, and robotics software into a sub-10W power envelope. Powered by Qualcomm's QCS6490 processor, the ASR-D501 delivers up to 12 TOPS of AI performance. It supports advanced capabilities including object detection, visual localisation, SLAM, and obstacle awareness. The device features five MIPI-CSI interfaces for multiple cameras, 2.5 GbE, USB 3.2 ports, and connectivity for LiDAR, depth cameras, and flight controllers. The ASR-D501 includes Advantech's Robotic Suite for Drone, providing pre-integrated workflows that connect ROS 2 applications with PX4 and ArduPilot flight controllers. The fanless design measures 100 × 60mm, weighs approximately 50g, and operates across -20°C to 70°C.