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Department

Thin Films Process Engineering (Chemical Vapor Deposition)

Project Title

Crater Defect Reduction in Tetraethyl Orthosilicate (TEOS) Chemical Vapor Deposition Process

Project Description

Crater defects observed in the Tetraethyl Orthosilicate (TEOS) Chemical Vapor Deposition (CVD) process pose yield and integration risks in high‑volume semiconductor manufacturing. This internship project focuses on developing a structured understanding of crater defect mechanisms by integrating process knowledge, chamber condition review, and manufacturing data analytics.
The intern will work on a defined engineering problem and apply data‑driven methodologies and controlled experimentation to identify defect contributors and evaluate improvement opportunities within the Fab10 TEOS CVD process.

Objective of the Project

Build a fundamental understanding of the TEOS CVD process flow and chamber condition effects
Apply data analysis techniques to characterize crater defect signatures and trends
Develop hypothesis‑driven insights linking process conditions to defect formation
Evaluate defect reduction opportunities while maintaining critical film performance requirements

Project Scope

Study TEOS CVD process flow, equipment configuration, and chamber condition history
Analyze inline defect inspection data and yield data to characterize crater defect patterns
Perform structured data analysis to identify key process and equipment variables correlated with defects
Conduct limited, well‑defined experiments (DOE or split runs) under Process Engineering Excellence (PEE) guidance
Assess defect improvement results against key film performance metrics (e.g., thickness, uniformity, electrical properties)

Learning Opportunities

Hands‑on exposure to semiconductor thin‑film CVD processes in a high‑volume manufacturing environment
Application of structured problem‑solving and statistical data analysis in real manufacturing scenarios
Experience in defect characterization, DOE methodology, and engineering trade‑off evaluation
Development of technical communication skills through data reviews and project presentations

Deliverables

Defect characterization summary with data‑driven insights on crater defect mechanisms
Analysis package correlating process parameters and chamber conditions to defect behavior
Experimental results demonstrating defect reduction opportunities with assessment of impact on critical film metrics
Final technical presentation and written summary documenting findings and recommendations

Impact of Project

Identification of actionable defect reduction opportunities for the TEOS CVD process
Improved understanding of process‑defect interactions to support yield and integration robustness
Reusable analytical framework for future defect investigations

Skillset Required

Data analysis and basic statistical analysis skills
Structured problem‑solving mindset
Ability to work with large datasets and derive engineering insights
Clear written and verbal technical communication skills
Strong curiosity and willingness to learn semiconductor manufacturing processes

Course of Interest

Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Data Analytics, or related engineering disciplines

Duration Period:Min6months (Semester Internship from July 2026 toDecember2026)

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations,please contact [email protected]

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Micron Technology

Chemical Vapor Deposition Intern

About the Job

Requirements

Responsibilities