Contract
Process & Filling Operator
2nd Shift
Bachmann Chemical and Engineering
201-500 employees
UV/LED curing materials and equipment provider
Compensation Overview
$20/hr
No H1B Sponsorship
Torrington, CT, USA
In Person
 Operations & Logistics (1) |
|---|
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- A high school diploma or equivalent is required.
- Must demonstrate computer skills; experience with E1 is a plus.
- Good mathematical and organizational skills are required.
- Requires attention to detail, organization, communication, and problem-solving skills, along with confidentiality and good judgment.
- Must be authorized to work for any employer in the United States.
- Fill and attach labels to accepted products as instructed by the cell leader and department supervisor.
- Run syringe, cartridge, liter, pail, and miscellaneous cells independently.
- Maintain a clean and organized workstation, bulk storage, and finished-product inventory in accordance with 6S guidelines.
- Provide neat, organized, and legible documentation at the workstation.
- Perform final inspection of filled, sealed, and labeled products and maintain the stated quality standard of fewer than 1.5 CIDs per year associated with the work.
- Ensure document information is neat, accurate, and legible.
- Maintain safe work habits and properly use personal protective equipment.
- Enter information daily into the enterprise resource planning system and labeling software.
- Assist with multiple process-improvement initiatives.
- Maintain and clean the workstation and manufacturing floor.
- Experience with E1.
Bachmann Chemical and Engineering provides eco-friendly light-curable solutions, including Dymax materials, dispensing equipment, and UV/LED curing systems that are designed to work together as an integrated system for manufacturing. The products cure when exposed to UV or LED light, and the materials and equipment are matched to optimize performance in production lines. The company supports customers with product and process design, testing, initial production runs, system integration, and ongoing service for the life of the process. It serves sectors such as aerospace and defense, energy, medical devices, and electronics. The goal is to help engineers improve manufacturing efficiency and reliability by offering a coordinated, end-to-end light-curing solution.
Company Size
201-500
Company Stage
N/A
Total Funding
N/A
Headquarters
null
Founded
1980
Get referred to Bachmann Chemical and Engineering
See people who can refer or advise you
Simplify's Take
What believers are saying
- Dymax opened Querétaro on July 3, 2026, expanding Mexico and Latin America coverage.
- July 31, 2026 launch broadens sales into AI hardware and advanced electronics.
- BCE’s 2026 hiring and product cadence signal sustained customer demand and commercialization momentum.
What critics are saying
- Cherng? no, Dymax Wiesbaden expansion strains execution during 2026 growth ramp.
- Heavy capacity and headcount investment pressure margins if demand softens after 2026.
- Single-industry concentration in electronics leaves BCE vulnerable to customer qualification delays.
What makes Bachmann Chemical and Engineering unique
- Dymax’s 2026 9310 adhesive targets high-reliability PCB reinforcement for AI hardware.
- BCE Holding unites Dymax, Bomar, ECT, and Tridak across niche industrial workflows.
- Dymax’s UV/LED curing speeds assembly versus traditional underfill and thermal-cure processes.
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Benefits
Health Insurance
Dental Insurance
Vision Insurance
Disability Insurance
401(k) Retirement Plan
Paid Vacation
Paid Holidays
Paid Sick Leave
Life Insurance
Tuition Reimbursement
Training Programs
Wellness Program
Company News
Dymax launches 9310 adhesive for high-reliability PCB reinforcement. Fast light curing, reflow durability, and controlled edge bonding for reliable PCB reinforcement in advanced electronic assemblies. Torrington, CT - July 30, 2026... Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards. Designed for advanced electronics and AI hardware, 9310 cures in seconds with light, delivering a fast, streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies. Dymax 9310 maintains adhesion through high-temperature reflow. It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments. The adhesive's high viscosity and thixotropic profile enable precise edge bonding without unwanted flow. This improves placement control and overall process consistency. The material is also reworkable at relatively low temperatures, supporting greater manufacturing flexibility. "9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill," said Doug Katze, Senior Electronics Business Development Manager for Dymax. Get in touch. Interested in learning more or have questions? Dymax want to hear from you. Back to top
Dymax launches 9310 adhesive for high-reliability PCB reinforcement. - Fast light curing, reflow durability, and controlled edge bonding for reliable PCB reinforcement in advanced electronic assemblies. SINGAPORE, July 31, 2026 /PRNewswire/ - Dymax, a global manufacturer of light-curing materials and equipment, announces the launch of its 9310 adhesive engineered to reinforce fine-pitch, leadless components on printed circuit boards. Designed for advanced electronics and AI hardware, 9310 cures in seconds with light, delivering a fast, streamlined alternative to traditional underfill. A secondary heat cure ensures full polymerization in shadowed areas, supporting consistent performance across complex assemblies. Dymax 9310 maintains adhesion through high-temperature reflow. It is formulated to flex under strain, helping absorb movement caused by thermal expansion and reducing stress on solder joints and components. Its combination of high elongation (145%) and controlled modulus allows the material to accommodate thermal and mechanical strain, helping maintain bond integrity over time in demanding environments. The adhesive's high viscosity and thixotropic profile enable precise edge bonding without unwanted flow. This improves placement control and overall process consistency. The material is also reworkable at relatively low temperatures, supporting greater manufacturing flexibility. "9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill," said Doug Katze, Senior Electronics Business Development Manager for Dymax. Dymax develops innovative rapid and light-curable materials, dispensing equipment, and UV/LED light-curing systems. The company's adhesives, coatings, and equipment are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiencies. Major markets include aerospace and defense; medical device; and consumer and automotive electronics. For additional information on Dymax, visit www.dymax.com or call Daily Bulletin at +65 6752 2887. SOURCE Dymax
Dymax, a global manufacturer of light-curing materials and equipment, has opened a new distribution and technical facility in Querétaro, Mexico, expanding support for customers across Mexico and Latin America. Located in Parque Terra Park Centenario, the facility provides local inventory, faster response times and enhanced technical support. The site serves industries including medical devices, automotive electronics and aerospace, offering product development, application testing and process optimisation capabilities. The investment addresses growing demand driven by electrification, miniaturisation and connected technologies in manufacturing. Dymax's expansion strengthens its partner network across Latin America, reducing lead times and improving access to training. The company develops rapid and light-curable materials, dispensing equipment and UV/LED curing systems for advanced manufacturing applications.
Dymax, a manufacturer of light-curing materials, has launched HLC-M-1004, a low viscosity adhesive designed for medical device assembly. The product expands the company's HLC Adhesives portfolio, which uses hybrid light-curable technology to cure in both light-exposed and shadowed areas. The adhesive is suited for catheters, diagnostic devices and other medical components with opaque substrates. It offers controlled dispensing, penetration into tight bond gaps and rapid fixturing for high-throughput manufacturing. The material requires no primers and provides flexibility after curing. HLC-M-1004 has been evaluated under ISO 10993 biocompatibility standards and contains no nonreactive solvents. As a one-part material, it aims to simplify processes and reduce waste in medical device manufacturing.
Dymax Expands HLC Adhesive Portfolio with New low viscosity medical product. May 28, 2026 -New Adhesive Enables Reliable Bonding in Both Light and Shadowed Areas SINGAPORE, May 28, 2026 /PRNewswire/ - Dymax, a global manufacturer of light-curing materials and equipment, today announced the release of HLC-M-1004, a low viscosity adhesive designed to support efficient assembly of complex medical devices. HLC-M-1004 expands the HLC(TM) Adhesives portfolio, which utilizes a hybrid light-curable platform to support curing in both light-exposed and shadowed areas. The adhesive combines on-contact cure in dark areas with rapid, low-intensity UV or visible-light curing to support fast, reliable manufacturing. Designed for medical device assembly, HLC-M-1004 is well-suited for applications involving catheters, diagnostic and therapeutic devices, and other parts that incorporate opaque or light-blocking substrates. The adhesive delivers low viscosity for controlled dispensing and penetration into tight bond gaps, enabling consistent bond formation without the need for primers. Additional performance benefits include limited blooming with proper light curing, flexibility after cure, and improved aesthetics. The material provides rapid fixturing to support high-throughput manufacturing processes. HLC-M-1004 has been evaluated in accordance with applicable ISO 10993 biocompatibility standards and contains no nonreactive solvents. As a one-part material, it helps manufacturers simplify processes, reduce waste, and improve overall production efficiency. With the addition of HLC-M-1004, Dymax continues to expand the HLC Adhesive family to address evolving bonding challenges in medical device assembly environments. Dymax Expands HLC(TM) Adhesives Portfolio with New Medical Adhesive, HLC-M-1004 Dymax develops innovative rapid and light-curable materials, dispensing equipment, and UV/LED light-curing systems. The company's adhesives, coatings, and equipment are perfectly matched to work seamlessly with each other, providing design engineers with tools to dramatically improve manufacturing efficiencies. Major markets include aerospace and defense; medical device; and consumer and automotive electronics. For additional information on Dymax, visit www.dymax.com or call Voiceofasean at +65 6752 2887.