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Micron Technology

Makes memory and storage chips for AI and PCs

NAND Cell Device Engineer

Hardware EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • A Master of Science or Ph.D. in Electrical Engineering, Physics, Materials Science, or a related field.
  • A strong foundation in semiconductor device physics and semiconductor fabrication processes.
  • Knowledge and understanding of statistical analysis and numerical computing software such as MATLAB, Octave, or JMP.
  • Hands-on experience leveraging AI-powered tools, such as large language models, generative AI assistants, or AI code-assist platforms, to drive engineering productivity and data-driven decision-making.
  • Excellent communication and collaboration skills, with the ability to influence and drive results across diverse technical teams.

Responsibilities

  • Characterize advanced NAND memory cells and arrays to identify opportunities for performance, reliability, and scaling improvements.
  • Develop deep expertise in NAND device physics, array operation, and failure mechanisms to guide future technology development.
  • Analyze large-scale electrical test data to uncover device behaviors, qualification gaps, and screening opportunities.
  • Apply AI-assisted and agentic AI workflows to accelerate data analysis, automate characterization tasks, and generate actionable engineering insights.
  • Contribute to NAND cell architecture and process development through innovative device solutions and technical insights.
  • Collaborate closely with process integration, design, product engineering, reliability, and manufacturing teams to overcome technical challenges and drive technology breakthroughs.

Desired Qualifications

  • Experience in NAND Flash or other non-volatile memory technologies, including device physics, reliability, and characterization.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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