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Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

ARM CPU Subsystem Design Leader

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeKodaira, Tokyo, JapanNo salary listed

About the Job

Requirements

  • Hands-on experience in at least one of the following areas, including specification study, design, verification, or performance evaluation: CPU or processor cores, cache architecture, or memory-related areas.
  • Ability to organize design directions and key discussion points based on requirements and share them with stakeholders.
  • Understanding of the logic design and verification flow, and experience actively participating in technical reviews and discussions.
  • Communication skills to collaborate across teams and contribute to technical consensus building.
  • Willingness and ability to communicate in English for technical meetings and specification reviews.

Responsibilities

  • Play a key role in specification definition and architectural study of the CPU subsystem for automotive SoCs in the R-Car series.
  • Work on the CPU subsystem, including CPU cores, cache architecture such as L1/L2/L3 and cache coherency, and memory-related areas; organize design directions from a subsystem-level optimization perspective while owning a primary technical area.
  • During logic design and verification phases, identify and structure technical issues, contribute to design decisions, and help drive development forward.
  • Consider constraints such as power, performance, and reliability, and make technical judgments consistent with overall SoC requirements.
  • For integrated third-party IPs, communicate with IP vendors to confirm specifications, clarify constraints and assumptions, and support issue resolution.
  • Collaborate with design teams in India and Vietnam and with IP vendors, working in English within a global development environment.

Desired Qualifications

  • Experience taking a technical lead role at subsystem or IP level, such as leading design reviews and guiding technical discussions.
  • Experience with multi-core CPU systems and/or cache coherency mechanisms.
  • Experience in SoC integration involving CPU, cache, and memory-related components.
  • Knowledge of power domain separation and physical implementation considerations such as placement and routing.
  • Experience in automotive SoC development or design/verification with functional safety or reliability considerations.
  • Experience in technical communication and coordination with overseas sites and/or third-party IP vendors.
  • Japanese language proficiency at a conversational level.

About the Company

Renesas Electronics

Automotive-focused MCUs, SoCs, analog devices

Renesas manufactures and sells MCUs, SoCs, and analog/power semiconductor devices to OEMs, focusing on automotive, industrial, infrastructure, and IoT markets. Its chips are building blocks that run embedded software and manage power and signals, and its Winning Combinations offer pre-tested system architectures to speed up design. It differentiates itself by growing through acquisitions to offer a broad, integrated portfolio and by moving toward a unified digital design platform to reduce integration work. Its goal is to become a leading supplier of these components and provide a single platform for electronics design that speeds time-to-market.

Company size
10,001+
Company stage
IPO
Headquarters
Tokyo, Japan
Founded
2002

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