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Mini-Circuits

Designs, manufactures, and distributes RF/microwave components

Senior Manager AI & Software Engineering

Full-Time
$190k - $235k
Senior, Expert
Bachelor's, Master's
Melville, NY, USA
In Person
Engineering ManagementEngineering Leadership

About the job

Requirements
  • A Bachelor's degree in Software Engineering, Computer Science, or a related field is required.
  • Seven to ten years of progressive experience in enterprise business application design and systems development, including system integrations with ERP systems, preferably SAP.
  • Five or more years of project management responsibility, leadership skills, and a track record of managing technical staff.
  • Five or more years of leading large-scale, company-wide systems initiatives to successful execution.
  • A deep technical understanding and a successful track record in a modernization journey, beyond awareness or management alone.
  • Understanding of company business goals, objectives, business processes, and how individual actions affect business performance; applying cost-effectiveness, competitiveness, and profitability to decisions and initiatives.
  • Proven success working with multiple legacy and custom-built applications while leading company-wide transformation initiatives that reduce redundancy, create synergy across systems and enterprise applications, and make data accessible and centralized.
  • Demonstrated ability to build strong collegial relationships, build trust through active listening, encourage open exchange of ideas, read situations and dynamics accurately, and foster productive outcomes.
  • Ability to gain buy-in and commitment from leadership and staff, negotiate effectively, balance conflicting interests, and find mutually beneficial solutions.
  • Experience implementing AI initiatives as part of a comprehensive IT strategy.
  • Experience working in large, complex, dynamic organizations with multiple business groups and broad geographic reach, and ability to work in an ambiguous environment.
  • Exceptional communication skills and ability to leverage internal and external networks in a fast-paced, growing organization.
  • Ability and willingness to comply with corporate safety initiatives and the Company’s Code of Conduct.
  • Ability to meet the physical demands of the role, including regularly talking and hearing; frequently standing, walking, sitting, and using a computer keyboard; occasionally reaching and lifting or moving up to 10 pounds; and having close vision and ability to adjust focus, with reasonable accommodations available.
Responsibilities
  • Lead AI and software engineering delivery across MC-CORE, Ask MC, PIM AI, Project Everest AI enablement, Project Atlas AI and analytics support, internal digital applications, integrations, workflow automation, and future AI product pods.
  • Own the AI and software engineering delivery operating system, including backlog structure, prioritization, delivery cadence, release planning, dependency management, blocker escalation, and delivery scorecards.
  • Translate AI and digital strategy into executable engineering roadmaps, product backlogs, release plans, technical milestones, and measurable business outcomes.
  • Coordinate AI platform resources, AI product development resources, global software developers, consultants, and vendor engineering contributors in a common engineering cadence with clear ownership and deliverables.
  • Partner with the VP of AI and Digital Technologies to align engineering priorities with business strategy, operating model maturity, governance requirements, and investment decisions.
  • Partner with IT Operations to ensure production readiness, environment readiness, support handoff, identity and access alignment, operational documentation, incident processes, and service transition before AI and software releases.
  • Partner with Enterprise Data Architecture to ensure AI and software solutions use approved data sources, documented lineage, defined data quality rules, semantic definitions, and AI-ready datasets.
  • Partner with Cybersecurity and Architecture/TDA stakeholders to ensure solutions meet architecture standards, security controls, access rules, data classification requirements, and production-risk expectations.
  • Establish and maintain engineering standards for coding practices, documentation, code reviews, testing, DevOps and release controls, technical decision logs, issue escalation pathways, and exception management.
  • Ensure MC-CORE evolves as a reusable enterprise AI platform supporting secure retrieval patterns, application programming interfaces, evaluation frameworks, model gateway patterns, logging, monitoring, and reusable integration approaches.
  • Ensure Ask MC and other AI products have named business owners, subject-matter expert validators, approved data sources, release plans, adoption metrics, and support models.
  • Coordinate global AI and software engineering capacity, including internal and distributed developers, assigning work according to product and pod priorities rather than informal task routing.
  • Maintain visibility into resource capacity, skill gaps, vendor dependency, technical debt, delivery risks, support implications, and future staffing needs.
  • Partner with PMO and Vendor Governance to manage delivery health, RAID items, vendor scorecards, statement-of-work acceptance criteria, documentation deliverables, knowledge-transfer evidence, and executive reporting inputs.
  • Implement engineering quality controls to reduce rework, improve release confidence, and ensure pilots, prototypes, and production capabilities follow appropriate quality and governance expectations.
  • Support 2027 planning by providing evidence-based recommendations for additional engineering, platform, MLOps, data engineering, quality assurance, PMO, or product-pod capacity.
  • Manage the Software Engineering and AI teams in the day-to-day performance of their responsibilities.
  • Ensure projects, department milestones, and goals are met in accordance with department and business strategies.
  • Conduct performance reviews, issue disciplinary action when required, drive software engineers’ development, and hire new team members when applicable.
  • Build a culture of accountability, engineering rigor, collaboration, customer focus, continuous improvement, and measurable delivery outcomes.
  • Provide management reporting on delivery progress, release readiness, blocker aging, product adoption, engineering quality, capacity constraints, vendor risks, and value realization.
  • Perform occasional work-related travel, including some overnight travel, as required.
Desired Qualifications
  • A Master's degree is preferred.
  • Experience in the high-tech manufacturing industry.

About the company

Mini-Circuits designs, manufactures, and distributes RF, intermediate-frequency (IF), and microwave components and integrated assemblies. It serves commercial, industrial, space, and military sectors with a catalog of over 27 product lines and more than 10,000 active models, ranging from surface-mount to connectorized formats. The company operates with vertical integration, controlling design through shipment, which enables strict quality control and rapid delivery of off-the-shelf products. It also offers custom-designed solutions and has recently qualified automotive-grade components, signaling a push into high-growth markets. The goal is to be a reliable, diversified supplier by meeting exact customer requirements with ready-to-ship parts while expanding into new applications and industries.

Company Size

201-500

Company Stage

N/A

Total Funding

N/A

Headquarters

null

Founded

1969

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Simplify Jobs

Simplify's Take

What believers are saying

  • September 28, 2026 Mini-Bench expands Mini-Circuits from components into sticky test software.
  • August 2026 Bioz partnership targets quantum-computing buyers and strengthens sales enablement.
  • September 2026 GaN-on-SiC amplifiers and October 2026 EMS setup support aerospace and satcom growth.

What critics are saying

  • Qorvo, Skyworks, and Analog Devices compress margins in 2027 with integrated RF platforms.
  • Mini-Bench and new GaN MMICs must win designs before incumbents standardize competing stacks.
  • Private-company opacity hides demand, workforce, and margin stress; a bad 2027 cycle crushes scale.

What makes Mini-Circuits unique

  • Mini-Circuits ships 10,000-plus stocked RF models from vertically integrated U.S. operations.
  • Its September 2026 Mini-Bench platform unifies sensors, visualization, and analysis across operating systems.
  • Bioz Badges and a Quantum Computing Hub tie products to peer-reviewed validation.

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Benefits

Health Insurance

Dental Insurance

Vision Insurance

Disability Insurance

Life Insurance

Wellness Program

Commuter Benefits

Paid Vacation

Company News

RF Design
Oct 7th, 2026
Mini-Circuits introduces Butler matrices for repeatable 5G and Wi-Fi MIMO testing.

Mini-Circuits introduces Butler matrices for repeatable 5G and Wi-Fi MIMO testing. Mini-Circuits has released a family of high-performance Butler matrices, designed to help engineers reproduce controlled RF phase relationships and multipath propagation conditions in laboratory and production test environments. Covering key Wi-Fi and 5G FR1 frequency bands, the five models provide bidirectional signal transfer between all inputs and outputs while maintaining controlled phase relationships, amplitude balance, and insertion loss across their operating bands. The Butler matrix architecture is particularly useful for antenna beamforming development and evaluation of MIMO transmitters and receivers. By providing multiple precisely related RF signal paths, the matrices allow engineers to emulate multipath conditions that normally occur during over-the-air transmission without requiring an OTA environment. Every unit is 100% tested for highly repeatable performance. The portfolio includes two 4 x 4 models and three 8 x 8 models, all with SMA connectors: * ZBLR-4X4-0672 - 4 inputs and 4 outputs covering 600 to 7250 MHz, with 7 dB typical loss and a 45° phase increment between adjacent outputs. * ZBLR-4X4E - 4 x 4 configuration covering 2000 to 8000 MHz, with 7 dB typical loss and a 45° phase increment. * ZBLR-8X8-0650 - 8 inputs and 8 outputs covering 600 to 5000 MHz, with 12 dB typical loss and a 22.5° phase increment. * ZBLR-8X8E - 8 x 8 configuration covering 2400 to 7200 MHz, with 10 dB typical loss and a 22.5° phase increment. * ZBLR-8X8-0672 - 8 x 8 configuration covering 600 to 7250 MHz, with 10 dB typical loss and a 22.5° phase increment. Designed for Controlled Phase and Amplitude Performance A key characteristic of the Butler matrix is its defined phase progression between adjacent outputs. The 4 x 4 models provide a 45° phase offset, while the 8 x 8 models provide a 22.5° offset. These phase relationships enable controlled excitation of multiple antenna paths, making the devices suitable for beamforming and MIMO test applications. The product design uses high-performance passive components and custom phase-matched cables to maintain phase and amplitude performance across the specified frequency bands. This approach provides low amplitude unbalance and controlled loss across the operating range, with every unit subjected to 100% testing. For applications requiring programmable path loss in addition to phase-controlled signal distribution, Mini-Circuits also offers multi-channel attenuators that can be used with Butler and other n x m matrices. These attenuators support individually controlled attenuation, fading, sweep and hop sequences, with USB and Ethernet control and automation capabilities through Python, LabVIEW and other programming environments. Get in touch for orders or any queries: [email protected] / +27 21 555 8400

Engineers Garage
Oct 7th, 2026
Mini-Circuits releases Butler matrices for MIMO testing.

Mini-Circuits releases Butler matrices for MIMO testing. Mini-Circuits has released a family of 4 x 4 and 8 x 8 Butler matrices for Wi-Fi and 5G FR1 antenna beamforming and MIMO test applications. The bidirectional matrices cover frequencies from 600 MHz to 8 GHz, with 4 x 4 models providing 45-degree phase increments and 8 x 8 models providing 22.5-degree increments. SMA connectors and 100% testing support repeatable signal distribution for laboratory and production environments where engineers need to emulate multipath conditions without over-the-air testing.

RF Design
Sep 30th, 2026
Mini-Circuits introduces Mini-Bench(TM) RF measurement platform for streamlined power sensor testing.

Mini-Circuits introduces Mini-Bench(TM) RF measurement platform for streamlined power sensor testing. Mini-Circuits will introduce Mini-Bench(TM), a new RF test and measurement software platform designed to simplify instrument setup, improve workflow efficiency and provide engineers with enhanced tools for measurement visualization and analysis at the European Microwave Week 2026, October 6-8 at ExCeL London in Booth A40A. Mini-Bench provides a modern, intuitive user interface for Mini-Circuits' PWR-Series high-performance power sensors. The platform lets users control multiple USB- and Ethernet-connected instruments from a single interface while speeding up setup and configuration. Built on customer feedback and real-world application requirements, Mini-Bench streamlines common measurement tasks while maintaining access to advanced test capabilities. The software supports Windows, macOS, and Linux systems. Advanced Measurement and Analysis Tools Mini-Bench gives engineers and technicians a flexible environment to configure measurements and analyze RF signals. Customizable measurement displays allow users to organize information for specific test requirements, while graphical tools provide greater visibility into device and system performance. Measurement capabilities include graphical power trend plots, pulse and modulation profile traces, dual profile traces for high-resolution analysis, measurement averaging, offset and relative measurements, and markers with delta-marker calculations. Users can also export measurement data and graph traces and schedule recordings for longer-term testing and analysis. A simulated sensor capability enables users to evaluate the software and become familiar with its operation before connecting hardware. The Mini-Bench interface can display multiple sensor measurements simultaneously while providing detailed graphical views of pulse and modulation characteristics. Instrument status, measurement values, configuration controls, and graphical analysis are brought together in a single workspace, helping users move efficiently from setup through measurement and analysis. Designed for Mini-Circuits' PWR-Series Power Sensors Mini-Bench complements Mini-Circuits' expanding family of PWR-Series RF and microwave power sensors. The product family includes sensors covering frequencies up to 40 GHz and supports measurements from CW and single-tone signals to pulsed signals and modern digital modulation formats. Simplifying the RF Test Workflow By combining instrument control, measurement configuration, visualization and data analysis in one platform, Mini-Bench helps reduce the time engineers spend configuring test equipment and managing separate measurement workflows. Its intuitive navigation makes the platform accessible to new users while providing the measurement and analysis functionality experienced RF test engineers require. Mini-Bench software, supporting documentation and information on compatible PWR-Series power sensors are available on the Mini-Circuits website. Get in touch for orders or any queries: [email protected] / +27 21 555 8400

RF Design
Aug 27th, 2026
Mini-Circuits new model alert: 7/16 DIN Adapters.

Mini-Circuits new model alert: 7/16 DIN Adapters. DC to 6 GHz, 7/16 DIN Adapters, Low Insertion Loss & Excellent VSWR Mini-Circuits' new series of 7/16 DIN adapters support a wide range of applications from DC to 6 GHz. They provide excellent VSWR and low insertion loss over the frequency band. They feature passivated stainless steel construction with gold-plated beryllium copper center pins. These 7/16 DIN connectors are best suited for high-power, multi-transmitter RF systems in aerospace/defense, outdoor telecom, broadcast, and industrial environments where durability and reliability are critical. Key Features: * Ultra-Wideband, DC to 6 GHz * Low Insertion Loss, Down to .02 dB at 6 GHz * Excellent VSWR, Down to 1.05 at 6 GHz * DIN-DIN & DIN-N-Type Options * Straight & Right Angle Get in touch for orders or any queries: [email protected] / +27 21 555 8400

Engineers Garage
Aug 26th, 2026
Mini-Circuits launches GaN-on-SiC MMIC amplifiers up to 6 GHz.

Mini-Circuits launches GaN-on-SiC MMIC amplifiers up to 6 GHz. Mini-Circuits has announced two GaN-on-SiC HEMT MMIC power amplifiers, GNA-63-5W+ and GNA-252-5W+, for defense, communications, satellite and test systems. The GNA-63-5W+ operates from 10 MHz to 6 GHz with typical saturated output power of +38.5 dBm, 12 dB gain and 35% PAE, while the GNA-252-5W+ covers 10 MHz to 2.5 GHz with typical saturated output power of +40 dBm, 13.5 dB gain and 47% PAE. Both parts are internally matched to 50 ohms, run from a +28 V supply with 400 mA quiescent current and support -55°C to +95°C operation, which helps reduce external matching components, board space and design time.