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Micron Technology

Makes memory and storage chips for AI and PCs

Senior DRAM Systems Architecture

Hardware Systems IntegrationConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A Master's degree or equivalent experience in Electrical Engineering, Computer Engineering, Computer Science, Applied Mathematics, Physics, or a related technical field.
  • At least 8 years of experience in memory systems, semiconductor architecture, computer architecture, or related technical areas.
  • Strong knowledge of DRAM architecture, memory systems, or high-performance computing system architecture.
  • Ability to develop architecture recommendations using quantitative analysis and engineering tradeoffs.
  • Experience using AI-powered tools and methodologies, including Large Language Models, Agentic AI, Generative AI, or AI-enabled simulation environments.

Responsibilities

  • Define architectures for DDR, LPDDR, HBM, CXL-attached memory, and emerging memory technologies.
  • Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs.
  • Drive architecture requirements across DRAM, packaging, modules, controllers, platforms, and system software.
  • Lead technical studies, roadmap development, and architecture recommendations supported by quantitative analysis.
  • Influence cross-functional teams, mentor engineers, and contribute to patents, publications, and standards activities.

Desired Qualifications

  • Experience working with DDR, LPDDR, HBM, CXL memory, MRDIMM/RDIMM, or emerging memory technologies.
  • Experience with memory-system simulation or modeling tools such as Ramulator, Ramulator2, DRAMsim3, gem5, internal simulators, or equivalent platforms.
  • Experience in queueing theory, stochastic modeling, performance modeling, reliability modeling, or mathematical optimization.
  • Experience with RAS architecture, ECC, CRC, EDC, metadata, on-die ECC, rank-level protection, link protection, or system-wide robustness.
  • Background in high-speed signaling, SI, clock distribution, packaging, module, PMIC, power, or thermal systems, and experience participating in JEDEC or similar standards organizations.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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