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DensityAI

High-density AI infrastructure for data centers

Mechanical Engineer - Systems

Design EngineeringConfirmed live in the last 24 hours
Full-timeMountain View, CA, USAIn-person

About the Job

Requirements

  • At least 5 years of mechanical design experience on datacenter, server, or comparable high-power electronic systems, including demonstrated ownership of a design from concept through high-volume production.
  • Highly capable in 3D computer-aided design (CAD) modeling.
  • Proficiency designing for a broad range of low- and high-volume manufacturing techniques, including machining, stamping, forming, additive manufacturing, extrusion, casting, welding, brazing, bonding, injection molding, overmolding, and soldering.
  • Structural, transient, and multiphysics analysis skills, including finite element analysis.
  • Demonstrated ability to work closely with thermal, electrical, packaging, and manufacturing teams, and with contract manufacturing (CM) and original design manufacturing (ODM) partners, to converge and release system designs.
  • Skilled in mechanical tolerance analysis, geometric dimensioning and tolerancing (GD&T), and mechanical drawing creation.
  • Ability to define and own engineering validation test campaigns.
  • Strong design documentation and organizational discipline, including experience releasing and revising detailed engineering drawings and managing documentation in product lifecycle management (PLM) systems to ensure manufactured parts meet engineering specifications and have adequate traceability.
  • Work authorization is required at the start of employment.

Responsibilities

  • Own mechanical design of AI accelerator systems from accelerator board through tray, rack, and datacenter, including power delivery, cooling, and high-speed signal connectivity systems.
  • Own tolerance stack-ups to ensure modules, trays, and racks fit together, and perform structural and shock-and-vibration analysis to validate survival through shipping and deployment.
  • Work through design tradeoffs with thermal, electrical, and silicon packaging engineering teams from concept through datacenter deployment.
  • Design accelerator modules, including module structure, retention and load, board and coldplate integration, PCBA co-design and stress analysis, coolant and air flow co-design, and connector definition.
  • Design trays, including chassis structure, component layout, cable and connector routing, blind-mate alignment, and serviceability.
  • Partner with thermal, electrical, packaging, and manufacturing teams on design tradeoffs, and drive design for manufacturing (DFM) and design for assembly (DFA) with CM and ODM partners.
  • Own products through their lifecycle, including design, prototyping, engineering and reliability validation campaigns, New Product Introduction, High Volume Manufacturing, field failure analysis, and service.
  • Develop rack-level mechanical architecture, including structure and weight distribution, power and cooling distribution, cable management, and compliance with datacenter rack standards.
  • Integrate liquid cooling at system scale, including cold plate mounting, manifold routing, quick disconnects, and leak detection and containment.
  • Drive structural and dynamic analysis, including finite element analysis, shock and vibration, seismic, and shipping analysis, and own tolerance stack-up and GD&T across module-to-tray-to-rack interfaces.
  • Use and develop AI-assisted tool flows to accelerate mechanical design, analysis, and signoff timelines.

Desired Qualifications

  • Experience with OCP and EIA-310 rack standards, OAM / UBB or comparable accelerator module form factors, liquid cooling and manifold integration, high-current busbar and power distribution mechanical design, or seismic and shipping qualification.

About the Company

DensityAI

High-density AI infrastructure for data centers

DensityAI designs high-density, full-stack AI infrastructure for data centers, with custom chips, hardware, and software tightly integrated. Its products are aimed at automotive and robotics applications, delivering end-to-end AI workflows from perception and decision-making to control. The platform leverages hardware-software co-design to achieve higher performance, better power efficiency, and lower costs, addressing scalability and sustainability in AI computing. Unlike typical vendors, DensityAI combines a strong ex-Tesla leadership with a team of Dojo alumni and other industry veterans to offer a plug-and-play solution for OEMs and operators, simplifying the deployment of AI infrastructure. The company plans to raise substantial funding to speed development, validate deployments in its core markets, and broaden into general AI data center use and a comprehensive developer ecosystem.

Company size
51-200
Company stage
Acquired
Total funding
Not listed
Headquarters
Mountain View, CA
Founded
2024

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