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Broadcom

Designs chips and software for data centers

Lead Physical Design Engineer

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timePune, Maharashtra, IndiaNo salary listedIn-person

About the Job

Requirements

  • 15+ years of hands-on experience in physical design and backend digital flows from RTL synthesis through final GDSII stream-out.
  • High proficiency in timing and physical constraints, translating design intent into physical layout.
  • Expertise across key design stages at the SoC top level, with hands-on proficiency using EDA tools for floor-planning, partitioning, placement, clock-tree synthesis, routing, and full-chip signoff physical verification (DRC/LVS).
  • Deep technical expertise with backend EDA toolsets from Cadence, Synopsys, and Siemens, including Genus, Innovus, Quantus, Tempus, DC, Star-RCXT, PT, PrimeRail, Voltus, and RedHawk.
  • Strong programming and scripting capabilities, with high proficiency in Tcl and Perl for developing production-grade automation.
  • Ability to independently debug complex physical design and timing-closure issues.
  • Ability to collaborate with teams across geographic sites and time zones.

Responsibilities

  • Drive physical design implementation for complex SoC architectures on 5nm and advanced sub-5nm technology nodes.
  • Drive top-down and bottom-up physical design integration for complex SoC architectures on 5nm and lower nodes.
  • Adapt to internal place-and-route methodologies and identify opportunities to incorporate industry best practices into existing flows.
  • Execute the complete backend flow for blocks and top-level designs, from floorplanning, partitioning, and placement through clock-tree synthesis, routing, and extraction.
  • Own timing and functional engineering change orders, collaborating with signoff teams to achieve final closure.
  • Lead and mentor a small physical design team, driving block-level and top-level SoC implementation and keeping the team aligned.
  • Build and scale automation flows from scratch as needed, and optimize existing scripts to maximize design re-use.
  • Set execution goals, identify technical bottlenecks, and establish engineering benchmarks for the team.
  • Improve turnaround time and elevate layout and design quality.

About the Company

Broadcom

Designs chips and software for data centers

Broadcom designs chips and sells infrastructure software for the companies that run large data centers, telecom networks and corporate IT. Its custom AI processors, built with cloud companies, and its Ethernet switch chips move and process data inside the computer clusters that train AI models. The chip business also makes parts for broadband, wireless, storage and industrial equipment, sold to device makers and cloud operators, while VMware software lets businesses run private clouds and is sold by subscription. Broadcom took its current form in 2016, when Avago Technologies, formed in 2005 from Agilent's chip unit, bought Broadcom Corporation, and it is based in Palo Alto, California.

Company size
10,001+
Company stage
IPO
Headquarters
Palo Alto, CA
Founded
2005

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