Failure Analysis Engineering Technical Leader

Meet the Team

As an Advanced Packaging ASIC Failure Analysis Engineer, you will be part of the Quality and Reliability group, responsible for Electrical Failure Analysis (eFA) and Physical Failure Analysis (pFA) of advanced packaging ASIC products. This role focuses on complex failure mechanisms related to advanced semiconductor packaging technologies, silicon-package interactions, assembly processes, and field reliability performance.

The ideal candidate should possess strong expertise in semiconductor fault isolation, package failure analysis, reliability investigation, and root cause analysis. You will work closely with Design Engineering, Product/Test Engineering, Reliability Engineering, Assembly Engineering, Foundry, OSAT, and supplier teams to identify, isolate, and resolve critical product and customer issues.

This position requires strong technical leadership, hands-on FA capability, and the ability to drive cross-functional problem-solving in high-volume manufacturing environments.

Your Impact (Responsibilities)

• Conduct electrical and physical failure analysis for advanced packaging ASIC products, including reliability failures, yield excursions, customer returns, and field failures.
• Perform electrical fault isolation using ATE, Scan/ATPG, MBIST, TDR, EMMI, OBIRCH, SIL, and LSM techniques.
• Drive physical FA activities using cross section, FIB, SEM, TEM, X-ray, CSAM, decap, and material analysis methods.
• Investigate advanced packaging failure mechanisms such as bump crack, Cu pillar fracture, RDL cracking, TSV defects, substrate warpage, delamination, electromigration, solder fatigue, die crack, and thermomechanical stress-related failures.
• Develop FA strategies for intermittent and low reproducibility failures under reliability stress conditions.
• Correlate electrical signatures with physical defects to identify root causes across silicon, package, SMT, and system-level interactions.
• Drive technical reviews and root cause investigations with OSATs, foundries, substrate suppliers, and assembly partners.
• Support new package technology qualification and risk assessment activities.
• Develop and improve FA methodologies, workflows, and standard operating procedures for advanced packaging technologies.
• Document and communicate FA findings, corrective actions, and technical risk assessments to management and cross-functional teams.

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Physics, or related field required. Master’s degree preferred.
• 10+ years of experience in semiconductor eFA/pFA, with strong focus on advanced packaging ASIC products.
• Hands-on experience with electrical fault isolation techniques including ATE, Scan/ATPG, MBIST, EMMI, OBIRCH, TDR, SIL, and LSM.
• Strong experience with physical FA tools and methodologies including FIB, SEM, TEM, cross section, X-ray, and CSAM.
• Proven experience with advanced packaging reliability and package interaction failure mechanisms.
• Strong understanding of semiconductor device physics, package structure, assembly process flow, and reliability stress behavior.
• Experience developing FA strategies and driving root cause analysis to closure.

Preferred Qualifications

• Experience with 2.5D/3D packaging, flip chip, wafer-level packaging (WLP), fan-out packaging (FOWLP/FOPLP), hybrid bonding, TSV, and high-density substrate technologies.
• Knowledge of JEDEC reliability qualification standards and failure mechanisms under thermal cycling, HTOL, uHAST, drop, bend, and SMT processes.
• Experience with OSAT process integration, package process mapping, and supplier quality management.
• Familiarity with customer-return investigation, field reliability analysis, and high-volume manufacturing support.
• Experience driving technical alignment across foundry, OSAT, substrate, and internal engineering teams.

Soft Skills

• Strong technical leadership and structured problem-solving skills.
• Ability to lead cross-functional and supplier discussions for complex reliability and quality issues.
• Excellent communication and presentation skills.
• Comfortable working in both laboratory and manufacturing environments.
• Strong ownership mindset and ability to manage multiple high-priority FA cases simultaneously.
• Ability to work effectively in fast-paced, global engineering environments.

SiOps

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