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Micron Technology

Makes memory and storage chips for AI and PCs

Senior / Distinguished Member of Technical Staff - NAND Process Pathfinding, Thin Films & Materials

Process EngineeringConfirmed live in the last 24 hours
Full-timeSingaporeNo salary listedIn-person

About the Job

Requirements

  • Deep expertise in thin film deposition technologies such as chemical vapor deposition, low-pressure chemical vapor deposition, plasma-enhanced chemical vapor deposition, atomic layer deposition, plasma-enhanced atomic layer deposition, metal-organic chemical vapor deposition, and emerging processes.
  • Solid experience in materials science, surface chemistry, plasma physics, and thin film integration.
  • Demonstrated success developing novel materials and process technologies from concept through integration.
  • Proven ability to lead complex technical programs across multiple fields and organizations.
  • PhD or MS in Materials Science, Electrical Engineering, Physics, Chemistry, or a related field.
  • 15+ years of semiconductor process development, pathfinding, or advanced research and development experience.
  • Recognized technical leadership in thin films, materials development, or semiconductor technology pathfinding.
  • Experience crafting technology strategy, assessing technical risk, and influencing long-term roadmaps.
  • Proven history of innovation demonstrated by patents, publications, or notable technical contributions.
  • Experience guiding technical talent and applying artificial intelligence, modeling, or advanced data science techniques to semiconductor process development.

Responsibilities

  • Define and drive thin film and materials technology roadmaps supporting future NAND scaling, performance, reliability, and cost objectives.
  • Guide exploration and creation of advanced materials and thin film solutions, including dielectric, conductive, interface, hard mask, and charge-storage layers.
  • Evaluate emerging materials, precursor chemistries, deposition technologies, and integration schemes for future memory architectures.
  • Collaborate with Device, Integration, Reliability, Modeling, Manufacturing, and Yield teams to address key technology challenges and guide strategic decisions.
  • Lead cross-functional initiatives and external collaborations with suppliers, material vendors, universities, and research partners.
  • Develop intellectual property through patents, publications, and innovative technology creation.
  • Mentor engineers and technical leaders while encouraging a culture of innovation and technical excellence.
  • Apply artificial intelligence-enabled engineering tools, advanced analytics, and digital workflows to accelerate learning, decision-making, and research and development efficiency.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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