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Micron Technology

Makes memory and storage chips for AI and PCs

EUV Process Engineer - Photo Dram

Process EngineeringConfirmed live in the last 24 hours
Full-timeBoise, ID, USANo salary listedIn-person

About the Job

Requirements

  • A Bachelor's degree in Electrical Engineering, Material Science, Physics, Chemical Engineering, or a related field, plus more than five years of post-degree experience in semiconductor lithography process engineering; or an MS or PhD in those fields or a related field, plus more than three years of post-graduate-degree experience in semiconductor lithography process engineering.
  • Ability to independently solve complex process problems using structured, data-driven approaches.
  • Strong communication and project management skills, and the ability to work effectively across disciplines and organizations.
  • Experience using artificial intelligence tools to automate workflows and improve engineering productivity.

Responsibilities

  • Lead and drive EUV lithography process development and sustainment for advanced technology nodes in a manufacturing environment.
  • Innovate new design, layout, and photolithography techniques to open a solution space for building future generations of memory devices; review literature to identify potential intellectual property opportunities and file disclosures.
  • Lead root-cause analysis and resolution of critical dimension uniformity, overlay, stochastic, and defectivity issues impacting yield and line performance.
  • Develop and optimize process windows, scanner jobs, and associated metrology strategies to meet performance and manufacturability targets.
  • Partner with equipment, metrology, materials, etch, and integration teams to deliver stable, high-yield EUV processes.
  • Collaborate with external partners and suppliers, including scanner, mask, resist, and ecosystem vendors, to evaluate and qualify new technologies to overcome process challenges.
  • Use data-driven methods to analyze large datasets and translate results into actionable process improvements.
  • Document and communicate complex technical results to engineering peers, leadership, and stakeholders.

Desired Qualifications

  • Deep knowledge of and experience with EUV lithography, critical dimension uniformity and overlay modeling, stochastic optimization, or defect mitigation strategies.
  • Data science, programming, or machine learning experience applied to semiconductor process development.
  • Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, and yield improvement initiatives.
  • Experience collaborating with external research institutes or equipment and materials suppliers.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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