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Micron Technology

Makes memory and storage chips for AI and PCs

Pde Pie – Package Integration Engineering - Engineer

Manufacturing EngineeringConfirmed live in the last 24 hours
Full-timeGeorge Town, Penang, MalaysiaNo salary listedIn-person

About the Job

Requirements

  • A bachelor's degree in Mechanical, Material, Chemical, or Electrical Engineering.
  • Passion for backend engineering process or package development.
  • Eagerness to learn technical knowledge in component test and/or module manufacturing process.
  • Understanding of semiconductor package structures and package reliability concepts.
  • Data analysis, statistical analysis, and data interpretation skills; proficiency in JMP analysis is required.
  • Ability to learn and make sound data-driven decisions, prioritize, and apply due diligence in day-to-day tasks.
  • Ability to use AI-assisted tools such as Copilot as a productivity multiplier, for example for faster root-cause screening, smarter design of experiments, and automated reporting.

Responsibilities

  • Lead and manage new product introduction activities as a Product Owner, working with cross-functional teams to accomplish organizational and business objectives.
  • Drive the new product introduction process through NPI Phase Gate Review.
  • Coordinate new product start-up and achieve first-pass qualification.
  • Understand new product start-up deadlines, product applications, and customer requirements, and communicate this information to the new product start-up team.
  • Work with process, equipment, manufacturing, and planning area owners to bring new products and packages into volume production.
  • Provide timely support for first silicon, engineering samples, and qualification samples, and meet expectations for engineering hot-lot cycle time according to the product development schedule.
  • Monitor product yield trends, QDR, and reliability to ensure assembly operations are in control, and initiate early attention when necessary.
  • Own the entire product life cycle, from new product introduction through end of life.
  • Understand new product challenges and collaborate with process, equipment, and development owners to develop new technology capabilities ahead of the market.
  • Act as a point of contact to TPM on product-related matters.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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