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Micron Technology

Makes memory and storage chips for AI and PCs

Staff / Senior Mechanical Design & Thermal Engineer

Design EngineeringPosted on Nov 11
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • A Bachelor's or Master's degree in Mechanical Engineering, Product Design, Thermal Engineering, or a related discipline.
  • Relevant experience in mechanical or product engineering for SSD, semiconductor, electronics, computing, or embedded hardware products.
  • Hands-on proficiency with AutoCAD, SolidWorks, or equivalent 2D/3D CAD tools.
  • Experience with PCB DXF generation and review, 3D modeling, mechanical drawings, tolerance analysis, and product-level mechanical integration.
  • Experience with mechanical simulation workflows, stress and structural analysis, shock and vibration, and PCB warpage assessment.
  • Experience designing and developing mechanical and thermal test fixtures.
  • Understanding of DFM/DFA, PCB assembly, component and package mechanical constraints, and product reliability considerations.
  • Demonstrated ability to perform mechanical failure analysis, root-cause analysis, and design optimization.
  • Strong problem-solving, ownership, communication, and cross-functional collaboration skills.
  • Demonstrated innovation mindset and adaptability to AI-enabled engineering tools and workflows.
  • Ability to collaborate effectively across multidisciplinary and geographically distributed engineering teams.

Responsibilities

  • Own mechanical design and development of SSD and embedded hardware products across multiple PCB and package form factors.
  • Generate and review PCB DXF files, board outlines, mechanical keep-outs, mounting locations, component clearances, labels, and dimensional constraints.
  • Create and review 2D drawings, 3D CAD models, assemblies, and product visualizations using tools such as AutoCAD and SolidWorks.
  • Perform product-level mechanical assessments covering PCBs, components, packages, connectors, enclosures, mounting features, thermal solutions, and assembly constraints.
  • Perform mechanical stack-up, tolerance, clearance, fit, interference, and component-height analysis.
  • Understand and execute mechanical simulation workflows, including model preparation, material properties, boundary conditions, simulation execution, results interpretation, and design optimization.
  • Support mechanical stress, shock, vibration, structural integrity, and PCB warpage assessments using appropriate simulation and measurement tools.
  • Assess the impact of component packaging, PCB deformation, and mechanical stress on product reliability.
  • Design, assess, develop, and characterize mechanical and thermal fixtures for product validation, characterization, debug, and reliability testing.
  • Support thermal engineering activities, including thermal fixture development, temperature-control solutions, and liquid-cooling approaches where applicable.
  • Perform dimensional, Z-height, flatness, deformation, and warpage measurements and support mechanical failure analysis and root-cause investigation.
  • Conduct DFM/DFA reviews and work closely with PCB layout, electrical hardware, thermal, validation, reliability, quality, manufacturing, and supplier teams.
  • Translate product and customer mechanical requirements into actionable engineering specifications and design constraints.
  • Identify opportunities to leverage AI, automation, and emerging engineering tools to improve CAD, simulation, analysis, documentation, and engineering productivity.
  • Drive innovation and continuous improvement through new design methodologies, fixture concepts, automation, and reusable engineering practices.

Desired Qualifications

  • Experience with SSD/storage or high-density electronic hardware.
  • Knowledge of PCB and semiconductor-package mechanical considerations.
  • Exposure to thermal characterization, temperature-control equipment, liquid cooling, warpage/metrology tools, and reliability testing.
  • Experience supporting products from concept/design through qualification and manufacturing release.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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