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Micron Technology

Makes memory and storage chips for AI and PCs

Staff Engineer - ASIC Analog Design

Silicon & ASIC DesignConfirmed live in the last 24 hours
Full-timeBengaluru, Karnataka, IndiaNo salary listedIn-person

About the Job

Requirements

  • Strong analog and mixed-signal CMOS circuit design experience in deep sub-micron technologies from 2nm to 28nm.
  • Experience with high-speed memory interfaces such as DDR3/4/5, LPDDR5/6, and GDDR5/6/7, or SerDes interfaces such as PCIe, MIPI, HDMI, USB, and SATA.
  • Full ownership experience of at least one critical PHY sub-block, such as a PLL, DLL, CDR, high-speed receiver with equalization, transmitter front-end, or high-speed data path.
  • Deep understanding of analog and mixed-signal design concepts with high-speed link experience.
  • Mandatory experience in SerDes and/or parallel interfaces.
  • Mandatory experience with TX/RX equalization techniques, including FFE, CTLE, and DFE.
  • Experience with CDR and clocking architectures.
  • Hands-on experience in FinFET technologies at 10nm and below.
  • Ability to develop block-level specifications based on link budgets.
  • Experience in system-level modeling using Verilog-A and/or Python.
  • Experience working with packaging and board teams.
  • Knowledge of ESD design considerations.
  • Experience in lab testing and collaborating with validation teams for data analysis.
  • Experience designing high-speed I/O cells such as DDR, LVDS, HSTL, and CML.
  • Experience with power delivery circuits, including bandgap, LDO, and bias circuits.
  • Strong understanding of AMS design, advanced CMOS, and FinFET technologies.
  • Knowledge of mismatch analysis, Monte Carlo simulations, transistor-level noise analysis, and deep sub-micron device physics.
  • Experience supervising complex analog layouts and defining IP floorplans.
  • Hands-on experience with industry-standard tools such as Cadence ADE, Spectre, AMS Verification, EM/IR flows, MATLAB, and Calibre.
  • Working knowledge of mixed-mode simulation, signal integrity, and ESD analysis.
  • M.S./M.Tech or B.S./B.E. in Electronics.
  • At least 5 years of experience.

Responsibilities

  • Be part of a high-speed PHY design team working on advanced technology nodes of 12nm and below.
  • Own analog sub-blocks within the PHY and drive specification, design, simulation, reliability, and mixed-mode verification.
  • Use AI-enabled tools to improve productivity and decision-making.
  • Drive layout implementation through mask designers while ensuring compliance with process rules and DFM requirements.
  • Participate in design reviews with internal teams and customers, explaining design choices and robustness.
  • Collaborate with cross-functional teams across multiple global locations.
  • Create IP EDA views, including behavioral models, Verilog-A, timing views, and abstracts.
  • Participate in silicon bring-up and characterization, and correlate silicon results with models and simulations.
  • Mentor and guide junior engineers.

About the Company

Micron Technology

Makes memory and storage chips for AI and PCs

Micron Technology designs and manufactures memory and storage chips, mainly DRAM and NAND flash, used in data centers, PCs, phones, cars and industrial equipment. It is one of only three companies that make HBM, the stacked high-bandwidth memory placed beside processors in AI servers, and it is the largest memory chipmaker based in the United States. Unlike chip designers that outsource production, Micron runs its own fabs and assembly sites in the United States and across Asia. It earns money by selling chips, memory modules and solid-state drives to cloud providers, device makers and distributors. Micron was founded in 1978 and is headquartered in Boise, Idaho.

Company size
10,001+
Company stage
IPO
Headquarters
Boise, ID
Founded
1978

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