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Neros Technologies

Mass-manufactures attritable UAS with integrated avionics

AI-Native Electrical Engineer - PCB Design

Board & Electronics DesignUpdated on Nov 13
Full-timeTorrance, CA, USA

About the Job

Requirements

  • At least 4 years of dedicated printed circuit board layout and design experience on hardware that reached production.
  • Expert proficiency with Altium Designer, including workspace and library management; recent version experience is preferred.
  • Demonstrated personal ownership of a company or corporate CAD library, including creating and maintaining footprints and symbols, deriving land patterns, and enforcing naming and revision standards across a design team.
  • Experience designing boards and drawing packages to IPC standards, including IPC-2221 and IPC-2222 for design, IPC-6012 Class 2 and Class 3 for board qualification, IPC-A-610 and J-STD-001 for assembly acceptability, and IPC-7351 for land patterns.
  • Flex and rigid-flex design experience, including bend area construction, stiffeners, and coverlay, designed per IPC-2223 and qualified to IPC-6013.
  • RF and high-speed digital layout expertise, including transmission line theory and topology selection (microstrip, stripline, and coplanar waveguide), controlled impedance, differential pairs, length and skew matching, reference plane and return path integrity, and via strategy.
  • Experience defining layer stackups and closing impedance calculations directly with fabrication vendors.
  • Fluency producing and releasing complete manufacturing output packages, with a track record of first-pass fabrication and assembly success.
  • A degree in electronics or electrical engineering, or equivalent depth of hands-on layout experience in place of a degree.
  • Ability to work onsite at the Torrance headquarters and eligibility to work with export-controlled technical data as a U.S. person.

Responsibilities

  • Own PCB layout on assigned designs from released schematic through fabrication release, including board outline, layer stackup definition, component placement, routing, and design rule closure.
  • Read and interpret schematics from design engineers and apply layout practices appropriate to each design.
  • Own the Altium library, including footprints, schematic symbols, land patterns, 3D component bodies, design rule and board templates, output jobs, naming conventions, and revision control.
  • Implement high-speed digital, RF, precision analog, and power sections on the same board, applying controlled impedance, differential pair and length matching, and disciplined return path design.
  • Design flexible and rigid-flex circuits, including bend area construction, stiffeners, coverlay, and ZIF terminations.
  • Produce complete fabrication and assembly documentation to IPC Class 2 and Class 3, including fabrication and assembly drawings, Gerber X2 or ODB++, NC drill, netlists, paste and assembly data, and BOM outputs.
  • Work directly with fabrication and assembly vendors on stackup and impedance confirmation, DFM and DFA feedback, and resolution of manufacturing issues.
  • Establish and maintain the department's PCB design standards, review layouts produced by others, and coordinate external layout resources during design surges.

Desired Qualifications

  • Recent version experience with Altium Designer.
  • Experience administering Altium 365 or Concord Pro workspaces, managed components, and revision control of ECAD data.
  • IPC CID or CID+ certification.
  • ECAD-to-MCAD co-design with SOLIDWORKS or Creo, including STEP model exchange and enclosure fit checks before prototype.
  • Exposure to signal and power integrity analysis, such as HyperLynx, Ansys SIwave, or field-solver-based stackup and impedance tools.
  • Experience with HDI construction, sequential lamination, microvias, via-in-pad, back-drilling, high layer count (greater than 16), and thicker board stackups.
  • Experience with UAV, avionics, defense, medical, or other high-reliability applications where vibration, thermal extremes, and field reliability drive layout decisions.
  • Scripting or automation of repetitive CAD and library tasks.

About the Company

Neros Technologies

Mass-manufactures attritable UAS with integrated avionics

Neros Technologies designs and mass-produces unmanned aerial systems (UAS) for the U.S. and allies. Its products include attritable FPV drones, loitering munitions, and defense-focused systems such as Archer AI (FPV with terminal guidance and GPS-denied position hold) and Bandit (a counter-UAS interceptor for larger threats). The company vertically integrates critical hardware and software, building flight computers, motor drivers, propulsion, and proprietary radios to resist electronic warfare, and it coordinates multiple drones for coordinated effects. Neros has demonstrated systems in active conflict zones (e.g., Ukraine) and aims to reach about one million drones produced annually from domestic manufacturing. In August 2026 it raised a $250 million Series C to accelerate Archer AI, Bandit, and multi-drone programs, underscoring its goal to scale production and support allied operations.

Company size
51-200
Company stage
Debt Financing
Total funding
$820.9M
Headquarters
Los Angeles, CA
Founded
2023

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