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Black Semiconductor

Graphene photonics enable optical chip interconnects

Senior Treasury Specialist

TreasuryConfirmed live in the last 24 hours
Full-timeAachen, Germany

About the Job

Requirements

  • Substantial experience in treasury, particularly cash forecasting and liquidity management.
  • A hands-on approach and structured, pragmatic working style, with the ability to build processes independently in a growing environment.
  • Experience working in international structures or across multiple entities, and the ability to develop shared standards.
  • Interest in automation, digital systems, and scalable process improvements.
  • Business-fluent German and English.

Responsibilities

  • Develop cash forecasts and provide visibility into liquidity, payment flows, and financing needs across international entities.
  • Develop reliable treasury processes, responsibilities, and standards, and support the development of globally aligned treasury management across countries and entities.
  • Identify opportunities to automate forecasting, reporting, and recurring treasury processes, and implement scalable, system-supported solutions.
  • Actively contribute to the further development of SAP S/4HANA Cloud and make full use of its capabilities.
  • Support financing activities, including those involving convertible loans; prepare analyses and decision-support materials for internal stakeholders.
  • Work closely with the Senior Manager Finance & Accounting and the headquarters Finance team, coordinate treasury matters with relevant internal and external stakeholders, and independently drive improvements.

About the Company

Black Semiconductor

Graphene photonics enable optical chip interconnects

Black Semiconductor develops graphene-based photonics that integrate optical components into the outer layers of CMOS-like chips, enabling direct optical chip-to-chip communication. It works by using graphene as a translator to convert electronic signals to optical signals and back, so electrons on silicon can talk to photons through integrated photonic interconnects. This approach differs from traditional silicon photonics or pure electronic interconnects by being CMOS-compatible, wafer-scale, and capable of linking multiple chips as a single high-performance unit while reducing production steps by about 60%. The company aims to move from pilot production to mass manufacturing, building a 300mm wafer facility (FabONE) in Aachen, with pilot production by 2027 and mass production by 2031, backed by a large European funding round and investors.

Company size
51-200
Company stage
Series A
Total funding
$287.4M
Headquarters
Aachen, Germany
Founded
2020

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