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ASM International

Semiconductor deposition equipment and ALD tech

Senior Process Engineer - Plasma

Design EngineeringConfirmed live in the last 24 hours
Full-timePhoenix, AZ, USANo salary listedIn-person

About the Job

Requirements

  • A PhD in Physics, Engineering (Chemical, Electrical, Mechanical, or related fields), Material Science, or a Master's degree with at least three years of professional experience.
  • In-depth knowledge of low-pressure radio-frequency plasma systems, including inductively coupled plasma, capacitively coupled plasma, and microwave plasma sources.
  • Strong understanding of plasma-surface interactions and precursor/plasma chemistry.
  • Familiarity with plasma-enhanced chemical vapor deposition, plasma-enhanced atomic layer deposition, and reactive ion etching process mechanisms.
  • Strong communication skills for technical documentation, cross-functional collaboration, and customer-facing discussions.

Responsibilities

  • Conduct research and development of components and mechanisms, including concept creation, feasibility studies, and practical evaluation and testing.
  • Perform hardware characterization, define process windows, and analyze process-hardware interactions.
  • Design experiments, collect data, analyze results, and compile reports on process development experiments.
  • Develop new equipment and functionalities, and improve existing equipment, from specification through detailed design.
  • Work across process development, hardware development, and metrology disciplines.

Desired Qualifications

  • Familiarity with epitaxial silicon growth and characterization.
  • Familiarity with electromagnetic and multiphysics simulation tools, such as COMSOL, Ansys HFSS, or CST Studio.
  • Familiarity with plasma diagnostics, such as Langmuir probes, optical emission spectroscopy, and VI probes.
  • Familiarity with thin-film and chemical characterization and metrology techniques, including scanning electron microscopy, transmission electron microscopy, X-ray diffraction, ellipsometry, X-ray photoelectron spectroscopy, Auger electron spectroscopy, inductively coupled plasma mass spectrometry, particle analysis, and sheet-resistance probe analysis.

About the Company

ASM International

Semiconductor deposition equipment and ALD tech

ASM International designs and supplies equipment and technologies for semiconductor fabrication, focusing on thin-film deposition processes such as chemical vapor deposition (CVD) and atomic layer deposition (ALD). Its products are used in making microchips by depositing ultra-thin material layers with precise control at the atomic level, enabling smaller and more powerful devices. The company built a global footprint through operations in the Netherlands, the US, Hong Kong, and Japan, and separated ASML Lithography (a joint venture with Philips) to focus on deposition while ASML develops photolithography systems. In recent years, ASM has sharpened its strategy around ALD, a process that creates uniformly thin layers one atomic layer at a time, allowing continued scaling of semiconductor devices. The goal is to be a core supplier of deposition technology and tools that enable chip manufacturers to produce smaller, faster, and more energy-efficient semiconductors.

Company size
1,001-5,000
Company stage
IPO
Headquarters
Almere, Netherlands
Founded
1968

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