HBM Architect - Memory Design

Job Title: HBM Architect - Memory Design
Office Location: San Jose, CA
Job Type: Full-Time
Work Model: Onsite       

Responsibilities:

• Design circuits for DRAM and HBM products that meet internal and external specifications.
• Improve design quality and yield during the DRAM or HBM product development phase.
• Perform characteristic analysis and verify product specifications at the Wafer, KGSD (Known Good Stack Die), and Assembly stages.
• Enhance performance and ensure stable operation to meet customer requirements during the product development stage.

Required Qualifications:   

• Bachelor’s degree or higher in Electrical Engineering or a related discipline(Master’s preferred).
• 3+ years of relevant industry experience (Research periods during Master’s or Ph.D. programs recognized).
• Experience in reviewing and designing DRAM or HBM Architecture with a solid understanding of DRAM/HBM subsystems.
• Experience in Full Custom + Digital Co-Design and PDN (Power Delivery Network) analysis.
• Experience in Full Custom-based Logic Foundry design.
• Experience with various tools and equipment for DRAM or HBM product failure analysis.

Preferred Qualifications:   

• Extensive experience in product development and analysis related to DRAM or HBM design.
• Experience in HBM product assembly system analysis.
• Experience in Full Custom Design environments with advanced process nodes (DRAM 1x nm, Foundry 3nm or below).
• Proficiency in using Python, Spotfire, Verilog, and Circuit Simulators (Hspice, Csim, PrimeSim, Spectre, etc.).

Benefits:       

• Top Tier health insurance at no employee cost
• Paid day offs: Paid Time Off, Company Holidays, Parental Leave, Happy Fridays
• 401k Matching
• Flexible Spending Account (FSA) for Health Care & Dependent Care
• Educational reimbursement up to $10,000 per year
• Donation Matching and volunteering opportunities
• Corporate discount programs
• Free Breakfast/Lunch/Dinner provided to employees

Pay Range 140000 - 310000 USD