HBM Architect
About the job
- A bachelor's degree or higher in Electrical Engineering or a related discipline is required; a master's degree is preferred.
- At least 3 years of relevant industry experience is required; research periods during master's or Ph.D. programs are recognized.
- Experience reviewing and designing DRAM or HBM architecture, with a solid understanding of DRAM/HBM subsystems, is required.
- Experience in Full Custom and Digital Co-Design and Power Delivery Network analysis is required.
- Experience in Full Custom-based Logic Foundry design is required.
- Experience using various tools and equipment for DRAM or HBM product failure analysis is required.
- Design circuits for DRAM and HBM products that meet internal and external specifications.
- Improve design quality and yield during the DRAM or HBM product development phase.
- Perform characteristic analysis and verify product specifications at the Wafer, Known Good Stack Die, and Assembly stages.
- Enhance performance and ensure stable operation to meet customer requirements during the product development stage.
- Extensive experience in product development and analysis related to DRAM or HBM design.
- Experience in HBM product assembly system analysis.
- Experience in Full Custom Design environments with advanced process nodes, including DRAM 1x nm or Foundry 3nm or below.
- Proficiency in Python, Spotfire, Verilog, and circuit simulators such as Hspice, Csim, PrimeSim, or Spectre.
About the company
Summary of SK hynix: 1) What does the company do? It is a global producer of semiconductor memory, specializing in DRAM and NAND Flash that power IT devices like computers, phones, and servers. 2) How do its products work? DRAM stores data using tiny capacitors and requires periodic refreshing to keep data, providing fast volatile memory. NAND Flash stores data in non-volatile memory cells and preserves data without power, serving as durable storage. Both chips are mounted in devices to enable fast processing and data retention. 3) How is the company different from competitors? It ranks as the second-largest memory chip maker with a broad product portfolio and strong technology, backed by the SK Group, giving it scale, resources, and global reach. 4) What is the company's goal? To become the world’s best semiconductor company by meeting diverse customer needs and leading in memory technology.
Company Size
5,001-10,000
Company Stage
IPO
Headquarters
Seoul, South Korea
Founded
1983
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Simplify's Take
What believers are saying
- 2Q26 revenue reached 79.3 trillion won, up 257%, with 76% operating margin.
- SK hynix won TSMC's 2026 Partner of the Year again, reinforcing ecosystem leadership.
- OpenAI, Nvidia, and Microsoft deals locked HBM demand through 2030, sustaining utilization.
What critics are saying
- Samsung raised HBM share to 33% by 2Q26, attacking SK hynix's lead aggressively.
- Indiana packaging starts October 2028, leaving U.S. customers dependent on Korea through 2029.
- Nvidia allocation drives HBM pricing and share, making SK hynix vulnerable to customer concentration.
What makes SK hynix unique
- SK hynix shipped HBM4 in 2Q26 and supplies Nvidia's Vera Rubin platform.
- TSMC awarded SK hynix Partner of the Year for HBM5-CoWoS collaboration in September 2026.
- Indiana's $4 billion HBM packaging fab creates first U.S. back-end base by 2029.
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Benefits
- Health Insurance
- Paid Vacation
- Paid Holidays
- Paid Parental Leave
- 401(k) Company Match
- Educational reimbursement
- Donation Matching and volunteering opportunities
- Corporate discount programs
- Health Insurance
- Paid day offs: PTO + Company Holidays + Happy Fridays